212656 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of package parts other than the semiconductor or other solid state devices to be connected; Cap; Shape; Cap comprising a cavity for hosting the device, e.g. U-shaped cap Cavity coating
Sub-classes:Chip on film package and heat-dissipation structure for a chip package
#2Workpiece with semiconductor chips, semiconductor device and method for producing a workpiece with semiconductor chips
#3Workpiece with semiconductor chips, semiconductor device and method for producing a workpiece with semiconductor chips
#4Semiconductor package
#5Semiconductor package
#6Microwave integrated circuit package and method for forming such package
#7CONNECTING PAD PRODUCING METHOD
#8Method of Producing Covers for Electronics
#9Hermetic sealing cap, electronic component accommodation package, and method for producing hermetic sealing cap
#10Embedded die system and method
#11ELECTRONIC APPARATUS AND SUBSTRATE MOUNTING METHOD
#12Electrical device and method
#13Microwave communication package
#14Manufacturing Method for Producing Wick Structures of a Vapor Chamber by Using a Powder Thermal Spray Gun
#15Microwave integrated circuit package and method for forming such package
#16Structure for electrostatic discharge in embedded wafer level packages
#17Modular board device, high frequency module, and method of manufacturing the same
#18Capillary underflow integral heat spreader
#19Electronic component package
#20Circuit module
#21Packaged electronic element and method of producing electronic element package
#22Cavity ball grid array apparatus having improved inductance characteristics
#23Shielding structure
#24Ground arch for wirebond ball grid arrays
#25VSAT block up converter (BUC) chip
#26Method of fabricating a semiconductor die package having improved inductance characteristics
#27Modular board device, high frequency module, and method of manufacturing same
#28Solid state imaging device having electromagnetic wave absorber attached to a mounting board
#29Integrated circuit housing
#30Electronic component and method for manufacturing the same
#31Hermetic sealing cap and method of manufacturing the same