212694 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of package parts other than the semiconductor or other solid state devices to be connected Frame
Sub-classes:Semiconductor device
#2Back side metallization
#3Method of manufacturing light-emitting device
#4Laminated stiffener to control the warpage of electronic chip carriers
#5Back side metallization
#6Method of forming an electronic package
#7Method and fixture for chip attachment to physical objects
#8Rear face element for a solar module
#9Fabricating an integrated circuit chip module with stiffening frame and orthogonal heat spreader
#10Semiconductor device, manufacturing apparatus for semiconductor device and manufacturing method for semiconductor device, and semiconductor module
#11Method of fabricating a chip module with stiffening frame and orthogonal heat spreader
#12Chip module with stiffening frame and orthogonal heat spreader
#13Fan-out semiconductor package
#14Flexible window clamp
#15Method of fabricating a chip module with stiffening frame and directional heat spreader
#16Methods for forming semiconductor device packages
#17Semiconductor device packages
#18Apparatus for mounting a power conditioner to a photovoltaic module frame
#19Package in package (PiP) electronic device and manufacturing method thereof
#20Semiconductor device, manufacturing apparatus for semiconductor device and manufacturing method for semiconductor device, and semiconductor module
#21Semiconductor package, fabrication method therefor, and package-on package
#22Semiconductor package with package-on-package stacking capability and method of manufacturing the same
#23Semiconductor device and method of forming interposer frame electrically connected to embedded semiconductor die
#24Method and apparatus for high temperature semiconductor device packages and structures using a low temperature process
#25Semiconductor device and method for manufacturing the same
#26Thermal matched composite die
#27Light emitting device package and light emitting device having lead-frames
#28Stacked-die including a die in a package substrate
#29Semiconductor device
#30Interconnect substrate with embedded semiconductor device and built-in stopper and method of making the same
#31Hybrid wiring board with built-in stopper, interposer and build-up circuitry
#32Semiconductor device housing package, and semiconductor apparatus and electronic apparatus including the same
#33Wiring substrate and method for manufacturing wiring subtrate
#34Power module
#35Flange for semiconductor die
#36METHODS AND APPARATUS FOR APPLYING AN ADHESIVE TO A CIRCUIT BOARD
#37Semiconductor device and method of forming interposer frame electrically connected to embedded semiconductor die
#38Flange for semiconductor die