212716 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of package parts other than the semiconductor or other solid state devices to be connected Encapsulation
Semiconductor device
#602Semiconductor device
#603Semiconductor device
#604Sensor package and manufacturing method thereof
#605Method of manufacturing a resin-sealed semiconductor device
#606Semiconductor device having a redistribution layer
#607Arrangement and thermal management of 3D stacked dies
#608Semiconductor chip including chip pad, redistribution wiring test pad, and redistribution wiring connection pad
#609Phosphor and light-emitting equipment using phosphor
#610Shielded electronic component package
#611Method of manufacturing an electronic device and electronic device manufactured thereby
#612SEMICONDUCTOR DEVICE WITH SEALED SEMICONDUCTOR CHIP
#613Semiconductor device
#614Light emitting device
#615Die stack with cascade and vertical connections
#616Semiconductor package and method for fabricating a semiconductor package
#617Compact opto-electronic modules and fabrication methods for such modules
#618Single-shot encapsulation
#619Package-on-package semiconductor assemblies and methods of manufacturing the same
#620Semiconductor device
#621Semiconductor packages and methods of packaging semiconductor devices
#622Radio-frequency switching devices having improved voltage handling capability
#623Methods related to radio-frequency switching devices having improved voltage handling capability
#624Light source circuit unit, illuminator, and display
#625SOLDER MATERIAL FOR SEMICONDUCTOR DEVICE
#626Packaging of a semiconductor device with a plurality of leads
#627Semiconductor device
#628Integrated circuit die packages including a contiguous heat spreader
#629Semiconductor device
#630Methods for producing 3D semiconductor memory device and structure utilizing alignment marks
#631Substrate and semiconductor package comprising an interposer element with a slot and method of manufacturing the same
#632Semiconductor device including sense insulated-gate bipolar transistor
#633Plurality of stacked pillar portions on a semiconductor structure
#634Semiconductor device and method for manufacturing the same
#635Stacked semiconductor die assemblies with support members and associated systems and methods
#636Light-emitting device, integrated light-emitting device, and light-emitting module
#637Stacked semiconductor die assemblies with die support members and associated systems and methods
#638Bridge interconnection with layered interconnect structures
#639Fan-out package having a main die and a dummy die
#640Package structure having taper-shaped conductive pillar and method of forming thereof
#641Multi-layer conversion material for down conversion in solid state lighting
#642Wafer level dicing method and semiconductor device
#643Packaged LEDs with phosphor films, and associated systems and methods
#644Molded semiconductor package having a negative standoff
#645Integrated circuit structure and method for reducing polymer layer delamination
#646Semiconductor devices with duplicated die bond pads and associated device packages and methods of manufacture
#647Semiconductor package and method of forming the same
#648Redistribution layer structures for integrated circuit package
#649Wafer level package structure and method of forming same
#650Semiconductor package and method of manufacturing the semiconductor package
#651Package structure and method of forming the same
#652Fan-out semiconductor package
#653SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURE
#654Methods for producing a 3D semiconductor memory device comprising charge trap junction-less transistors
#655Method for producing a 3D semiconductor memory device and structure
#656Semiconductor package and method of manufacturing the same
#657Color stable red-emitting phosphors
#658Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body
#659Chip package
#660Method for manufacturing semiconductor device including step of simultaneous formation of plurality of contact openings
#661Packages with metal line crack prevention design
#662Method for interconnecting stacked semiconductor devices
#663Semiconductor package structure and method for manufacturing the same
#664Packaged stackable electronic power device for surface mounting and circuit arrangement
#665Power semiconductor device and method of manufacturing the same, and power conversion device
#666Package with fan-out structures
#667Semiconductor device comprising a resin case and a wiring member that is flat in the resin case
#668Solderless interconnection structure and method of forming same
#669Package comprising a substrate with interconnect routing over solder resist layer and an integrated device coupled to the substrate and method for manufacturing the package
#670Semiconductor device
#671Wafer level chip scale packaging intermediate structure apparatus and method
