212665 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of package parts other than the semiconductor or other solid state devices to be connected; Cap; Disposition stacked type assemblies, e.g. stacked multi-cavities
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
#2Power Envelope Analysis for the Thermal Optimization of Multi-Chip Modules
#3ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
#4Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices
#5Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices
#6High-frequency module
#7Electronic device
#8Package structure
#9Shielded stacked integrated circuit packaging system and method of manufacture thereof
#10Multiple chip module and package stacking method for storage devices
#11Manufacturing process for embedded semiconductor device
#12Integrated circuit package including a thermally and electrically conductive package lid
#13Apparatus for packaging semiconductor devices, packaged semiconductor components, methods of manufacturing apparatus for packaging semiconductor devices, and methods of manufacturing semiconductor components
#14System and method for stacked die embedded chip build-up
#15ELECTRONIC PACKAGE AND METHOD OF ASSEMBLING THE SAME
#16Apparatus for shielding integrated circuit devices
#17Semiconductor devices including semiconductor dice in laterally offset stacked arrangement
#18Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices
#19Semiconductor device assemblies, electronic devices including the same and assembly methods
#20STEREOSCOPIC ELECTRONIC CIRCUIT DEVICE, AND RELAY BOARD AND RELAY FRAME USED THEREIN
#21Hermetic sealing cap, electronic component accommodation package, and method for producing hermetic sealing cap
#22Semiconductor device and method of fabrication thereof
#23Module
#24Process for producing multilayer printed wiring board
#25Electrical module
#26Infinitely stackable interconnect device and method
#27Multilayer substrate manufacturing method
#28Shielded stacked integrated circuit packaging system and method of manufacture thereof
#29SCALABLE SUBSYSTEM ARCHITECTURE HAVING INTEGRATED COOLING CHANNELS
#30Manufacturing process and structure for embedded semiconductor device
#31Stack combination of plural chip package units
#32HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS OF USE THEREOF
#33Electrical device and method
#34METHOD OF MANUFACTURING A COMBINED MULTILAYER CIRCUIT BOARD HAVING EMBEDDED CHIPS
#35Stackable microelectronic device carriers, stacked device carriers and methods of making the same
#36Semiconductor device, substrate, equipment board, method for producing semiconductor device, and semiconductor chip for communication
#37Semiconductor device, substrate, equipment board, method for producing semiconductor device, and semiconductor chip for communication
#38Apparatus for shielding integrated circuit devices
#39Sensor component and method for producing a sensor component
#40Device having a bonding structure for two elements
#41Apparatus for packaging semiconductor devices, packaged semiconductor components, methods of manufacturing apparatus for packaging semiconductor devices, and methods of manufacturing semiconductor components
#42Probe structure having a plurality of discrete insulated probe tips projecting from a support surface, apparatus for use thereof and methods of fabrication thereof
#43METHODS AND APPARATUS FOR MULTICHIP MODULE PACKAGING
#44Semiconductor device, substrate, equipment board, method for producing semiconductor device, and semiconductor chip for communication
#45Method of fabricating a shielded stacked integrated circuit package system
#46Interconnecting board and three-dimensional wiring structure using it
#47HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS OF USE THEREOF
#48HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS OF USE THEREOF
#49Laminated bond of multilayer circuit board having embedded chips
#50Cooled Integrated Circuit
#51Method of manufacturing a combined multilayer circuit board having embedded chips
#52Stackable ceramic FBGA for high thermal applications
#53Multi-chip structure
#54DEVICE AND METHOD FOR TESTING SEMICONDUCTOR PACKAGES
#55High density integrated circuit apparatus, test probe and methods of use thereof
#56Method and apparatus for forming stacked die and substrate structures for increased packing density
#57Plurality of devices attached by solder bumps
#58Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices
#59Stacked module and manufacturing method thereof
#60Multiple chip module and package stacking for storage devices
#61Method of forming a semiconductor device
#62Multi-level semiconductor module
#63Tier structure with tier frame having a feedthrough structure
#64Methods of bonding two semiconductor devices
#65Scalable subsystem architecture having integrated cooling channels
#66Electro-optic interconnection apparatus and method
#67Copper substrate with feedthroughs and interconnection circuits
#68Method of wafer-level packaging using low-aspect ratio through-wafer holes
#69Method and stacked memory structure for implementing enhanced cooling of memory devices
#70Stackable tier structure comprising prefabricated high density feedthrough
#71Multilayer module and method of manufacturing the same
#72Multilayer substrate and the manufacturing method thereof
#73Method and apparatus for forming stacked die and substrate structures for increased packing density
#74Multilevel semiconductor module and method for fabricating the same
#75Chip-scale package for integrated circuits
#76Wafer-level package for integrated circuits
#77Semiconductor integrated circuit and semiconductor device
#78Multilayer printed wiring board and process for producing the same
#79Multi-level semiconductor module and method for fabricating the same
#80Multi-level semiconductor module
#81Circuit boards, electronic devices, and methods of manufacturing thereof
#82Multi-level semiconductor module and method for fabricating the same
#83Stackable frames for packaging microelectronic devices
#84Method and apparatus for fabricating a circuit board with a three dimensional surface mounted array of semiconductor chips
#85Semiconductor module with conductive element between chip packages
#86Semiconductor device and method for producing the same
#87Semiconductor chip mounting wiring board, manufacturing method for same, and semiconductor module
#88Heat dissipation for chip-on-chip IC packages
#89Semiconductor device, substrate, equipment board, method for producing semiconductor device, and semiconductor chip for communication
#903D circuit module, multilayer 3D circuit module formed thereof, mobile terminal device using the circuit modules and method for manufacturing the circuit modules
#91Methods of bonding two semiconductor devices
#92Multilayer wiring board, manufacturing method therefor and test apparatus thereof
#93Die package with higher useable die contact pad area
#94Stereoscopic electronic circuit device, and relay board and relay frame used therein
#95Stackable ceramic FBGA for high thermal applications
#96Multiple cavity/compartment package
#97Stacked mass storage flash memory package
#98Hybrid integrated circuit
#99Method for shielding integrated circuit devices
#100Semiconductor device and method of manufacturing the same, cirucit board, and electronic instrument
#101Stacked-type semiconductor device