Solder material

Package structure and manufacturing method thereof

LOGIC DRIVE BASED ON STANDARD COMMODITY FPGA IC CHIPS USING NON-VOLATILE MEMORY CELLS

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES WITHOUT THICKNESS DEVIATION

Package-on-package assembly with wire bond vias

3D semiconductor device and structure with bonding

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

Wire bond wires for interference shielding

Power module semiconductor device and inverter equipment, and fabrication method of the power module semiconductor device, and metallic mold

Light source device and display unit

SEMICONDUCTOR PACKAGE WITH PLURALITY OF LEADS AND SEALING RESIN

Package with electrically insulated carrier and at least one step on encapsulant

SEMICONDUCTOR DEVICE, BATTERY MANAGEMENT SYSTEM AND METHOD OF PRODUCING A SEMICONDUCTOR DEVICE

Power delivery for embedded bridge die utilizing trench structures

SEMICONDUCTOR MODULE AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Side-solderable leadless package

Semiconductor device

Semiconductor device and manufacturing method thereof

Bridge interconnection with layered interconnect structures

POWER SEMICONDUCTOR DEVICE

Chip package structure having molding layer

Methods for producing a 3D semiconductor device and structure with memory cells and multiple metal layers

Semiconductor device

Semiconductor device packages, packaging methods, and packaged semiconductor devices

Thin semiconductor packaging unit having a plurality of bridging layers

MEMS resonator system

MAGNETICALLY COUPLED GALVANICALLY ISOLATED COMMUNICATION USING LEAD FRAME

Encircling a semiconductor device with stacked frames on a substrate

Manufacturing method of semiconductor package including forming cavity in circuit substrate without exposing floor plate

SEMICONDUCTOR PACKAGE AND METHOD COMPRISING FORMATION OF REDISTRIBUTION STRUCTURE AND INTERCONNECTING DIE

3D semiconductor device and structure with bonding

PACKAGE WITH FAN-OUT STRUCTURES

Package structure with reinforcement structures in a redistribution circuit structure and manufacturing method thereof

BACK SURFACE PLASMA DICED WAFERS AND METHODS THEREOF

SEMICONDUCTOR DEVICE

Sensing die encapsulated by an encapsulant with a roughness surface having a hollow region

Low cost package warpage solution

Low warpage high density trench capacitor

Electrical interconnect bridge

IC package including multi-chip unit with bonded integrated heat spreader

Semiconductor structure having an anti-arcing pattern disposed on a passivation layer

Semiconductor device

Semiconductor devices having a plurality of offsets in leads supporting stacked components and methods of manufacturing thereof

MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME

Semiconductor device and method for manufacturing the same

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

3D semiconductor device and structure with single-crystal layers

SEMICONDUCTOR DEVICE AND METHOD

Packaged electronic device having integrated antenna and locking structure

Semiconductor device package and method for manufacturing the same

Semiconductor die connection system and method

DISCRETE POWER SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE MODULE INCLUDING VERTICAL TERMINALS

Semiconductor structure comprising various via structures

Semiconductor package structures and methods of manufacture

Semiconductor packages with roughened conductive components

Cathode for a solid-state battery

Methods for producing a 3D semiconductor device and structure with memory cells and multiple metal layers

SEMICONDUCTOR PACKAGE INCLUDING ANTENNA SUBSTRATE AND MANUFACTURING METHOD THEREOF

INVERTED LEADS FOR PACKAGED ISOLATION DEVICES

Semiconductor device

CIRCUIT BOARD, METHOD FOR MANUFACTURING CIRCUIT BOARD, AND RESONATOR DEVICE

Package structure with metallic layer over the surfaces of a plurality of semiconductor dies

Sensor package and manufacturing method thereof

Method for interconnecting stacked semiconductor devices

Shielded electronic component package

Package structure including stacked pillar portions

Semiconductor Device and Method of Forming Conductive Vias to Have Enhanced Contact to Shielding Layer

SEMICONDUCTOR APPARATUS

Switching device and electronic circuit

Switching device and electronic circuit

Method for Manufacturing Semiconductor Device

Switching device and electronic circuit

Chip package and manufacturing method thereof

CAVITY PACKAGES

Packaged die and RDL with bonding structures therebetween

Forming Recesses in Molding Compound of Wafer to Reduce Stress

Semiconductor package and method

Interconnect structure having a barrier layer along the sidewall of self-aligned via structures