#672Methods for producing a 3D semiconductor memory device and structure
#673Buried electrical debug access port
#674METHOD OF MANUFACTURING AN OPTICAL SEMICONDUCTOR DEVICE
#675Optical semiconductor element mounting package and optical semiconductor device using the same
#676Interconnect structures, packaged semiconductor devices, and methods of packaging semiconductor devices
#677Method for fabricating substrate structure
#678PACKAGE STRUCTURE FOR POWER CONVERTER AND MANUFACTURE METHOD THEREOF
#679Semiconductor device
#680Case with a plurality of pair case components for a semiconductor device
#681Method of attaching an insulation sheet to encapsulated semiconductor device
#682SEMICONDUCTOR PACKAGE AND METHOD OF MAKING
#683Thermal dissipation through seal rings in 3DIC structure
#6843DIC packaging with hot spot thermal management features
#685RADIO FREQUENCY SHIELDING WITHIN A SEMICONDUCTOR PACKAGE
#686LIGHT EMITTING DEVICE
#687Semiconductor package having a high reliability
#688Heat Spreading Device and Method
#689Heterogeneous fan-out structure and method of manufacture
#690Electronic package structure with reduced vertical stress regions
#691Semiconductor device
#692Methods and apparatus for an improved integrated circuit package
#693Power module package and method of manufacturing the same
#694Method of manufacturing semiconductor device
#695Semiconductor module
#696Methods for producing a 3D semiconductor memory device and structure
#697Liquid compression molding encapsulants
#698Release film and method of manufacturing release film
#699LED package with multiple element light source and encapsulant having curved and/or planar surfaces
#700Packaged die and RDL with bonding structures therebetween
#701Plurality of leads having a two stage recess
#702Semiconductor device and method of manufacture
#703Package-on-package (PoP) semiconductor package and electronic system including the same
#704Land structure for semiconductor package and method therefor
#705Semiconductor device with frame having arms
#7063D semiconductor device and structure with multiple isolation layers
#707Logic drive based on standard commodity FPGA IC chips using non-volatile memory cells
#708Light emitting device and backlight including the light emitting device
#709Semiconductor device
#710Terminal member made of plurality of metal layers between two heat sinks
#711Iintegrated fan-out packages with embedded heat dissipation structure
#712Semiconductor device and method of making a wafer-level chip-scale package
#713Method of manufacturing package-on-package device and bonding apparatus used therein
#714Packages with Si-substrate-free interposer and method forming same
#715Semiconductor package with a plurality of chips having a groove in the encapsulation
#716Semiconductor device and manufacturing method of the same
#717Chip on Package Structure and Method
#718Semiconductor structure and manufacturing method thereof
#719Package with metal-insulator-metal capacitor and method of manufacturing the same
#720Packaging mechanisms for dies with different sizes of connectors
#721SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF
#722Package structure and method
#723Cutting a leadframe assembly with a plurality of punching tools
#724Semiconductor device
#725Packaged semiconductor devices and methods of packaging semiconductor devices
#726Thermally conductive structure for heat dissipation in semiconductor packages
#727Resin molding, surface mounted light emitting apparatus and methods for manufacturing the same
#7283D SEMICONDUCTOR DEVICE AND STRUCTURE
#729Opening in the pad for bonding integrated passive device in InFO package
#730Light-emitting device and backlight including light-emitting device
#731Modified leadframe design with adhesive overflow recesses
#732Semiconductor device and method for manufacturing the same
#733Semiconductor chip-encapsulating resin composition containing epoxy resin, and semiconductor package including a cured product of the semiconductor-chip-encapsulating resin composition
#734Stacked-die MEMS resonator
#735Stress relief encapsulation for flexible hybrid electronics
#736Method of manufacturing a package-on-package type semiconductor package
#737Semiconductor device package and method for manufacturing the same
#738Semiconductor device
#739Method for forming a semiconductor device having TSV formed through a silicon interposer and a second silicon substrate with cavity covering a second die
#740Chip package assembly and method for manufacturing the same
#741Stacked memory device, a system including the same and an associated method
#742Optical semiconductor element mounting package and optical semiconductor device using the same
#743Semiconductor package with protected sidewall and method of forming the same
#744Method for processing a 3D integrated circuit and structure
