212699 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of package parts other than the semiconductor or other solid state devices to be connected; Frame Connection portion, e.g. seal
THERMALLY ENHANCED EMBEDDED DIE PACKAGE
#2SEMICONDUCTOR DEVICE
#3SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
#4SEMICONDUCTOR DEVICE
#5SOCKET INTERFACE FRAMES FOR DEVICES WITH IMPROVED-PERFORMANCE SUBSTRATES
#6ELECTRONIC DEVICE PACKAGE INCLUDING A GEL
#7THERMALLY ENHANCED EMBEDDED DIE PACKAGE
#8Semiconductor module and method for manufacturing semiconductor module
#9SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#10Package assembly for plating with selective molding
#11Thermal transfer structures for semiconductor die assemblies
#12Hermetic package for high CTE mismatch
#13Hermetic package for high CTE mismatch
#14Semiconductor packages and method of manufacturing semiconductor packages
#15Packaging process for plating with selective molding
#16Integrated electronic device having a dissipative package, in particular dual side cooling package
#17Thermal transfer structures for semiconductor die assemblies
#18Integrated electronic device having a dissipative package, in particular dual side cooling package
#19Non-planar inductive electrical elements in semiconductor package lead frame
#20Semiconductor package and method for manufacturing the same
#21Power semiconductor module
#22Semiconductor device with notched main lead
#23Package and high frequency terminal structure for the same
#24Package and high frequency terminal structure for the same