H01L2924/166 - CPC Classification Index

ClassID:

212678 ⎘

H01L2924/166 - CPC Classification

Classification description:

Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of package parts other than the semiconductor or other solid state devices to be connected; Cap Material

Sub-classes:

H01L2924/167 » with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof 65
H01L2924/16786 » with a principal constituent of the material being a non metallic, non metalloid inorganic material 0
H01L2924/1679 » with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy 19
H01L2924/16793 » with a principal constituent of the material being a solid not provided for in groups to , e.g. allotropes of carbon, fullerene, graphite, carbon-nanotubes, diamond 6
H01L2924/16798 » with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams 2

Recent Application in this class:

20200013667

2020-01-09

Non-embedded silicon bridge chip for multi-chip module

20190096786

2019-03-28

Semiconductor packages that include a heat pipe for exhausting heat from one or more ends of the package

20170245035

2017-08-24

Die with integrated microphone device using through-silicon vias (TSVs)

20150163958

2015-06-11

Heat dissipation structure

20150037937

2015-02-05

SEMICONDUCTOR DEVICES INCLUDING ELECTROMAGNETIC INTERFERENCE SHIELD

20140103506

2014-04-17

Semiconductor chip device with polymeric filler trench

20140027898

2014-01-30

Multichip electronic packages and methods of manufacture

20120326294

2012-12-27

Multichip electronic packages and methods of manufacture

20120061852

2012-03-15

Semiconductor chip device with polymeric filler trench

#10

20120061133

2012-03-15

High-frequency circuit package and high-frequency circuit device

#11

20120005875

2012-01-12

Method of semiconductor device protection

#12

20110272796

2011-11-10

Nano-structured gasket for cold weld hermetic MEMS package and method of manufacture

#13

20110268977

2011-11-03

Electronic component device and method for producing the same

#14

20110210431

2011-09-01

Microwave circuit package

#15

20110180929

2011-07-28

Gold-tin-indium solder for processing compatibility with lead-free tin-based solder

#16

20110059567

2011-03-10

MEMS device package with vacuum cavity by two-step solder reflow method

#17

20110049729

2011-03-03

Method for producing a hermetically sealed, electrical feedthrough using exothermic nanofilm

#18

20110049699

2011-03-03

Semiconductor device packaging structure

#19

20110044017

2011-02-24

Electronic component

#20

20100291399

2010-11-18

LID FOR A FUNCTIONAL PART AND A PROCESS FOR ITS MANUFACTURE

#21

20100089629

2010-04-15

ELECTRONIC COMPONENT DEVICE AND METHOD FOR PRODUCING THE SAME

#22

20100039774

2010-02-18

Power semiconductor module and method for its production

#23

20100006336

2010-01-14

LID OR CASE FOR SEALED PACKAGE AND METHOD FOR MANUFACTURING THE SAME

#24

20090288852

2009-11-26

Electronic device and method of manufacturing the same

#25

20090283876

2009-11-19

Electromagnetic interference shield for semiconductors using a continuous or near-continuous peripheral conducting seal and a conducting lid

#26

20090194852

2009-08-06

Semiconductor device packages with electromagnetic interference shielding

#27

20090152695

2009-06-18

SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE

#28

20090152688

2009-06-18

Integrated circuit package system for shielding electromagnetic interference

#29

20090151972

2009-06-18

COLD WELD HERMETIC MEMS PACKAGE AND METHOD OF MANUFACTURE

#30

20080296709

2008-12-04

Chip assembly including package element and integrated circuit chip

#31

20080203558

2008-08-28

Method of semiconductor device protection, package of semiconductor device

#32

20080144287

2008-06-19

Mounting device for high frequency microwave devices

#33

20080124841

2008-05-29

Reduction of damage to thermal interface material due to asymmetrical load

#34

20080102564

2008-05-01

Method for cooling a semiconductor device

#35

20080093718

2008-04-24

SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE

#36

20080042767

2008-02-21

Crystal oscillator emulator

#37

20070267734

2007-11-22

No-lead IC packages having integrated heat spreader for electromagnetic interference (EMI) shielding and thermal enhancement

#38

20070188253

2007-08-16

Crystal oscillator emulator

#39

20070182500

2007-08-09

Crystal oscillator emulator

#40

20070176690

2007-08-02

Crystal oscillator emulator

#41

20070090505

2007-04-26

Apparatus and method for manufacturing imaging device package

#42

20070063336

2007-03-22

QFN/SON compatible package with SMT land pads

#43

20070031279

2007-02-08

Solder composition for electronic devices

#44

20070004080

2007-01-04

Hermetic seals for micro-electromechanical system devices

#45

20060283917

2006-12-21

Method of soldering or brazing articles having surfaces that are difficult to bond

#46

20060272857

2006-12-07

EMI ABSORBING SHIELDING FOR A PRINTED CIRCUIT BOARD

#47

20060272856

2006-12-07

EMI absorbing shielding for a printed circuit board

#48

20060261468

2006-11-23

Semiconductor apparatus having a cooling apparatus that compressively engages a semiconductor device

#49

20060249836

2006-11-09

Chip-scale package

#50

20060243384

2006-11-02

Method for adhesive bonding in electronic packaging

#51

20060189038

2006-08-24

Semiconductor component and method of manufacture

#52

20060186513

2006-08-24

High frequency unit

#53

20060180916

2006-08-17

Ground arch for wirebond ball grid arrays

#54

20060113639

2006-06-01

Integrated circuit including silicon wafer with annealed glass paste

#55

20060061974

2006-03-23

Solder foil, semiconductor device and electronic device

#56

20060037994

2006-02-23

Bonded silicon, components and a method of fabricating the same

#57

20050255635

2005-11-17

Microelectronic assembly having a thermally conductive member with a cavity to contain a portion of a thermal interface material

#58

20050212102

2005-09-29

Method for attaching shields on substrates

#59

20050139990

2005-06-30

Method of manufacturing ceramic package sealing structure and ceramic package having said sealing structure

#60

20050133904

2005-06-23

Method of forming metal pattern for hermetic sealing of package

#61

20050104164

2005-05-19

EMI shielded integrated circuit packaging apparatus method and system

#62

20050095438

2005-05-05

Ceramic package sealing structure and ceramic package having said sealing structure

#63

20050072972

2005-04-07

Semiconductor device protection cover, and semiconductor device unit including the cover

#64

20050067689

2005-03-31

Semiconductor module and method for producing a semiconductor module

#65

20050045358

2005-03-03

EMI absorbing shielding for a printed circuit board

#66

20050029546

2005-02-10

Mounting device for high frequency microwave devices