Heterogeneous fan-out structure and method of manufacture

Packaging of a semiconductor device with a plurality of leads

Power module and related methods

Wafer level chip scale packaging intermediate structure apparatus and method

Power delivery for embedded bridge die utilizing trench structures

Semiconductor package structure and method for manufacturing the same

Semiconductor package having a high reliability

Semiconductor package for thermal dissipation

Pad Design For Reliability Enhancement in Packages

SEMICONDUCTOR DEVICE WITH REDISTRIBUTION LAYERS FORMED UTILIZING DUMMY SUBSTRATES

Semiconductor device and method for manufacturing the same

Packaged integrated circuit devices with through-body conductive vias, and methods of making same

Light emitting device

Package-on-package type semiconductor package

Multi-chip package and manufacturing method thereof

Semiconductor device having a carrier, semiconductor chip packages mounted on the carrier and a cooling element

Lead frame assembly having a plurality of dicing holes

Method for producing a 3D semiconductor device and structure with memory cells and multiple metal layers

Red flip chip light emitting diode, package, and method of making the same

METHOD FOR MANUFACTURING COMPOSITE LAYER CIRCUIT STRUCTURE OF ELECTRONIC DEVICE

TEMPORARY PROTECTION FILM FOR SEMICONDUCTOR ENCAPSULATION, PRODUCTION METHOD THEREFOR, LEAD FRAME WITH TEMPORARY PROTECTION FILM, TEMPORARILY PROTECTED ENCAPSULATION OBJECT, AND METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE

3D semiconductor device and structure with bonding

Single-package wireless communication device

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF

High voltage monolithic LED chip with improved reliability

Plurality of semiconductor devices between stacked substrates

Packaged stackable electronic power device for surface mounting and circuit arrangement

Power delivery for embedded bridge die utilizing trench structures

3D semiconductor device and structure with single-crystal layers

Package-on-package (PoP) semiconductor package and electronic system including the same

Cavity formed in a molding compound of a semiconductor package to reduce mechanical stress on a portion of a die in the package, and methods of formation

SEMICONDUCTOR DEVICE

Power Module with Press-Fit Contacts

Integrated fan-out package and the methods of manufacturing

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING SEMICONDUCTOR DEVICE AND RIBBON FOR USE THEREIN

SEMICONDUCTOR DEVICE

ELECTRONIC DEVICE

Packaged semiconductor devices and methods of packaging semiconductor devices

Power module semiconductor device and inverter equipment, and fabrication method of the power module semiconductor device, and metallic mold

Fan-out wafer level package structure

Semiconductor device

Method for manufacturing package structure

Semiconductor Device and Method of Forming Dual-Sided Interconnect Structures in FO-WLCSP

SEMICONDUCTOR DEVICE HAVING GALVANIC ISOLATION AND METHOD THEREFOR

Semiconductor device

Semiconductor package having routable encapsulated conductive substrate and method

Package structure and method for manufacturing the same

Light emitting device, and method for manufacturing thereof

Chip package

Molded proximity sensor

SEMICONDUCTOR DEVICE AND POWER CONVERTER

Semiconductor package including a circuit substrate having a cavity and a floor plate embedded in a dielectric material and a semiconductor die disposed in the cavity

Light-emitting device, integrated light-emitting device, and light-emitting module

Semiconductor die mounted in a recess of die pad

Semiconductor package and method comprising formation of redistribution structure and interconnecting die

Wire bond wires for interference shielding

LIGHT EMITTING DEVICE

Package structure having at least one die with a plurality of taper-shaped die connectors

Semiconductor device package

Method of forming a packaged semiconductor device having enhanced wettable flank and structure

Semiconductor device comprising PN junction diode and Schottky barrier diode

Integrated circuit package having wirebonded multi-die stack

Electrical, mechanical, computing, and/or other devices formed of extremely low resistance materials

SEMICONDUCTOR DEVICE ASSEMBLY WITH THROUGH-PACKAGE INTERCONNECT AND ASSOCIATED SYSTEMS, DEVICES, AND METHODS

3D semiconductor memory device and structure

Semiconductor structure and method for forming the same

Semiconductor Device and Method of Using a Standardized Carrier to Form Embedded Wafer Level Chip Scale Packages

