Leadframe-based semiconductor package having arched bend in a supporting bar and leadframe for the package

Integrated circuit packaging system with isolated pads and method of manufacture thereof

COL (Chip-On-Lead) multi-chip package

Semiconductor device having electrical devices mounted to IPD structure and method for shielding electromagnetic interference

Semiconductor device and method of connecting a shielding layer to ground through conductive vias

Semiconductor device and method of forming shielding layer grounded through metal pillars formed in peripheral region of the semiconductor

Semiconductor device and method of shielding semiconductor die from inter-device interference

Light-emitting apparatus package, light-emitting apparatus, backlight apparatus, and display apparatus

Light emitting device

Techniques for arranging solder balls and forming bumps

Techniques for arranging solder balls and forming bumps

Method and system for composite bond wires

METHOD OF CUTTING ADHESIVE FILM ON A SINGULATED WAFER BACKSIDE

METHOD OF FABRICATING SEMICONDUCTOR CHIP PACKAGE, SEMICONDUCTOR WAFER, AND METHOD OF SAWING THE SEMICONDUCTOR WAFER

Method of forming a leaded molded array package

FLIP CHIP PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Method for manufacturing a semiconductor device

LIGHT SOURCE MODULE, RELATED LIGHT BAR AND RELATED LIQUID CRYSTAL DISPLAY

High efficiency lighting device including one or more solid state light emitters, and method of lighting

CHIP CAPACITOR PRECURSORS, PACKAGED SEMICONDUCTORS, AND ASSEMBLY METHOD FOR CONVERTING THE PRECURSORS TO CAPACITORS

Arrangements for a current sensing circuit and integrated current sensor

Phosphor composition and method for producing the same, and light-emitting device using the same

Semiconductor memory device and manufacturing method thereof

Semiconductor device, and manufacturing method therefor

Substrate for semiconductor package

Method for fabricating a module including a sintered joint

Packaging substrate and method for fabricating the same

SEMICONDUCTOR DEVICE

CHIP PACKAGE CARRIER AND FABRICATION METHOD THEREOF

Semiconductor device

MOLDED SEMICONDUCTOR DEVICE

Semiconductor device and manufacturing method therefor

Stacked structure of integrated circuits having space elements

Package-on-package system with heat spreader

LEAD FRAME AND SEMICONDUCTOR DEVICE UTILIZING THE SAME

Flip-chip package with fan-out WLCSP

TWO-WAY HEAT EXTRACTION FROM PACKAGED SEMICONDUCTOR CHIPS

Four mosfet full bridge module

Semiconductor package system with cut multiple lead pads

Conductive clip for semiconductor device package

Lead Frame and Chip Package Structure and Method for Fabricating the Same

Leadframe having delamination resistant die pad

Methods of making an electronic component package and semiconductor chip packages

Semiconductor device and method of forming holes in substrate to interconnect top shield and ground shield

Semiconductor device and method of forming through vias with reflowed conductive material

Semiconductor device and method of forming double-sided through vias in saw streets

Semiconductor device and method of forming embedded passive circuit elements interconnected to through hole vias

LED PACKAGE AND METHOD OF MANUFACTURING THE SAME

CARD TYPE MEMORY PACKAGE

Circuit board process

Sensor chip, detection device and method of manufacturing detection device

Semiconductor chip and method for fabricating the same

METHOD OF RESIN ENCAPSULATION MOLDING FOR ELECTRONIC PART

Method of manufacturing a semiconductor device and molding die

Method of manufacturing a semiconductor device

Semiconductor package having through-hole vias on saw streets formed with partial saw

Semiconductor package having through-hole vias on saw streets formed with partial saw

Semiconductor package having through-hole vias on saw streets formed with partial saw

Semiconductor device and a semiconductor device manufacturing method

Optical device and production method thereof

Solid-state imaging device

Warm-white light-emitting diode and its phosphor powder

Low Inductance Ball Grid Array Device Having Chip Bumps on Substrate Vias

Semiconductor device and method of manufacturing a semiconductor device

Peel-resistant semiconductor device with improved connector density, and method of manufacturing the same

SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE USING THE SAME

Wirebondless wafer level package with plated bumps and interconnects

Semiconductor apparatus having a two-side heat radiation structure

HERMETIC SEALING OF MICRO DEVICES

Circuit board, lead frame, semiconductor device, and method for fabricating the same

Structure and manufacturing method of chip scale package

Semiconductor device

Semiconductor package and method for manufacturing the same

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

System and method for stacking a plurality of electrically coupled semiconductor chips with a conductive pin

Integrated circuit package system with shield and tie bar

PACKAGING STRUCTURE OF LIGHT EMITTING DIODE

Wafer Leveling-Bonding System Using Disposable Foils

Semiconductor package with a chip on a support plate

Semiconductor device and method of fabrication thereof

HYBRID ELECTRONIC DEVICE INCLUDING SEMICONDUCTOR CHIP AND FUEL CELL, METHOD OF FABRICATING THE SAME AND SYSTEM HAVING THE SAME

Silver-coated ball and method for manufacturing same

SIALON-BASED OXYNITRIDE PHOSPHOR AND PRODUCTION METHOD THEREOF

Integrated circuit package having integrated faraday shield

SEMICONDUCTOR PACKAGE, MOUNTING CIRCUIT BOARD, AND MOUNTING STRUCTURE

Thermally Enhanced Package with Embedded Metal Slug and Patterned Circuitry

Nitride phosphor and production process thereof, and light emitting device

Semiconductor package featuring flip-chip die sandwiched between metal layers

Semiconductor chip package structure

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE

Semiconductor package, method for manufacturing a semiconductor package, an electronic device, method for manufacturing an electronic device

Package structure and method

Semiconductor multi-package module including tape substrate land grid array package stacked over ball grid array package

OPTICAL SEMICONDUCTOR DEVICE

Semiconductor Device and a Method of Manufacturing the Same

Lead frame manufactured from low-priced material and not requiring strict process control, semiconductor package including the same, and method of manufacturing the lead frame and the semiconductor package

QFN Semiconductor package

Semiconductor chip package assembly with deflection- resistant leadfingers

Semiconductor device and method

Lead-on-chip semiconductor package and leadframe for the package

Semiconductor device and method of conforming conductive vias between insulating layers in saw streets

Light-emitting diode chip package body and method for manufacturing same

Apparatus and system for miniature surface mount devices

Techniques for arranging solder balls and forming bumps

Integrated multi-axis micromachined inertial sensing unit and method of fabrication

Method of fabricating chip package

Thermoplastic-thermosetting composite and method for bonding a thermoplastic material to a thermosetting material

LIGHT EMITTING DEVICE AND A MANUFACTURING METHOD THEREOF

Module

Semiconductor device package with internal device protection

Resin sealing structure for electronic component and resin sealing method for electronic component

Semiconductor package having stepwise depression in substrate

Semiconductor device

Semi-finished package and method for making a package

Printed circuit board and method thereof and a solder ball land and method thereof

Semiconductor device and method of fabrication

Packaged electronic devices with face-up die having TSV connection to leads and die pad

STACKED TYPE CHIP PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME

Stacked type chip package structure including a chip package and a chip that are stacked on a lead frame

SEMICONDUCTOR DIE PACKAGE INCLUDING DIE STACKED ON PREMOLDED SUBSTRATE INCLUDING DIE

Low temperature co-fired ceramic (LTCC) tape compositions, light-emitting diode (LED) modules, lighting devices and methods of forming thereof

Molded chip fabrication method and apparatus

Led module and method of manufacturing the same

LIGHT EMITTING DIODE AND PACKAGE METHOD THEREOF

Semiconductor light-emitting device

Methods for reducing stress in microelectronic devices and microelectronic devices formed using such methods

Stacking semiconductor device and production method thereof

ILLUMINATION DEVICE AND INPUT UNIT WITH ILLUMINATION DEVICE

Circuit arrangement having two semiconductor switching elements and one freewheeling element

Semiconductor component with improved contact pad and method for forming the same

High density memory device manufacturing using isolated step pads

Integrated circuit package on package system

Display device and manufacturing method of the same

Bond wire loop for high speed noise isolation

Multi-chip discrete devices in semiconductor packages

Semiconductor device and method

Semiconductor device including offset bonding pad and inspection method therefor

OPTO-ELECTRONIC PACKAGE STRUCTURE HAVING SILICON-SUBSTRATE AND METHOD OF FORMING THE SAME

CHIP PACKAGE STRUCTURE AND METHOD OF MAKING THE SAME

White LED lamp and backlight using the same, and liquid crystal display device using the backlight

Method of forming an integrated circuit with MM-wave antennas using conventional IC packaging

Semiconductor device

Apparatus for manufacturing semiconductor package for wide lead frame and method of constructing semiconductor package using the same

Apparatus for manufacturing semiconductor package for wide lead frame and method of constructing semiconductor package using the same

Packaged semiconductor device with dual exposed surfaces and method of manufacturing

Controlling flip-chip techniques for concurrent ball bonds in semiconductor devices

Optical module and method of manufacturing thereof

Optical head, optical information recording and reproducing device, and optical information system device

REFLECTIVE MATERIAL AND REFLECTOR FOR LIGHT-EMITTING DIODE

Illuminating device

Phosphor, process for producing the same, and luminescent device

Method of manufacturing an integrated circuit

Plastic ball grid array ruggedization

Low voltage drop and high thermal performance ball grid array package

3-D stacking of active devices over passive devices

Heat extraction from packaged semiconductor chips, scalable with chip area

Semiconductor device

Electronic circuit device and method for manufacturing same

Structure and manufacturing method of a chip scale package with low fabrication cost, fine pitch and high reliability solder bump

INTEGRATED CIRCUIT PACKAGE AND MANUFACTURING METHOD THEREOF

Semiconductor device and manufacturing method thereof

SEMICONDUCTOR PACKAGE

Compound semiconductor light-emitting device and method for manufacturing the same

Method for making light emitting diode chip package

Optoelectronic semiconductor component

Circuit board and manufacturing method thereof

Hidden plating traces

Method for manufacturing semiconductor device

Light source unit

Image sensor package and camera module having same

Semiconductor package with mechanical stress isolation of semiconductor die subassembly

Power semiconductor module with pressure element and method for fabricating a power semiconductor module with a pressure element

Chip package

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Semiconductor module

Semiconductor device and method of forming vertical interconnect structure using stud bumps

SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD

SEMICONDUCTOR PACKAGE WITH STACKED DIE ASSEMBLY

SEMICONDUCTOR PACKAGE WITH LEAD INTRUSIONS

Wafer level integration package

High output power light emitting device and package used therefor

Method of manufacturing a wiring board

Thermosetting resin composition and semiconductor sealing medium

Inline integrated circuit system

DFN semiconductor package having reduced electrical resistance

Optical electronic component

Integrated circuit package-on-package system with central bond wires

Semiconductor device and programming method

Stacked, interconnected semiconductor package

Semiconductor device packages with electromagnetic interference shielding

Semiconductor Package, Method for Manufacturing the Same, Semiconductor Module, and Electronic Device

Packaging method of image sensing device

Semiconductor light-emitting device

Power conversion apparatus

Microwave Cure of Semiconductor Devices

METHOD FOR MANUFACTURING STACK CHIP PACKAGE STRUCTURE

Reinforced assembly carrier

Lighting fixture using semiconductor coupled with a reflector having reflective surface with a phosphor material

Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask

Electronic component and method for its production

Semiconductor device and method of manufacturing the same

Multilayer wiring substrate, semiconductor package, and method of manufacturing semiconductor package

Semiconductor device and manufacturing method therefor

Semiconductor device package having features formed by stamping

Leadframe for packaged electronic device with enhanced mold locking capability

Phosphor composition and method for producing the same, and light-emitting device using the same

Circuit Device and Method for Manufacturing the Circuit Device

Interposers, electronic modules, and methods for forming the same

Overmolded electronic module with an integrated electromagnetic shield using SMT shield wall components

Adhesive Composition, Adhesive Sheet and Production Method of Semiconductor Device

Adhesive composition, adhesive sheet and production method of semiconductor device

METHOD OF PRODUCING SEMICONDUCTOR PACKAGES

Method for fabricating an optically pumped semiconductor apparatus

ELECTRONIC COMPONENT MOUNTED STRUCTURE AND METHOD OF MANUFACTURING THE SAME

Integrated circuit tampering protection and reverse engineering prevention coatings and methods

Semiconductor device having wiring formed on wiring board and electric conductor formed in wiring board and conductor chip formed over wiring

Semiconductor device and bonding material

Mounting structure of semiconductor device and electronic apparatus using thereof

Power Device Substrates and Power Device Packages Including the Same

Flat magnetic element and power IC package using the same

Phosphor and production method thereof, and phosphor-containing composition, light emitting device, image display and lighting system

Semiconductor device capable of switching operation modes and operation mode setting method therefor

Semiconductor device and manufacturing method of the same

Methods to Form a Three-Dimensionally Curved Pad in a Substrate and Integrated Circuits Incorporating such a Substrate

Window type BGA semiconductor package and its substrate

Substrate, manufacturing method thereof, method for manufacturing semiconductor device

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method of semiconductor device

Module including a rough solder joint

Enhanced thermal dissipation ball grid array package

Integrated circuit package system with planar interconnect

Semiconductor device package

Power Device Packages Having Thermal Electric Modules Using Peltier Effect and Methods of Fabricating the Same

Integrated circuit package system with rigid locking lead

Mounting structure of semiconductor device and electronic apparatus using same

Stacked integrated circuit package system

Stacked integrated circuit package system

Integrated circuit package system with stacking module

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH REDISTRIBUTION

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH NON-SYMMETRICAL SUPPORT STRUCTURES

Mountable integrated circuit package system with substrate

Mountable integrated circuit package system with exposed external interconnects

Semiconductor device and method for manufacturing semiconductor device

Method and apparatus for a package having multiple stacked die

Complex semiconductor packages and methods of fabricating the same

Lead frame and package of semiconductor device

Semiconductor chip package assembly method and apparatus for countering leadfinger deformation

Leadframe, semiconductor packaging structure and manufacturing method thereof

I/O connection scheme for QFN leadframe and package structures

INTEGRATED CONDUCTIVE SHIELD FOR MICROELECTRONIC DEVICE ASSEMBLIES AND ASSOCIATED METHODS

Through hole vias at saw streets including protrusions or recesses for interconnection

Resin sheet for encapsulating optical semiconductor element and optical semiconductor device

Semiconductor light emitting device and semiconductor light emitting unit

GaN based semiconductor light-emitting device and method for producing same

METHOD AND TOOL FOR REPOSITIONING SOLDER FILL HEAD

Semiconductor device capable of switching operation modes

Method for mounting semiconductor device

Method of manufacturing wiring substrate

Methods for a multiple die integrated circuit package

Method for manufacturing microelectronic devices

Method for manufacturing package structure of optical device

LED unit with interlocking legs

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Semiconductor device and data processor

Fluorescent substance, process for producing the same, and luminescent device

LED light source and method for adjusting chromaticity of LED light source

Phosphor and manufacturing method therefore, and light emission device using the phosphor

Integrated circuit package system with stacking module

Integrated circuit package system for stackable devices

Integrated circuit package system with support structure for die overhang

Electronic device including a carrier and a semiconductor chip attached to the carrier and manufacturing thereof

Window ball grid array package

Semiconductor package having substrate ID code and its fabricating method

Microelectronic devices

Semiconductor device packages and assemblies

Ball grid array package system

THERMALLY-ENHANCED MULTI-HOLE SEMICONDUCTOR PACKAGE

Semiconductor device

PACKAGE-ON-PACKAGE SEMICONDUCTOR STRUCTURE

IC PACKAGE WITH WIREBOND AND FLIPCHIP INTERCONNECTS ON THE SAME DIE WITH THROUGH WAFER VIA

Integrated circuit packaging system with package-in-package and method of manufacture thereof

Semiconductor memory card and semiconductor memory device

Integrated circuit package system with step mold recess

IC PACKAGE HAVING REDUCED THICKNESS

Method of making and designing lead frames for semiconductor packages

COL SEMICONDUCTOR PACKAGE

Semiconductor chip package

Semiconductor package having a bridged plate interconnection

Semiconductor chip package

Apparatus and method for series connection of two die or chips in single electronics package

Integrated circuit package system with isloated leads

Chip package structure and the method thereof with adhering the chips to a frame and forming UBM layers

Semiconductor device and manufacturing method of the same

Semiconductor device and method of forming UBM fixed relative to interconnect structure for alignment of semiconductor die

SEMICONDUCTOR DEVICE WITH CAPACITOR

Light emitting apparatus and display apparatus having the same

LED assembly incorporating a structure for preventing solder contamination when soldering electrode leads thereof together

Method of manufacturing wiring substrate and method of manufacturing semiconductor device

Dual flat non-leaded semiconductor package

Thin quad flat package with no leads (QFN) fabrication methods