#745Packaged electronic device having integrated antenna and locking structure
#746LED assembly for omnidirectional light applications
#747Fan-out semiconductor package
#748Flat no-lead package with surface mounted structure
#749Semiconductor module
#750SEMICONDUCTOR PACKAGE WITH WETTABLE FLANK
#751Semiconductor devices having through electrodes and methods for fabricating the same
#752Power module semiconductor device and inverter equipment, and fabrication method of the power module semiconductor device, and metallic mold
#753Cavity packages
#754Methods for producing a 3D semiconductor memory device and structure
#7553D semiconductor device and structure with memory
#7563D semiconductor device and structure with memory
#7573D semiconductor device and structure with NAND logic
#7583D semiconductor memory device and structure
#759Packaging photon building blocks with top side connections and interconnect structure
#7603D device and devices with bonding
#761Sawing underfill in packaging processes
#762Methods of manufacturing a photovoltaic module
#763Package with interlocking leads and manufacturing the same
#764Microelectronic package having electromagnetic interference shielding
#765Semiconductor device
#766Non-insulated power module
#767Side-solderable leadless package
#768Semiconductor device with thin redistribution layers
#769Semiconductor package and method
#770Flat no-lead package with surface mounted structure
#771Method of forming a molded substrate electronic package and structure
#772Low warpage high density trench capacitor
#7733D integrated circuit device and structure with hybrid bonding
#774Semiconductor device comprising PN junction diode and Schottky barrier diode
#775Interconnect structures, packaged semiconductor devices, and methods of packaging semiconductor devices
#776Package structure and method of forming the same
#777Semiconductor device and method
#778Package structure
#779Sensing component encapsulated by an encapsulation layer with a roughness surface having a hollow region
#780Optical chips mounted on a deformed carrier
#781Multi-chip semiconductor package
#782Semiconductor assemblies using edge stacking and methods of manufacturing the same
#783Packaging of a semiconductor device with a plurality of leads
#784Semiconductor structure having an anti-arcing pattern disposed on a passivation layer and method of fabricating the semiconductor structure
#785Electronic package for integrated circuits and related methods
#786Printed circuit board
#787Semiconductor package structure
#788Chip package, method of forming a chip package and method of forming an electrical contact
#789Semiconductor device and manufacturing method thereof
#790Semiconductor package having wafer-level active die and external die mount
#791Semiconductor module including semiconductor package and semiconductor package
#792Semiconductor device and method of manufacture
#793Semiconductor device with sealed semiconductor chip
#794Sawn leadless package having wettable flank leads
#795High-frequency module
#796Semiconductor device and method of manufacturing the same
#797Illumination device
#798Single-package wireless communication device
#799Semiconductor package for thermal dissipation
#800Sawing underfill in packaging processes
#801Pad design for reliability enhancement in packages
#802LED assembly with omnidirectional light field
#803Power amplifier systems with control interface and bias circuit
#804Package-on-package assembly with wire bonds to encapsulation surface
#805Semiconductor device with electromagnetic interference film and method of manufacture
#806Method of forming a packaged semiconductor device having enhanced wettable flank and structure
#807Leadframe package with side solder ball contact and method of manufacturing
#808Surface treatment method and apparatus for semiconductor packaging
#809Dual step laser processing of an encapsulant of a semiconductor chip package
#810Memory device comprising programmable command-and-address and/or data interfaces
#811Methods related to metallization of ceramic substrates for shielding applications
#812Flat lead package formation method
#813Electronic device with three dimensional thermal pad
#814Electronic device with top side pin array and manufacturing method thereof
#815Stacking integrated circuits containing serializer and deserializer blocks using through
#816Microelectronic packages with high integration microelectronic dice stack
#817Package-on-package assembly with wire bond vias
#818Stacked dies electrically connected to a package substrate by lead terminals
#819Integrated circuit package pad and methods of forming
#820Switching device and electronic circuit
#821Light emitting device
#822Light-emitting apparatus
#823EMI shielding for flip chip package with exposed die backside
#824Fan-out wafer level package structure
