Manufacturing process of leadframe-based BGA packages

Flip chip package with advanced electrical and thermal properties for high current designs

Method for thin semiconductor packages

Shielding Apparatus and Manufacturing Method Thereof

PLASMA DISPLAY APPARATUS

Carrier body for components or circuits

Integrated circuit package including miniature antenna

Fluorophor and method for production thereof and illuminator

Fluorescent material and light-emitting device

Method of reducing memory card edge roughness by edge coating

METHOD OF REDUCING MEMORY CARD EDGE ROUGHNESS BY PARTICLE BLASTING

FLIP-CHIP MOUNTING BODY AND FLIP-CHIP MOUNTING METHOD

Semiconductor packages having interposers, electronic products employing the same, and methods of manufacturing the same

Semiconductor device and semiconductor memory device

ELECTRONIC APPARATUS AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURING

Ball grid array substrate package and solder pad

Integrated circuit package system with mold lock subassembly

Power semiconductor module

Semiconductor device and methods of manufacturing semiconductor devices

Integrated circuit package system with multiple die

Semiconductor device

Integrated circuit packaging system with base structure device

Integrated circuit package system with leadframe array

Glass cap molding package, manufacturing method thereof and camera module

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

Light emitting diode package with large viewing angle

Wafer-Shaped Measuring Apparatus and Method for Manufacturing the Same

AUTOMOTIVE ELECTRIC/ELECTRONIC PACKAGE

Electronic device

Warpage control using a package carrier assembly

LED multi-chip lighting units and related methods

Integrated circuit support for low profile wire bond

Integrated circuit package system with multiple device units

Stacked dual-die packages, methods of making, and systems incorporating said packages

Integrated circuit packaging system with interposer

Stacked semiconductor chips

Semiconductor device with conductive die attach material

Semiconductor device having decoupling capacitor formed on substrate where semiconductor chip is mounted

Semiconductor device and method of forming interconnect structure in non-active area of wafer

Integrated circuit packaging system with passive components

Semiconductor device including electronic component coupled to a backside of a chip

Tape substrate and semiconductor module for smart card, method of fabricating the same, and smart card

Semiconductor package, apparatus and method for manufacturing the semiconductor package, and electronic device equipped with the semiconductor package

Semiconductor device and manufacturing method of the same

Air cavity package for flip-chip

Method of manufacturing integrated circuit package system with warp-free chip

Integrated circuit package system with under paddle leadfingers

Semiconductor package and manufacturing method thereof

Semiconductor device and method of manufacturing the same

Semiconductor package and method of reducing electromagnetic interference between devices

Semiconductor device having multiple substrates

SEMICONDUCTOR APPARATUS

Solid-state optical device

Light emitting device

LIGHT EMITTING DIODE PACKAGE STRUCTURE

Photodetector with embedded infrared filter

Three dimensional packaging optimized for high frequency circuitry

Light emitting device having silicon-containing composition and method of making same

Electromagnetic shield formation for integrated circuit die package

Method of manufacturing a semiconductor device

Method for fabricating multi-chip stacked package

Manufacturing method of semiconductor device with a mold resin having a mold release agent

Method of manufacturing semiconductor device

Thermally enhanced package structure

BIDIRECTIONAL OPTICAL TRANSMISSION DEVICE

Package, packaging method and substrate thereof for sliding type thin fingerprint sensor

Minimizing the number of external terminals required when compensation is to be provided for signal drop in bond wire of a package in which an integrated circuit is provided

Nitride phosphor and production process thereof, and light emitting device

Semiconductor device, and manufacturing method of semiconductor device

Semiconductor device

Integrated circuit package system with package encapsulation having recess

Semiconductor device with conductive interconnect

Semiconductor device and method for manufacturing the same

SEMICONDUCTOR APPARATUS AND FABRICATION METHOD THEREOF

Semiconductor device with inductor

Semiconductor device with double-sided electrode structure and its manufacturing method

Integrated circuit package system with delamination prevention structure

PACKAGED INTEGRATED CIRCUITS AND METHODS TO FORM A STACKED INTEGRATED CIRCUIT PACKAGE

SEMICONDUCTOR DEVICE

Package for monolithic compound semiconductor (CSC) devices for DC to DC converters

