212669 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of package parts other than the semiconductor or other solid state devices to be connected; Cap; Connection portion, e.g. seal Disposition
Semiconductor Device and Method of Forming Conductive Structure for EMI Shielding and Heat Dissipation
#2Semiconductor Device and Method of Forming Thin Heat Sink Using E-Bar Substrate
#3SEMICONDUCTOR PACKAGE STRUCTURES AND METHODS OF FORMING THE SAME
#4Package with Improved Heat Dissipation Efficiency and Method for Forming the Same
#5SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#6Semiconductor Device and Method of Forming Graphene-Coated Core Embedded Within TIM
#7SEMICONDUCTOR PACKAGE
#8METHODS OF FORMING ANCHOR-CONTAINING UNDERFILL STRUCTURES FOR A CHIP PACKAGE
#9Semiconductor Device and Method Forming Same
#10SEMICONDUCTOR PACKAGE AND METHOD
#11ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF
#12DAM STRUCTURE ON LID TO CONSTRAIN A THERMAL INTERFACE MATERIAL IN A SEMICONDUCTOR DEVICE PACKAGE STRUCTURE AND METHODS FOR FORMING THE SAME
#13SEMICONDUCTOR PACKAGE WITH BALL GRID ARRAY CONNECTION HAVING IMPROVED RELIABILITY
#14SEMICONDUCTOR DEVICE
#15PACKAGE ASSEMBLY LID AND METHODS FOR FORMING THE SAME
#16PACKAGE ASSMEBLY INCLUDING LID WITH ADDITIONAL STRESS MTITGATING FEET AND METHODS OF MAKING THE SAME
#17SEMICONDUCTOR DEVICE
#18ELECTRONIC ELEMENT MOUNTING SUBSTRATE, ELECTRONIC DEVICE, ELECTRONIC MODULE, AND METHOD FOR MANUFACTURING ELECTRONIC ELEMENT MOUNTING SUBSTRATE
#19LIDDED ELECTRONIC PACKAGE CONTAINING A BATTERY
#20SEMICONDUCTOR PACKAGES WITH THERMAL LID AND METHODS OF FORMING THE SAME
#21ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
#22ELECTRONIC PACKAGE AND SUBSTRATE STRUCTURE THEREOF
#23SEMICONDUCTOR DEVICE
#24ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
#25BONDING STRUCTURE AND METHOD THEREOF
#26ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
#27Package with Heat Dissipation Structure and Method for Forming the Same
#28Integrated Circuit Packages and Methods of Forming the Same
#29Semiconductor Device and Method of Forming Graphene-Coated Core Embedded Within TIM
#30SEMICONDUCTOR PACKAGE
#31ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF
#32Tunable Fingertip Capacitors with Enhanced Shielding in Ceramic Package
#33SEMICONDUCTOR PACKAGE WITH BALL GRID ARRAY CONNECTION HAVING IMPROVED RELIABILITY
#34Package with Improved Heat Dissipation Efficiency and Method for Forming the Same
#35Semiconductor Device and Method of Forming Conductive Structure for EMI Shielding and Heat Dissipation
#36Multi-component modules (MCMs) including configurable electromagnetic isolation (EMI) shield structures and related methods
#37Semiconductor Device and Method of Forming Thin Heat Sink Using E-Bar Substrate
#38SEMICONDUCTOR PACKAGE AND METHOD
#39ANCHOR-CONTAINING UNDERFILL STRUCTURES FOR A CHIP PACKAGE AND METHODS OF FORMING THE SAME
#40SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME
#41ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
#42Semiconductor Device and Method Forming Same
#43SEMICONDUCTOR PACKAGE STRUCTURES AND METHODS OF FORMING THE SAME
#44Package assembly lid and methods for forming the same
#45SEMICONDUCTOR PACKAGES
#46SEMICONDUCTOR PACKAGE
#47SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#48Bonding structure and method thereof
#49MICROELECTRONIC ASSEMBLIES INCLUDING STIFFENERS AROUND INDIVIDUAL DIES
#50PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
#51ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
#52POWER SEMICONDUCTOR MODULE, METHOD FOR ASSEMBLING A POWER SEMICONDUCTOR MODULE AND HOUSING FOR A POWER SEMICONDUCTOR MODULE
#53INTERPOSER STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
#54Warpage Compensation for BGA Package
#55WIRING BOARD AND SEMICONDUCTOR PACKAGE
#56SEMICONDUCTOR PACKAGE
#57HIGH-FREQUENCEY PACKAGE, HIGH-FREQUENCY MODULE, AND RADIO WAVE ABSORPTION METHOD
#58SEMICONDUCTOR DEVICE
#59Semiconductor Packages with Thermal Lid and Methods of Forming the Same
#60DAM STRUCTURE ON LID TO CONSTRAIN A THERMAL INTERFACE MATERIAL IN A SEMICONDUCTOR DEVICE PACKAGE STRUCTURE AND METHODS FOR FORMING THE SAME
#61SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#62Package assembly including lid with additional stress mitigating feet and methods of making the same
#63SEMICONDUCTOR PACKAGE HAVING PACKAGE HOUSING IN ENGRAVED SURFACE FORM AND METHOD OF MANUFACTURING THE SAME
#64Semiconductor device
#65CLIP STRUCTURE FOR SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
#66LIQUID METAL THERMAL INTERFACE
#67Solid metal foam thermal interface material
#68PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
#69Direct bonded heterogeneous integration silicon bridge
#70Semiconductor device and manufacturing method thereof
#71Manufacturing method of housing for semiconductor device
#72Multi-component modules (MCMs) including configurable electro-magnetic isolation (EMI) shield structures, and related methods
#73Semiconductor package
#74Semiconductor package with heatsink
#75Package structure and method of fabricating the same
#76Semiconductor device assembly with vapor chamber
#77Stacked silicon package assembly having thermal management
#78Sensor element
#79Semiconductor device assembly with heat transfer structure formed from semiconductor material
#80Semiconductor device assembly with heat transfer structure formed from semiconductor material
#81High reliability wafer level semiconductor packaging
#82Semiconductor device assembly with vapor chamber
#83System and method for bonding package lid
#84Methods and apparatus for thermal interface material (TIM) bond line thickness (BLT) reduction and TIM adhesion enhancement for efficient thermal management
#85High reliability wafer level semiconductor packaging
#86Cavity package with composite substrate
#87Semiconductor device assembly with heat transfer structure formed from semiconductor material
#88System and method for bonding package lid
#89High reliability wafer level semiconductor packaging
#90Semiconductor device
#91Microelectronic assemblies with cavities, and methods of fabrication
#92Semiconductor device assembly with heat transfer structure formed from semiconductor material
#93Semiconductor device assembly with vapor chamber
#94Cavity package with composite substrate
#95Integrated circuit assemblies with reinforcement frames, and methods of manufacture
#96Electronic device
#97Integrated circuit assemblies with reinforcement frames, and methods of manufacture
#98System and method for bonding package lid
#99Electronic component