212692 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of package parts other than the semiconductor or other solid state devices to be connected; Cap; Material with a principal constituent of the material being a solid not provided for in groups - , e.g. allotropes of carbon, fullerene, graphite, carbon-nanotubes, diamond
Fabricating an integrated circuit chip module with stiffening frame and orthogonal heat spreader
#2Method of fabricating a chip module with stiffening frame and orthogonal heat spreader
#3Chip module with stiffening frame and orthogonal heat spreader
#4Method of fabricating a chip module with stiffening frame and directional heat spreader
#5Organic module EMI shielding structures and methods
#6Organic module EMI shielding structures and methods
#7Thermal hot spot cooling for semiconductor devices