Intergrated circuit packaging with improved die bonding

Integrated circuit package system with dual connectivity

Integrated circuit package system with external interconnects at high density

Integrated circuit package system with leads separated from a die paddle

Integrated circuit package-in-package system with leads

Thermal enhanced upper and dual heat sink exposed molded leadless package

Multi-Chip Stacked Package Structure

Molded semiconductor device including IC-chip covered with conductor member

Integrated shielding process for precision high density module packaging

SENSOR ARRAY HAVING A SUBSTRATE AND A HOUSING, AND METHOD FOR MANUFACTURING A SENSOR ARRAY

PROCESS FOR PRODUCING LIGHT-EMITTING DEVICE AND LIGHT-EMITTING DEVICE

Phosphor and light-emitting device using same

Electronic component package

Multilayer substrate with interconnection vias and method of manufacturing the same

Structural component comprising boron nitride agglomerated powder

Three-Dimensional Memory-Based Three-Dimensional Memory Module

Manufacturing process for a quad flat non-leaded chip package structure

MANUFACTURING PROCESS FOR A QUAD FLAT NON-LEADED CHIP PACKAGE STRUCTURE

Semiconductor connection component

Manufacturing process for a quad flat non-leaded chip package structure

Manufacturing process for a chip package structure

Manufacturing process for a chip package structure

Manufacturing process for a chip package structure

Electronic device having stack-type semiconductor package and method of forming the same

Method for generating low color temperature light and light emitting device adopting the same

Chip module and a fabrication method thereof

Package structure for multiple die stack

Structure of high performance combo chip and processing method

Multi-chip semiconductor device

Semiconductor device and methods of manufacturing semiconductor devices

Semiconductor package with improved size, reliability, warpage prevention, and heat dissipation and method for manufacturing the same

Semiconductor device package structure

Semiconductor package embedded in substrate, system including the same and associated methods

Singulated semiconductor package

Semiconductor device with leadframe including a diffusion barrier

Semiconductor package and method of assembling a semiconductor package

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

METHOD OF FORMING A SEMICONDUCTOR DIE HAVING A SLOPED EDGE FOR RECEIVING AN ELECTRICAL CONNECTOR

White light LED with multiple encapsulation layers

LED chip package structure with high-efficiency light-emitting effect and method of packing the same

Multilayer semiconductor device

Manufacturing process for a Quad Flat Non-leaded chip package structure

SEMICONDUCTOR PACKAGE HAVING A GRID ARRAY OF PIN-ATTACHED BALLS

Method of packaging an integrated circuit die

Method of manufacturing a semiconductor device including plural semiconductor chips

Optoelectronic circuit with a photoreceptor and a laser diode, and module comprising the same

LED and LED lamp

LIGHT-EMITTING DEVICE

Device and connecting method for connecting power-supply terminals to a power-supply bus based on noise intensities

Integrated current sensor

Semiconductor device

Stack-type semiconductor package, method of forming the same and electronic system including the same

SEMICONDUCTOR PACKAGE AND APPARATUS USING THE SAME

Semiconductor device with non-overlapped circuits

MULTIPLE CHIP SEMICONDUCTOR DEVICE

Structure of high performance combo chip and processing method

Stacked chip package with redistribution lines

Semiconductor device and method of manufacturing the same

Nail-shaped pillar for wafer-level chip-scale packaging

Semiconductor device and plural semiconductor elements with suppressed bending

IC package having IC-to-PCB interconnects on the top and bottom of the package substrate

SEMICONDUCTOR DEVICE

Ball grid array package enhanced with a thermal and electrical connector

CO-PACKAGED HIGH-SIDE AND LOW-SIDE NMOSFETS FOR EFFICIENT DC-DC POWER CONVERSION

Integrated Circuit Package with Passive Component

Integrated circuit package system employing an offset stacked configuration

Integrated circuit package-on-package system with anti-mold flash feature

Integrated circuit package-in-package system with side-by-side and offset stacking

Low cost lead frame package and method for forming same

Lead frame, semiconductor device, and method of manufacturing semiconductor device

BONDING-PATTERNED DEVICE AND ELECTRONIC COMPONENT

SEMICONDUCTOR DIE PACKAGE INCLUDING STAND OFF STRUCTURES

Self locking and aligning clip structure for semiconductor die package

THERMALLY ENHANCED THIN SEMICONDUCTOR PACKAGE

APPARATUS TO SAW WAFER AND HAVING NOZZLE TO REMOVE BURRS IN SCRIBE LANES, METHOD OF SAWING WAFER, AND SEMICONDUCTOR PACKAGE FABRICATED BY THE SAME

Semiconductor assemblies and methods of manufacturing such assemblies including forming trenches in a first side of the molding material

SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE

Semiconductor device

Method of manufacturing electronic component package

STRAP ASSEMBLY COMPRISING FUNCTIONAL BLOCK DEPOSITED THEREIN AND METHOD OF MAKING SAME

Semiconductor packaging method

METHOD OF MANUFACTURING SOLID STATE IMAGING DEVICE

HIGH POWER LIGHT EMITTING DEVICE ASSEMBLY WITH ESD PROTECTION ABILITY AND THE METHOD OF MANUFACTURING THE SAME

ADHESIVE FILM FOR SEMICONDUCTOR USE, METAL SHEET LAMINATED WITH ADHESIVE FILM, WIRING CIRCUIT LAMINATED WITH ADHESIVE FILM, AND SEMICONDUCTOR DEVICE USING SAME, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

Semiconductor device

Semiconductor device having a semiconductor chip mounted on an insulator film and coupled with a wiring layer, and method for manufacturing the same

Semiconductor device, substrate and semiconductor device manufacturing method

Package structure and manufacturing method thereof

Semiconductor package having buss-less substrate

Package structure and manufacturing method thereof

Method of Manufacture and Identification of Semiconductor Chip Marked For Identification with Internal Marking Indicia and Protection Thereof by Non-black Layer and Device Produced Thereby

Semiconductor package structure

STACK PACKAGE AND METHOD OF FABRICATING THE SAME

LEAD FRAME STRUCTURE

Semiconductor chip stack-type package and method of fabricating the same

Multi-chip module package

Semiconductor component

Lead frame with non-conductive connective bar

Electronic component with buffer layer

Method of manufacturing semiconductor device with electrode for external connection and semiconductor device obtained by means of said method

Semiconductor device and method of manufacturing the same

Resin molding, surface mounted light emitting apparatus and methods for manufacturing the same

Semiconductor light emitting device and semiconductor light emitting apparatus

LIGHT EMITTING DIODE AND OUTDOOR ILLUMINATION DEVICE HAVING THE SAME

Solid state lighting component

Pressure sensor and method for manufacturing the same

Method for producing shock and tamper resistant microelectronic devices

PACKAGING METHOD INVOLVING REARRANGEMENT OF DICE

Solid state imaging device and manufacturing method thereof

Planar magnetic device and power supply IC package using same

Multi-substrate region-based package and method for fabricating the same

Semiconductor element and semiconductor device

Microelectronic package

Semiconductor chip package, electronic device including the semiconductor chip package and methods of fabricating the electronic device

Carrier substrate and integrated circuit

Multidirectional Semiconductor Device Package Thermal Enhancement Systems and Methods

Semiconductor device including a first land on the wiring substrate and a second land on the sealing portion

Stacked microelectronic devices and methods for manufacturing stacked microelectronic devices

Semiconductor component having maximized bonding areas of electrically conductive members connected to semiconductor device and connected to leadframe and method of producing

Lead frame, semiconductor device, method of manufacturing the lead frame, and method of manufacturing the semiconductor device

SEMICONDUCTOR PACKAGE STRUCTURE AND LEADFRAME THEREOF

DOUBLE SIDED INTEGRATED PROCESSING AND SENSING CHIP

Power semiconductor device

Light emitting element

Member for semiconductor light emitting device and method for manufacturing such member, and semiconductor light emitting device using such member

PACKAGED INTEGRATED CIRCUITS AND METHODS TO FORM A PACKAGED INTEGRATED CIRCUIT

Method of manufacturing an integrated circuit module

System for the Manufacture of Electronic Assemblies Without Solder

Package-based filtering and matching solutions

Cascode current sensor for discrete power semiconductor devices

WHITE LED DEVICE COMPRISING DUAL-MOLD AND MANUFACTURING METHOD FOR THE SAME

Package and the method for making the same, and a stacked package

Packaged integrated circuit devices with through-body conductive vias, and methods of making same

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor device including a semiconductor chip which is mounted spaning a plurality of wiring boards and manufacturing method thereof

Power semiconductor module

Method for fabricating a semiconductor and semiconductor package

Packaging substrate and application thereof

Semiconductor package having buried post in encapsulant and method of manufacturing the same

Leadframe-based semiconductor package

SEMICONDUCTOR DEVICE

Circuit member, manufacturing method for circuit members, semiconductor device, and surface lamination structure for circuit member

Thermally enhanced ball grid array package formed in strip with one-piece die-attached exposed heat spreader

Semiconductor device with semiconductor chip and method for producing it

Heat slug and semiconductor package

Semiconductor device

SEMICONDUCTOR LIGHT EMITTING DEVICES WITH SEPARATED WAVELENGTH CONVERSION MATERIALS AND METHODS OF FORMING THE SAME

Semiconductor light emitting devices with applied wavelength conversion materials