Heat slug attached to a die pad for semiconductor package

Semiconductor device and method of manufacturing the same

Semiconductor Device and Method of Forming Embedded Wafer Level Chip Scale Packages

LED assembly

STACKED MICROFEATURE DEVICES AND ASSOCIATED METHODS

Fine pitch BVA using reconstituted wafer with area array accessible for testing

Build-up package for integrated circuit devices, and methods of making same

Universal Surface-Mount Semiconductor Package

Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrate

POWER MODULE AND POWER CONVERSION DEVICE

Semiconductor package element

LTHC as charging barrier in info package formation

SEMICONDUCTOR PACKAGE

Package structure having a plurality of chips attached to a lead frame by redistribution layer

Power amplifier modules including semiconductor resistor and tantalum nitride terminated through wafer via

Multi-chip semiconductor package

Lead frames having rounded corners and related packages and methods

Semiconductor package and method of fabricating the same

Semiconductor package and method of manufacturing the same

Electronic device package and fabricating method thereof

Package-on-package assembly with wire bonds to encapsulation surface

Plurality of bus bars intersecting a plurality electrode

Semiconductor package with dual sides of metal routing

Packages with Si-substrate-free interposer and method forming same

3D semiconductor device and structure with memory

Semiconductor device encapsulated by molding material attached to redistribution layer

Opening in the pad for bonding integrated passive device in InFO package

Forming large chips through stitching

Method of forming device and package structure

Power semiconductor device including a deformable flow blocking member between a module unit and a cooling unit

Stacked-die MEMS resonator

SEMICONDUCTOR PACKAGE HAVING PASSIVE SUPPORT WAFER

Semiconductor package with layer structures, antenna layer and electronic component

Pad structure design in fan-out package

Semiconductor device with sealed semiconductor chip

Light emitting device

Ultra small molded module integrated with die by module-on-wafer assembly

Devices and methods related to metallization of ceramic substrates for shielding applications

Semiconductor device

Electronic device with exposed tie bar

Semiconductor device, semiconductor system, moving body, and method for manufacturing semiconductor device

3D semiconductor device and structure with single-crystal layers

Method for producing a 3D semiconductor device and structure with single crystal transistors and metal gate electrodes

EMBEDDED SEMICONDUCTIVE CHIPS IN RECONSTITUTED WAFERS, AND SYSTEMS CONTAINING SAME

Polyamideimide resin, resin composition, and semiconductor device

3D semiconductor devices and structures with metal layers

Semiconductor device and method of manufacture

Method of making an integrated circuit package including an integrated circuit die soldered to a bond pad of a redistribution structure

Plurality of transistors attached to a heat sink with a periphery notch

Light source device and display unit

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Frames stacked on substrate encircling devices and manufacturing method thereof

Multichip packaged semiconductor device

Frame member with a porous material between a semiconductor module and heat sink

Chip package

Structure and method of forming a joint assembly

Semiconductor die connection system and method

Semiconductor device having EMI shielding structure and related methods

Press, actuator set and method for encapsulating electronic components with at least two individual controllable actuators

Package-on-package semiconductor assemblies and methods of manufacturing the same

Circuit module having a plurality of lead frames connected to a substrate by metal posts

Semiconductor package with plurality of leads and sealing resin

Semiconductor device and method of forming microelectromechanical systems (MEMS) package

Packaged integrated circuit devices with through-body conductive vias, and methods of making same

BOTTOM PACKAGE EXPOSED DIE MEMS PRESSURE SENSOR INTEGRATED CIRCUIT PACKAGE DESIGN

Integrated circuit package pad and methods of forming

Semiconductor device and method for manufacturing semiconductor device

Semiconductor package with plurality of grooves on lower surface

Thermal structures adapted to electronic device heights in integrated circuit (IC) packages

Emi shielding for flip chip package with exposed die backside

Light emitting diode constructions and methods for making the same

Semiconductor package including a through-electrode penetrating a molding part

Anisotropic conductive film and method of producing the same

SEMICONDUCTOR DEVICE WITH THIN REDISTRIBUTION LAYERS

3D semiconductor memory device and structure

Package structure with reinforcement structures in a redistribution circuit structure and manufacturing method thereof

Semiconductor package and related methods

EMI shielding for flip chip package with exposed die backside

Semiconductor device and manufacturing method thereof

Component and Method of Manufacturing a Component Using an Ultrathin Carrier

Printed circuit board

Switching device and electronic circuit

Semiconductor package with barrier to contain thermal interface material

Power module with electrodes and heat sink and manufacturing method therefor

Multi-chip packaged semiconductor device

Low cost package warpage solution

Semiconductor device and measurement device

Sensing component encapsulated by an encapsulant with a roughness surface having a hollow region

Light emitting device

LIGHT-EMITTING ELEMENT AND LIGHT-EMITTING DIODE

Roughened conductive components

Power module and related methods

Semiconductor module and power conversion device

Semiconductor device packages, packaging methods, and packaged semiconductor devices

Package structure

Leadframe package with adjustable clip

Chip package structure with conductive shielding film

Semiconductor package having side wall plating

Plurality of vertical heat conduction elements attached to metal film

Composite wafer, semiconductor device and electronic component

Package on package structure

Method of forming chip package having stacked chips

Chip Package and Method of Forming Chip Packages

Chip package including stacked chips and chip couplers

Lead frame with a support portion having a through hole over a heat dissipation plate, semiconductor device, and manufacturing method of lead frame

Semiconductor package including high thermal conductivity layer

Semiconductor packaging method, semiconductor assembly and electronic device comprising semiconductor assembly

Semiconductor packaging method, semiconductor assembly and electronic device comprising semiconductor assembly

EMBEDDED SEMICONDUCTIVE CHIPS IN RECONSTITUTED WAFERS, AND SYSTEMS CONTAINING SAME

Memory device comprising programmable command-and-address and/or data interfaces

Package-on-package assembly with wire bond vias

Power semiconductor module and power converter

Semiconductor structure having an anti-arcing pattern disposed on a passivation layer and a post passivation layer disposed on the anti-arcing pattern

Package process and package structure

Methods of Packaging Semiconductor Devices and Packaged Semiconductor Devices

Package with electrically insulated carrier and at least one step on encapsulant

Logic drive based on standard commodity FPGA IC Chips using non-volatile memory cells

FLIP-CHIP ON LEADFRAME HAVING PARTIALLY ETCHED LANDING SITES

Semiconductor apparatus mounted electrically connected to a plurality of external terminals by a lead

Semiconductor device and manufacturing method thereof

Memories and memory components with interconnected and redundant data interfaces

Embedded resistor-capacitor film for fan out wafer level packaging

Semiconductor package structure including an encapsulant having a cavity exposing an interposer

Method for fabricating semiconductor package and semiconductor package using the same

Stiffener package and method of fabricating stiffener package

Tablet ultrasound system

Method of manufacturing a light emitting device

LIGHT EMITTING DEVICE

Package structure and manufacturing method thereof

Semiconductor device with discrete blocks

PACKAGED MICROELECTRONIC DEVICES HAVING STACKED INTERCONNECT ELEMENTS AND METHODS FOR MANUFACTURING THE SAME

3D semiconductor devices and structures with at least two single-crystal layers

Scalable high-bandwidth connectivity

Semiconductor device including resin with a filler for encapsulating bridge member connected to a substrate

Chip package structure

Semiconductor device

Semiconductor chip

Plurality of lead frames for cooling a power device

RF devices with enhanced performance and methods of forming the same

Nitride semiconductor device and nitride semiconductor package

Semiconductor device having through silicon vias and manufacturing method thereof

Semiconductor device with die mounted to an insulating substrate and corresponding method of manufacturing semiconductor devices

Semiconductor package having a chip carrier and a metal plate sized independently of the chip carrier

Leadframe package with pre-applied filler material

3D semiconductor memory device and structure

3D semiconductor device and structure with a built-in test circuit for repairing faulty circuits

Semiconductor device with encapsulant deposited along sides and surface edge of semiconductor die in embedded WLCSP

Architectures for an implantable stimulator device having a plurality of electrode driver integrated circuits with shorted electrode outputs

Voltage generators with charge pumps for switch circuits

Semiconductor package structures and methods of manufacture

Semiconductor device

3D semiconductor device and structure with high-k metal gate transistors