212666 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of package parts other than the semiconductor or other solid state devices to be connected; Cap Connection portion, e.g. seal
Sub-classes:SEMICONDUCTOR DEVICE STRUCTURE WITH PROTECTION CAP
#2Devices and methods related to stack structures including passivation layers for distributing compressive force
#3SEMICONDUCTOR DEVICE PACKAGE CONTAINING A MEMS DEVICE AND METHOD FOR MANUFACTURING THE SAME
#4Coating method, coating apparatus and method for manufacturing component
#5DAM FOR THREE-DIMENSIONAL INTEGRATED CIRCUIT
#6Semiconductor device structure having protection caps on conductive lines
#7Method of manufacturing an integrated inductor with protections caps on conductive lines
#8Proximity coupling interconnect packaging systems and methods
#9Coating method, coating apparatus and method for manufacturing component
#10Method of forming a semiconductor package
#11Die encapsulation in oxide bonded wafer stack
#12Platform with thermally stable wireless interconnects
#13Die encapsulation in oxide bonded wafer stack
#14Proximity coupling interconnect packaging systems and methods
#15Power module
#16Dam for three-dimensional integrated circuit
#17Semiconductor package and method of forming the same
#18Semiconductor device, and method of manufacturing the same
#19Semiconductor light emitting apparatus, stem part
#20Lid attach optimization to limit electronic package warpage
#21Lid attach optimization to limit electronic package warpage
#22Die with integrated microphone device using through-silicon vias (TSVs)
#23Lid attach optimization to limit electronic package warpage
#24Circuit card attachment for enhanced robustness of thermal performance
#25Semiconductor device
#26Platform with thermally stable wireless interconnects
#27Wafer to wafer bonding process and structures
#28Proximity coupling of interconnect packaging systems and methods
#29Printed circuit board
#30Stack structures in electronic devices including passivation layers for distributing compressive force
#31Electronic component, manufacturing method for electronic component, electronic apparatus, and moving object
#32Dam for three-dimensional integrated circuit
#33Sealing structure for a bonded wafer and method of forming the sealing structure
#34Integrated bondline spacers for wafer level packaged circuit devices
#35Integrated bondline spacers for wafer level packaged circuit devices
#36Integrated circuit package including wire bond and electrically conductive adhesive electrical connections
#37Integrated bondline spacers for wafer level packaged circuit devices
#38Electronic controller
#39Miniaturized electrical component comprising an MEMS and an ASIC and production method
#40Wafer level hermetic bond using metal alloy with keeper layer
#41Semiconductor device and method of mounting cover to semiconductor die and interposer with adhesive material
#42Semiconductor device for smoothing the voltage of the end face of a drain of a high frequency semiconductor chip
#43Lid for an electrical hardware component
#44Enhanced thermal management of 3-D stacked die packaging
#45Nano-structured gasket for cold weld hermetic MEMS package and method of manufacture
#46MEMS device package with vacuum cavity by two-step solder reflow method
#47WAFER JOINING METHOD, WAFER COMPOSITE, AND CHIP
#48Semiconductor device
#49COLD WELD HERMETIC MEMS PACKAGE AND METHOD OF MANUFACTURE
#50Semiconductor device
#51Pressure-contact semiconductor device
#52Semiconductor Chip Manufacturing Method, Semiconductor Chip, Semiconductor Thin Film Chip, Electron Tube and Photo-Detecting Device
#53Thermal interconnect and interface systems, methods of production and uses thereof
#54Microfeature workpieces, carriers, and associated methods
#55Arrangement in semiconductor packages for inhibiting adhesion of lid to substrate while providing compression support
#56Semiconductor module
#57Method of wafer-level packaging using low-aspect ratio through-wafer holes
#58Ground arch for wirebond ball grid arrays
#59Circuit boards, electronic devices, and methods of manufacturing thereof
#60Arrangement in semiconductor packages for inhibiting adhesion of lid to substrate while providing compression support
#61Cold weld hermetic MEMS package and method of manufacture
#62Microelectronic assembly having a thermally conductive member with a cavity to contain a portion of a thermal interface material
#63Low warpage flip chip package solution-channel heat spreader
#64Method of fabricating an apparatus including a sealed cavity
#65Method of forming metal pattern for hermetic sealing of package
#66Wafer-level package and its manufacturing method
#67Heat dissipating structure and semiconductor package with the same
#68Surface mounted electronic circuit module
#69Hermetic sealing cap and method of manufacturing the same