CHIP PACKAGE AND CHIP PACKAGING PROCESS THEREOF

Substrate and manufacturing method of the same, and semiconductor device and manufacturing method of the same

ELECTRO-OPTICAL CIRCUITRY HAVING INTEGRATED CONNECTOR AND METHODS FOR THE PRODUCTION THEREOF

RF identification device with near-field-coupled antenna

Output control device, and AC/DC power source device, circuit device, LED backlight circuit device, and switching DC/DC converter device each using output control device

COMPLEX OXYNITRIDE PHOSPHOR, LIGHT-EMITTING DEVICE USING SAME, IMAGE DISPLAY, ILLUMINATING DEVICE, PHOSPHOR-CONTAINING COMPOSITION AND COMPLEX OXYNITRIDE

SEMICONDUCTOR DEVICE

Semiconductor device manufacturing method

Semiconductor device and method of providing common voltage bus and wire bondable redistribution

Semiconductor stack package having wiring extension part which has hole for wiring

SEMICONDUCTOR DEVICE

Arrangement of stacked integrated circuit dice having a direct electrical connection

Semiconductor device having a stacked bump to reduce kirkendall voids and or cracks and method of manufacturing

INTEGRATED CIRCUIT

Substrate, substrate fabrication, semiconductor device, and semiconductor device fabrication

Redistributed chip packaging with thermal contact to device backside

SEMICONDUCTOR SUBSTRATES CONNECTED WITH A BALL GRID ARRAY

Integrated Support Structure for Stacked Semiconductors With Overhang

Integrated circuit package system with multiple devices

Lead frame package apparatus and method

SEMICONDUCTOR PACKAGE APPARATUS

TFCC (TM) and SWCC (TM) thermal flex contact carriers

Rearrangement sheet, semiconductor device and method of manufacturing thereof

Method for forming semiconductor package and mold cast used for the same

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Electronic device and method for manufacturing electronic device

Method of fabricating a semiconductor multipackage module including a processor and memory package assemblies

Enclosure including an electrical module

Connector with build-in control unit and its application

Phosphor, light-emitting device using same, image display and illuminating device

White light-emitting lamp, backlight using same, display and illuminating device

Phosphor, phosphor sheet, and manufacturing method therefore, and light emission device using the phosphor

CHIP-TO-CHIP PACKAGE AND PROCESS THEREOF

Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

Electrical connections for multichip modules

Semiconductor device and method for manufacturing the same

Heat extraction from packaged semiconductor chips, scalable with chip area

Semiconductor module

Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods

Stacked integrated circuit leadframe package system

LEAD FRAME, SEMICONDUCTOR PACKAGE, AND STACKED SEMICONDUCTOR PACKAGE HAVING THE SAME

Thin plastic leadless package with exposed metal die paddle

Thin semiconductor die packages and associated systems and methods

SEMICONDUCTOR DIES WITH RECESSES, ASSOCIATED LEADFRAMES, AND ASSOCIATED SYSTEMS AND METHODS

Semiconductor device and method of manufacturing the same

Sensor package

Semiconductor device

Light emitting device and method of manufacturing the same

SUPER THIN SIDE-VIEW LIGHT-EMITTING DIODE (LED) PACKAGE AND FABRICATION METHOD THEREOF

PUNCHED ADHESIVE TAPE FOR SEMICCONDUCTOR, METHOD OF MANUFACTURING LEAD FRAME WITH THE ADHESIVE TAPE, LEAD FRAME WITH THE ADHESIVE TAPE, AND SEMICONDUCTOR DEVICE COMPRISING THE LEAD FRAME

Semiconductor device with offset stacked integrated circuits

Memory card and its manufacturing method

Semiconductor assembly having a housing

Fluorescent substance and process for producing the same, and luminescent element using the same

Integrated circuit package system with triple film spacer having embedded fillers and method of manufacture thereof

Circuit module and electrical component

Semiconductor device and method of manufacturing the same

Semiconductor device having double side electrode structure and method of producing the same

Method of manufacturing a semiconductor apparatus

Method for packaging semiconductor dies having through-silicon vias

Wafer level package structure and fabrication methods

Semiconductor device

Semiconductor device and manufacturing method of the same

QUAD FLAT PACKAGE WITH EXPOSED COMMON ELECTRODE BARS

TAPE CARRIER SUBSTRATE AND SEMICONDUCTOR DEVICE

Method of preparing a sealed light-emitting diode chip

Light emitting device and method of manufacturing the same

Red line emitting complex fluoride phosphors activated with Mn4+

Method of manufacturing printed wiring board