H01L2924/162 - CPC Classification

Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of package parts other than the semiconductor or other solid state devices to be connected; Cap Disposition

• H01L2924/16235 » Connecting to a semiconductor or solid-state bodies i.e. cap-to-chip 487
• H01L2924/16251 » Connecting to an item not being a semiconductor or solid-state body, e.g. cap-to-substrate 456
• H01L2924/1626 » Cap-in-cap assemblies 3
• H01L2924/1627 » stacked type assemblies e.g. stacked multi-cavities 100

Recent Application in this class: