212716 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of package parts other than the semiconductor or other solid state devices to be connected Encapsulation
Rigid-flexible printed circuit board manufacturing method for package on package
#10802Electric power conversion apparatus
#10803Nitride phosphor and production process thereof, and light emitting device
#10804Adhesive Film for Semiconductor and Semiconductor Device Therewith
#10805Chip structure and stacked chip package as well as method for manufacturing chip structures
#10806Semiconductor device and manufacturing method thereof
#10807Semiconductor device including adhesive covered element
#10808Flip chip package
#10809Semiconductor package and multi-chip package using the same
#10810Semiconductor device with integrated passive circuit and method of making the same using sacrificial substrate
#10811SEMICONDUCTOR CHIP PACKAGE STRUCTURE FOR ACHIEVING FACE-UP ELECTRICAL CONNECTION WITHOUT USING A WIRE-BONDING PROCESS AND METHOD FOR MAKING THE SAME
#10812Semiconductor die package including embedded flip chip
#10813Semiconductor die package including multiple semiconductor dice
#10814System for solder ball inner stacking module connection
#10815Semiconductor package with penetrable encapsulant joining semiconductor die and method thereof
#10816Integrated circuit packaging system with etched ring and die paddle and method of manufacture thereof
#10817Multi-chips package structure and the method thereof
#10818Advanced quad flat no lead chip package having a protective layer to enhance surface mounting and manufacturing methods thereof
#10819Advanced quad flat no lead chip package having marking and corner lead features and manufacturing methods thereof
#10820SEMICONDUCTOR CHIP PACKAGE HAVING GROUND AND POWER REGIONS AND MANUFACTURING METHODS THEREOF
#10821Semiconductor package having a cavity structure
#10822Stress Mitigation in Packaged Microchips
#10823Leadframe package with dual lead configurations
#10824Semiconductor Device
#10825Semiconductor die package including IC driver and bridge
#10826Integrated circuit package system with integration port
#10827Semiconductor package structure, lead frame and conductive assembly for the same
#10828Housing body and method for production thereof
#10829Light emitting device
#10830LIGHT EMITTING DIODE PACKAGE AND METHOD OF MANUFACTURING THE SAME
#10831Light emitting diode package structure and method for fabricating the same
#10832Interconnecting a chip and a substrate by bonding pure metal bumps and pure metal spots
#10833LED chip package structure in order to prevent the light-emitting efficiency of fluorescent powder from decreasing due to high temperature and method for making the same
#10834NON-PLANAR SUBSTRATE STRIP AND SEMICONDUCTOR PACKAGING METHOD UTILIZING THE SUBSTRATE STRIP
#10835Semiconductor device
#10836Method of fabricating semiconductor components with through interconnects
#10837Semiconductor device and method of manufacturing the same
#10838Semiconductor package having semiconductor die with internal vertical interconnect structure and method therefor
#10839Semiconductor device and manufacturing method thereof
#10840Semiconductor module molded by resin with heat radiation plate opened outside from mold
#10841Substrate and semiconductor package for lessening warpage
#10842Semiconductor device and fabricating method thereof
#10843Wafer level die integration and method therefor
#10844Integrated circuit with step molded inner stacking module package in package system
#10845Integrated circuit package system with stacked devices
#10846Optical semiconductor device having pre-molded leadframe with window and method therefor
#10847Chip package with a dam structure on a die pad
#10848Semiconductor die package including exposed connections
#10849Semiconductor package with mold lock vent
#10850Double-faced electrode package and its manufacturing method
#10851Semiconductor device with wire-bonding on multi-zigzag fingers
#10852Semiconductor device
#10853Semiconductor device having a gate contact on one surface electrically connected to a gate bus on an opposing surface
#10854Light emitting diode package structure and manufacturing method therefor
#10855Optical semiconductor device and method of manufacturing optical semiconductor device
#10856Semiconductor light emitting devices including a luminescent conversion element and methods for packaging the same
#10857Semiconductor component with regions electrically insulated from one another and method for making a semiconductor component
#10858Lead frame isolation using laser technology
#10859Method of a package on package packaging
#10860Packaging an integrated circuit die using compression molding
#10861Method of manufacturing a semiconductor device
#10862Adhesive Sheet for Dicing and Die Bonding
#10863Wafer-level integrated circuit package with top and bottom side electrical connections
#10864Semiconductor device
#10865SEMICONDUCTOR DEVICE
#10866Semiconductor package having a bridge plate connection
#10867SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
#10868Storage medium and semiconductor package
#10869Multi-chip package structure and method of fabricating the same
#10870Power device package and method of fabricating the same
#10871Power device package and method of fabricating the same
#10872Lead frame based semiconductor package and a method of manufacturing the same
#10873Semiconductor device, electronic device, and manufacturing method of the same
#10874SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
#10875Light illumination during wafer dicing to prevent aluminum corrosion
#10876Package having exposed integrated circuit device
#10877Manufacturing method of resin-sealed semiconductor device
#10878Board on chip package and method of manufacturing the same
#10879Packaging method of image sensing device
#10880Fabrication method of semiconductor device
#10881Power module
#10882Integrated circuit nanotube-based subsrate
#10883Electrical module
#10884Light unit, liquid crystal display having the same, and method of manufacturing the same
#10885Semiconductor devices having a resin with warpage compensated surfaces
#10886Integrated circuit package substrate having configurable bond pads
#10887Semiconductor device
#10888Semiconductor device
#10889Carbon nanotube-based conductive connections for integrated circuit devices
#10890Semiconductor device and a method of manufacturing the same
#10891Stacked solder balls for integrated circuit device packaging and assembly
#10892Integrated circuit package system with overhang film
#10893Thermal interface material design for enhanced thermal performance and improved package structural integrity
#10894Semiconductor device
#10895Integrated circuit package system with external interconnects within a die platform
#10896SEMICONDUCTOR PACKAGE ACCOMPLISHING FAN-OUT STRUCTURE THROUGH WIRE BONDING
#10897Resin sealed semiconductor device and manufacturing method therefor
#10898Leadframe having mold lock vent
#10899Thermally enhanced molded leadless package
#10900Package system for shielding semiconductor dies from electromagnetic interference
#10901Surface-mounted optoelectronic semiconductor component and method for the production thereof
#10902Device including semiconductor chip and leads coupled to the semiconductor chip and manufacturing thereof
#10903Electronic device substrate and its fabrication method, and electronic device and its fabrication method
#10904DICING DIE-BONDING FILM
#10905METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND ULTRASONIC BONDING APPARATUS
#10906Method for forming lead frame land grid array
#10907Chipstack package and manufacturing method thereof
#10908Method of manufacturing semiconductor device and the semiconductor device
#10909Method of manufacturing semiconductor package
#10910Semiconductor device
#10911ELECTRICAL DEVICE AND METHOD OF MANUFACTURING ELECTRICAL DEVICES USING FILM EMBOSSING TECHNIQUES TO EMBED INTEGRATED CIRCUITS INTO FILM
#10912Integrated circuit package
#10913SEMICONDUCTOR CHIP PACKAGE STRUCTURE FOR ACHIEVING ELECTRICAL CONNECTION WITHOUT USING A WIRE-BONDING PROCESS AND METHOD FOR MAKING THE SAME
#10914Method of forming semiconductor chips, the semiconductor chips so formed and chip-stack package having the same
#10915Semiconductor device having chip mounted on an interposer
#10916Integrated circuit and method
#10917Intermediate Bond Pad for Stacked Semiconductor Chip Package
#10918QUAD FLAT NON-LEADED PACKAGE STRUCTURE
#10919Module including a sintered joint bonding a semiconductor chip to a copper surface
#10920Integrated circuit stacked package precursors and stacked packaged devices and systems therefrom
#10921Package structure of compound semiconductor device and fabricating method thereof
#10922ZnO based semiconductor device and its manufacture method
#10923GaN based semiconductor light-emitting device and method for producing same
#10924Mold cleaning sheet and manufacturing method of a semiconductor device using the same
#10925Enhanced Die-Up Ball Grid Array and Method for Making the Same
#10926SEMICONDUCTOR DEVICE FABRICATING METHOD
#10927Wiring substrate for use in semiconductor apparatus, method for fabricating the same, and semiconductor apparatus using the same
#10928Semiconductor package, and method of manufacturing semiconductor package
#10929Boundary acoustic wave element, boundary acoustic wave device, and manufacturing methods for the same
#10930Compression molding method for electronic component and compression molding apparatus employed therefor
#10931Semiconductor device
#10932Semiconductor device and method of manufacturing the same
#10933Semiconductor device and manufacturing method thereof
#10934Integrated circuit package
#10935Semiconductor device and manufacturing method of the same
#10936Semiconductor device and manufacturing method therefor
#10937Lighting device and production method of the same
#10938Chip card for insertion into a holder
#10939Lead Frame Fabrication Method
#10940ADHESIVE FILM FOR SEMICONDUCTOR
#10941Metal-resin-boned structured body and resin-encapsulated semiconductor device, and fabrication method for them
#10942Method of fabricating chip package structure
#10943Semiconductor device singulation method
#10944Method of fabricating substrate
#10945Wiring board for semiconductor devices, semiconductor device, electronic device, and motherboard
#10946Methods for making a starting substrate wafer for semiconductor engineering having wafer through connections
#10947Integrated Circuit and Memory Module
#10948Semiconductor device including wiring and manufacturing method thereof
#10949Semiconductor device having wiring line and manufacturing method thereof
#10950Integrated circuit device and a method of making the integrated circuit device
#10951Panel level methods and systems for packaging integrated circuits with integrated heat sinks
#10952SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME
#10953Semiconductor package and methods of fabricating the same
#10954Hybrid carrier and a method for making the same
#10955MOLDED PACKAGE ASSEMBLY
#10956Folded leadframe multiple die package
#10957Semiconductor device package and method of making a semiconductor device package
#10958Shielded stacked integrated circuit packaging system and method of manufacture thereof
#10959Semiconductor device packages with electromagnetic interference shielding
#10960Semiconductor device packages with electromagnetic interference shielding
#10961Semiconductor device having antenna over thin film integrated circuit
#10962SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
#10963GROUP-III NITRIDE COMPOUND SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREOF, GROUP-III NITRIDE COMPOUND SEMICONDUCTOR LIGHT-EMITTING DEVICE AND PRODUCTION METHOD THEREOF, AND LAMP
#10964LIGHT EMITTING ELEMENT, PRODUCTION METHOD THEREOF, BACKLIGHT UNIT HAVING THE LIGHT EMITTING ELEMENT, AND PRODUCTION METHOD THEREOF
#10965Light emitting diode having grooves to modulate light emission thereof
#10966Sensor ,Sensor Component and Method for Producing a Sensor
#10967Semiconductor device
#10968Semiconductor device and manufacturing method thereof
#10969Method for singulating semiconductor devices
#10970METHOD OF ENCAPSULATING AN ELECTRONIC COMPONENT
#10971SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD OF THE SAME
#10972Electronic device and method of manufacturing same
#10973Apparatus for improved power distribution in wirebond semiconductor packages
#10974Semiconductor device
#10975ELECTRONIC ELEMENT PACKAGING
#10976High temperature operating package and circuit design
#10977LUMINESCENT MATERIAL
#10978FLUORESCENCE EMITTING DEVICE
#10979SEMICONDUCTOR CHIP COMPRESSION MOLDING METHOD AND MOLD FOR COMPRESSION MOLDING
#10980SEMICONDUCTOR DEVICE
#10981FLIP CHIP QUAD FLAT NON-LEADED PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF AND CHIP PACKAGE STRUCTURE
#10982STACK CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
#10983Integrated Circuit, Semiconductor Module and Method for Manufacturing a Semiconductor Module
#10984SEMICONDUCTOR PACKAGE AND A METHOD FOR MANUFACTURING THE SAME
#10985Integrated circuit package system with wafer scale heat slug
#10986Multiphase synchronous buck converter
#10987Wafer Level Chip Scale Packages Including Redistribution Substrates and Methods of Fabricating the Same
#10988Manufacturing process and structure for embedded semiconductor device
#10989Method of manufacturing semiconductor device
#10990Semiconductor package with stacked dice for a buck converter
#10991Semiconductor device and manufacturing method of the same
#10992Wiring device for semiconductor device, composite wiring device for semiconductor device, and resin-sealed semiconductor device
#10993Ultra-Thin Semiconductor Package
#10994Semiconductor device
#10995Method of manufacturing electronic device on leadframe
#10996Light emitting diode package and manufacturing method thereof
#10997Light-emitting diode light source
#10998Semiconductor device
#10999Mounting substrate
#11000Bonding wire for semiconductor device
#11001Block-Molded Semiconductor Device Singulation Methods and Systems
#11002Method for manufacturing electronic device
#11003Power semiconductor devices having integrated inductor
#11004Dual metal stud bumping for flip chip applications
#11005Manufacturing method of semiconductor device
#11006IC PACKAGING PROCESS BY PHOTO-CURING ADHESIVE
#11007Method of making phosphor containing glass plate, method of making light emitting device
#11008Integrated circuit and assembly therewith
#11009Semiconductor package with an antenna and manufacture method thereof
#11010Module with stacked semiconductor devices
#11011Wiring substrate, tape package having the same, and display device having the same
#11012INSULATIVE WIRING BOARD, SEMICONDUCTOR PACKAGE USING THE SAME, AND METHOD FOR PRODUCING THE INSULATIVE WIRING BOARD
#11013Resin-sealed semiconductor device
#11014Semiconductor package apparatus having redistribution layer
#11015Semiconductor package having insulated metal substrate and method of fabricating the same
#11016Electromagnetic shilding structure and manufacture method for multi-chip package module
#11017Method of forming a semiconductor package and structure thereof
#11018SUBSTRATE FOR MOUNTING DEVICE AND METHOD FOR PRODUCING THE SAME, SEMICONDUCTOR MODULE AND METHOD FOR PRODUCING THE SAME, AND PORTABLE APPARATUS PROVIDED WITH THE SAME
#11019IC PACKAGING PROCESS
#11020Method for fabricating a flip chip system in package
#11021Semiconductor module
#11022Light emitting device
#11023Leadless package
#11024Integrated circuit incorporating wire bond inductance
#11025Stacked semiconductor package assembly having hollowed substrate
#11026Semiconductor Die Packages Having Solder-free Connections, Systems Using the Same, and Methods of Making the Same
#11027Flex clip connector for semiconductor device
#11028Integrated circuit package-on-package stacking system and method of manufacture thereof
#11029Semiconductor device and method of manufacturing the same
#11030Semiconductor light-emitting device, method of manufacturing semiconductor light-emitting device, and lamp
#11031Light emitting device package
#11032Light-emitting device with magnetic field
#11033Light emitting device with magnetic field
#11034Light emitting device
#11035Wiring board for semiconductor device
#11036Removable layer manufacturing method
#11037Method of manufacturing a semiconductor device
#11038Semiconductor device having a chip mounting portion and a plurality of suspending leads supporting the chip mounting portion and each suspension lead having a bent portion
#11039Method for forming a die-attach layer during semiconductor packaging processes
#11040Process for producing light-emitting semiconductor device
#11041Combination substrate
#11042Semiconductor device
#11043Integrated circuit package system with heat slug
#11044CIRCUIT BOARD, SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD OF CIRCUIT BOARD
#11045Hybrid integrated circuit device, and method for fabricating the same, and electronic device
#11046Semiconductor device and programming method
#11047Semiconductor module
#11048Module with Flat Construction and Method for Placing Components
#11049Substrate for semiconductor device, resin-sealed semiconductor device, method for manufacturing said substrate for semiconductor device and method for manufacturing said resin-sealed semiconductor device
#11050ELECTRONIC COMPONENT, SEMICONDUCTOR PACKAGE, AND ELECTRONIC DEVICE
#11051Semiconductor package and semiconductor device
#11052Die package including substrate with molded device
#11053Multi-chip package
#11054Flexible contactless wire bonding structure and methodology for semiconductor device
#11055Radio frequency over-molded leadframe package
#11056Method of manufacturing a semiconductor light-emitting device
#11057Wavelength-converting converter material, light-emitting optical component, and method for the production thereof
#11058White light emitting device
#11059IC MODULE, IC INLET, AND IC MOUNTED BODY
#11060Interposer and method for manufacturing interposer
#11061Circuit board ready to slot
#11062Method of manufacturing semiconductor device
#11063Adhesive composition and adhesive sheet
#11064METHOD FOR MANUFACTURING A FLIP CHIP PACKAGE
#11065Semiconductor Device and Method of Forming the Device Using Sacrificial Carrier
#11066Surface light emitting device and polarization light source
#11067Packaged integrated circuits having inductors and methods to form inductors in packaged integrated circuits
#11068Power drive unit including a heat sink and a fastener
#11069Compact inductive power electronics package
#11070Encapsulating resin composition for preapplication, semiconductor device made with the same, and process for producing the same
#11071Method for cutting and molding in small windows to fabricate semiconductor packages
#11072PACKAGED INTEGRATED CIRCUITS HAVING SURFACE MOUNT DEVICES AND METHODS TO FORM PACKAGED INTEGRATED CIRCUITS
#11073Semiconductor package including flip chip controller at bottom of die stack
#11074Mountable integrated circuit package system with intra-stack encapsulation
#11075Integrated circuit package with improved connections
#11076Semiconductor device using lead-free solder as die bonding material and die bonding material not containing lead
#11077Method of manufacturing semiconductor device including mounting and dicing chips
#11078Power semiconductor module
#11079High-power semiconductor die packages with integrated heat-sink capability and methods of manufacturing the same
#11080Semiconductor chip having conductive member for reducing localized voltage drop
#11081SEMICONDUCTOR CHIP PACKAGE
#11082SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE
#11083Lead frame for semiconductor package
#11084Integrated circuit package system with interposer
#11085SENSOR SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
#11086Semiconductor memory device
#11087Etched surface mount islands in a leadframe package
#11088LEAD FRAME DIE ATTACH PADDLES WITH SLOPED WALLS AND BACKSIDE GROOVES SUITABLE FOR LEADLESS PACKAGES
#11089System and apparatus for wafer level integration of components
#11090Leadless package system having external contacts
#11091Integrated circuit package system with lead locking structure
#11092Integrated circuit package system with shielding
#11093Leadframe design for QFN package with top terminal leads
#11094TSOP LEADFRAME STRIP OF MULTIPLY ENCAPSULATED PACKAGES
#11095Semiconductor device and its manufacture
#11096Semiconductor device with optical sensor and method of forming interconnect structure on front and backside of the device
#11097Semiconductor device and method for fabricating semiconductor device
#11098HIGH POWER LIGHT EMITTING DIODE PACKAGE AND MANUFACTURING METHOD THEREOF
#11099White LED, backlight using the same, and liquid crystal display device
#11100Multinary oxynitride phosphor, and light emitting device, image display, illuminating device and phosphor-containing composition using the same, and multinary oxynitride