Patents-Review.com
ClassID:

212697 ⎘

H01L2924/17151 - CPC Classification

Classification description:

Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of package parts other than the semiconductor or other solid state devices to be connected; Frame; Shape Frame comprising an aperture, e.g. for pressure control, encapsulation

Recent Application in this class:
#1
20250226271
2025-07-10

SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME

 #2
20250105107
2025-03-27

ELECTRONIC CIRCUIT PACKAGES THAT DEMONSTRATE REDUCED ADHESION TO MOLD FLASH AND METHODS FOR REDUCING ADHESION OF MOLD FLASH TO METAL LEADFRAMES

 #3
20250054900
2025-02-13

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

 #4
20240145319
2024-05-02

Semiconductor device package and a method of manufacturing the same

 #5
20240096748
2024-03-21

CHIP PROTECTION DEVICE

 #6
20240071851
2024-02-29

ELECTRONIC DEVICE PACKAGE INCLUDING A GEL

 #7
20240038683
2024-02-01

SEMICONDUCTOR DEVICE WITH STRESS RELIEF FEATURE AND METHOD THEREFOR

 #8
20230335460
2023-10-19

SEMICONDUCTOR MODULE

 #9
20230100769
2023-03-30

High density interconnection and wiring layers, package structures, and integration methods

 #10
20230005801
2023-01-05

Semiconductor module and method for manufacturing semiconductor module

 #11
20220208623
2022-06-30

Semiconductor device package and a method of manufacturing the same

 #12
20220077012
2022-03-10

Electronic element mounting substrate and electronic device

 #13
20210407872
2021-12-30

Electronic element mounting substrate, and electronic device

 #14
20210202365
2021-07-01

Package with shifted lead neck

 #15
20200243408
2020-07-30

Semiconductor device package and a method of manufacturing the same

 #16
20190181068
2019-06-13

Circuit module and manufacturing method therefor

 #17
20190067560
2019-02-28

Semiconductor device and mounting structure of semiconductor device

 #18
20190051640
2019-02-14

Semiconductor module with temperature detecting element

 #19
20180190553
2018-07-05

Semiconductor device package and a method of manufacturing the same

 #20
20180114734
2018-04-26

Chip package structure and manufacturing method thereof

 #21
20180053891
2018-02-22

Semiconductor device and mounting structure of semiconductor device

 #22
20170323845
2017-11-09

Electronic package

 #23
20170186672
2017-06-29

Electronic element mounting substrate and electronic device

 #24
20170110390
2017-04-20

SUPPORT AND/OR CLIP FOR SEMICONDUCTOR ELEMENTS, SEMICONDUCTOR COMPONENT, AND PRODUCTION METHOD

 #25
20140145321
2014-05-29

Power semiconductor housing with contact mechanism

 #26
20120018857
2012-01-26

Method of chip package build-up

 #27
20080186112
2008-08-07

PACKAGE STRUCTURE FOR A HIGH-FREQUENCY ELECTRONIC COMPONENT

 #28
20060263460
2006-11-23

Jig structure for manufacturing an image sensor