#825Electronic device package and fabricating method thereof
#826Thermal interface material having defined thermal, mechanical and electric properties
#827Wafer-level stack chip package and method of manufacturing the same
#828Package structure with reinforcement structures in a redistribution circuit structure and manufacturing method thereof
#829METHOD OF FORMING A PACKAGED SEMICONDUCTOR DEVICE USING GANGED CONDUCTIVE CONNECTIVE ASSEMBLY AND STRUCTURE
#830Electronic device module and method of manufacturing electronic device module
#831MAGNETICALLY COUPLED GALVANICALLY ISOLATED COMMUNICATION USING LEAD FRAME
#832Method for interconnecting stacked semiconductor devices
#833Semiconductor device encapsulated by molding material attached to redestribution layer
#834Method of making leadframe strip
#835Semiconductor devices comprising getter layers and methods of making and using the same
#836Integrated circuit packages and methods of forming same
#837Light emitting device
#838Chip package structure with seal ring structure
#839Method of manufacturing semiconductor package structure
#840Semiconductor package with a cavity in a die pad for reducing voids in the solder
#841Electronic control device
#842Method of manufacturing package structure
#843Light emitting device
#844LIGHT EMITTING STRUCTURE
#845Stair-stacked dice device in a system in package, and methods of making same
#846Thermal interface material having different thicknesses in packages
#847Semiconductor device and method of forming microelectromechanical systems (MEMS) package
#848EMI shielding for flip chip package with exposed die backside
#849Microelectronic structures having multiple microelectronic devices connected with a microelectronic bridge embedded in a microelectronic substrate
#850Pad design for reliability enhancement in packages
#851Chip packages and methods for forming the same
#852Method for manufacturing a semiconductor device having a semiconductor element mounted on a lead frame
#853Manufacturing of integrated circuit resonator
#854Semiconductor package with layer structures, antenna layer and electronic component
#855Packages with Si-substrate-free interposer and method forming same
#856Light-emitting package
#857Semiconductor package
#858Semiconductor package and method of forming the same
#859Fan-out package and methods of forming thereof
#860Lead frame and method of fabricating the same
#861Die-on-interposer assembly with dam structure and method of manufacturing the same
#862High voltage monolithic LED chip with improved reliability
#863Compact opto-electronic modules and fabrication methods for such modules
#8643D integrated circuit
#865Multi-chip modules including stacked semiconductor dice
#866Via structure for packaging and a method of forming
#867LEADLESS SEMICONDUCTOR PACKAGES, LEADFRAMES THEREFOR, AND METHODS OF MAKING
#868Package with lead frame with improved lead design for discrete electrical components and manufacturing the same
#869Radio frequency module
#870Image sensing apparatus
#871METHODS AND APPARATUS FOR PASSIVE ATTACHMENT OF COMPONENTS FOR INTEGRATED CIRCUITS
#872Method to form a 3D integrated circuit
#873Protective layer for contact pads in fan-out interconnect structure and method of forming same
#874Integrated fan-out package structures with recesses in molding compound
#875Semiconductor package for reducing stress to redistribution via
#876Electrical interconnect bridge
#877Semiconductor device package
#878Formation of conductive connection tracks in package mold body using electroless plating
#879Package-on-package structure
#880Low cost package warpage solution
#881Interconnect structures and methods of forming same
#882Semiconductor device with through-mold via
#883Electronic component package and method for manufacturing the same
#884Semiconductor device and method of forming embedded wafer level chip scale packages
#885Chip packages and methods for forming the same
#886Semiconductor device with redistribution layers formed utilizing dummy substrates
#887Method for fabricating electronic package
#888Device and package structure and method of forming the same
#8893D SEMICONDUCTOR DEVICE AND STRUCTURE
#890Semiconductor device having an embedded conductive layer for power/ground planes in Fo-eWLB
#891EMBEDDED-BRIDGE SUBSTRATE CONNECTORS AND METHODS OF ASSEMBLING SAME
#892Method of fabricating semiconductor package
#893Package with passive devices and method of forming the same
#894Fan-out interconnect structure and method for forming same
#895Semiconductor device and method of manufacturing the same
#896Connecting electronic components to substrates
#897Plurality of transistor packages with exposed source and drain contacts mounted on a carrier
#898Printed circuit board
#899Stiffener package and method of fabricating stiffener package
#900Method for Embedding a Component in a Printed Circuit Board