212668 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of package parts other than the semiconductor or other solid state devices to be connected; Cap; Connection portion, e.g. seal Shape
Semiconductor Device and Method of Forming Thin Heat Sink Using E-Bar Substrate
#2ELECTRONIC ELEMENT MOUNTING SUBSTRATE, ELECTRONIC DEVICE, ELECTRONIC MODULE, AND METHOD FOR MANUFACTURING ELECTRONIC ELEMENT MOUNTING SUBSTRATE
#3STIFFENER ASSEMBLY AND METHOD FOR MAKING A SEMICONDUCTOR ASSEMBLY
#4BONDING STRUCTURE AND METHOD THEREOF
#5ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
#6Integrated Circuit Packages and Methods of Forming the Same
#7ELECTRONIC DEVICE PACKAGE INCLUDING A GEL
#8Semiconductor Device and Method of Forming Thin Heat Sink Using E-Bar Substrate
#9SEMICONDUCTOR MODULE
#10Bonding structure and method thereof
#11MICROELECTRONIC ASSEMBLIES INCLUDING STIFFENERS AROUND INDIVIDUAL DIES
#12PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
#13ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
#14HIGH-FREQUENCEY PACKAGE, HIGH-FREQUENCY MODULE, AND RADIO WAVE ABSORPTION METHOD
#15SEMICONDUCTOR PACKAGE HAVING PACKAGE HOUSING IN ENGRAVED SURFACE FORM AND METHOD OF MANUFACTURING THE SAME
#16Semiconductor device and manufacturing method thereof
#17Method for fabricating an electronic device comprising forming an infused adhesive and a periperal ring
#18Stacked silicon package assembly having thermal management
#19Sensor element
#20Semiconductor device
#21Semiconductor packaging structure and process
#22Method for fabricating an electronic device and a stacked electronic device
#23Solid-state image pickup device and electronic apparatus to increase yield
#24Electronic component storage substrate and housing package
#25Cavity package with composite substrate
#26Semiconductor packaging structure and process
#27Light emitting device
#28Microelectronic assemblies with cavities, and methods of fabrication
#29Cavity package with composite substrate
#30Semiconductor device and manufacturing method of semiconductor device
#31Electronic device
#32Semiconductor packaging structure and process
#33Wafer level package and a method of forming a wafer level package
#34Power module and method for manufacturing the same
#35Piezoelectric resonator device and manufacturing method therefor
#36Compression and cold weld sealing method for an electrical via connection
#37LIGHT-EMITTING DEVICE
#38Light-Emitting Device
#39Light emitting device
#40Mold design and semiconductor package
#41CONNECTING STRUCTURE, CIRCUIT DEVICE AND ELECTRONIC APPARATUS
#42Multiple patterning wiring board, wiring board and electronic apparatus
#43Nano-structured gasket for cold weld hermetic MEMS package and method of manufacture
#44SHIELD CASE AND MEMS MICROPHONE HAVING IT
#45Power semiconductor module, power semiconductor module assembly and method for fabricating a power semiconductor module assembly
#46Thermoplastic material
#47Electronic component
#48Shield case and MEMS microphone having it
#49Power semiconductor module system
#50Process for producing a circuit module
#51SEMICONDUCTOR DEVICE, ITS MANUFACTURING METHOD AND OPTICAL PICKUP MODULE
#52Electronic device and method of manufacturing the same
#53Electromagnetic interference shield for semiconductors using a continuous or near-continuous peripheral conducting seal and a conducting lid
#54Semiconductor package structure with heat sink
#55Power semiconductor module method
#56Power semiconductor module
#57CONCENTRATION PHOTOVOLTAIC MODULE
#58Mold design and semiconductor package
#59Infrared detector package
#60Circuit module and process for producing the same
#61Mounting device for high frequency microwave devices
#62Solid state image pickup device, method for manufacturing the same, semiconductor device and method for manufacturing the same
#63Planar circuit housing
#64Semiconductor package and method for fabricating the same
#65Electronic component package
#66Wafer-level chip package process
#67Semiconductor structure and method of assembly
#68Solder composition for electronic devices
#69Image sensor package, optical glass used therein, and processing method of the optical glass
#70Method of manufacturing enhanced thermal dissipation integrated circuit package
#71Hermetic MEMS package and method of manufacture
#72Device package
#73Hermetically sealing using a cold welded tongue and groove structure
#74Container, battery and electric double layer capacitor
#75Surface-mounted microwave package and corresponding mounting with a multilayer circuit
#76Control unit and method for producing the same
#77Semiconductor package with heat sink
#78Semiconductor package with heat sink
#79Apparatus and method for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages
#80Semiconductor substrate and thin processing method for semiconductor substrate
#81Resin-molded package with cavity structure
#82Method of manufacturing a semiconductor device and a fabrication apparatus for a semiconductor device
#83Semiconductor package
#84EMI shielded integrated circuit packaging apparatus method and system
#85Method of manufacturing a semiconductor device and a fabrication apparatus for a semiconductor device
#86Heat dissipating structure and semiconductor package with the same
#87Semiconductor package with heat sink
#88Semiconductor package with heat dissipating structure
#89Mounting device for high frequency microwave devices
#90Methods for enclosing a thermoplastic package
#91Lead for integrated circuit package
#92Flange for integrated circuit package
#93Thermoplastic material
#94Method of manufacturing an enhanced thermal dissipation integrated circuit package