Low profile wire bonded USB device

Electronic assembly manufacturing method

Mold for forming molding member and method of manufacturing LED package using the same

LED DEVICE WITH IMPROVED LIFE PERFORMANCE

Composition of a solder, and method of manufacturing a solder connection

Data storage and stackable configurations

Porcelain enamel substrate for mounting light emitting device and method of manufacturing the same, light emitting device module, illumination device, display unit and traffic signal

Semiconductor unit, and power conversion system and on-vehicle electrical system using the same

DOWNHOLE TOOL

Method of fabricating a power electronic device

Managed Memory Component

METHOD AND LEADFRAME FOR PACKAGING INTEGRATED CIRCUITS

Semiconductor package with leads on a chip having multi-row of bonding pads

ISOLATOR AND METHOD OF MANUFACTURING THE SAME

Infrared proximity sensor package with reduced crosstalk

Integrated circuits with phase change devices

Semiconductor device and automotive AC generator

Low cost high frequency device package and methods

Integrated circuit package system with package integration

Integrated circuit package system with offset stacking and anti-flash structure

Semiconductor device and method of forming integrated passive device module

Semiconductor device

Light emitting diode package with diffuser and method of manufacturing the same

Semiconductor device and power supply device using the same

Method of manufacturing a printed wiring board

Semiconductor device

Circuit board having bypass pad

Fluorescent substance, method for manufacturing the same and image display device

Warm-white semiconductor and its phosphor with red-spectrum garent structure

White light emitting diode and method of manufacturing the same

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH FLIP CHIP

Semiconductor package

Semiconductor device

Method of forming stacked die package

Semiconductor device and method of forming interconnect structure for encapsulated die having pre-applied protective layer

Semiconductor device with resin mold

Controller chip mounted on a memory chip with re-wiring lines

SUBSTRATE FOR HIGH SPEED SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE HAVING THE SAME

Methods and systems for packaging integrated circuits

Integrated circuit package system with interconnect lock

Integrated circuit packaging system with interposer

Mountable integrated circuit package system with mountable integrated circuit die

Semiconductor device and manufacturing method of the same

Semiconductor device

Electronic device

Integrated circuit package system with offset stacking

Leadframe having die attach pad with delamination and crack-arresting features

Integrated circuit package system for shielding electromagnetic interference

Electronic device including an inductor

Semiconductor apparatus

FABRICATING METHODS OF PHOTOELECTRIC DEVICES AND PACKAGE STRUCTURES THEREOF

Light emitting diode

LIGHT REFLECTING MATERIAL, PACKAGE FOR LIGHT EMITTING ELEMENT ACCOMMODATION, LIGHT EMITTING DEVICE AND PROCESS FOR PRODUCING PACKAGE FOR LIGHT EMITTING ELEMENT ACCOMODATION

Semiconductor component

Integrated circuit packaging system with leadframe interposer and method of manufacture thereof

Disguising test pads in a semiconductor package

Semiconductor device and touch sensor device

SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME

Microelectronic imaging units

Interconnection element with plated posts formed on mandrel

Integrated circuit package-on-package stacking system and method of manufacture thereof

Semiconductor device and method of manufacturing the same

Semiconductor wafer level interconnect package utilizing conductive ring and pad for separate voltage supplies and method of making the same

Thermoset polyimides for microelectronic applications

Fabrication method of semiconductor package

Molded Leadless Packages and Assemblies Having Stacked Molded Leadless Packages

CIRCUIT MEMBER, MANUFACTURING METHOD OF THE CIRCUIT MEMBER, AND SEMICONDUCTOR DEVICE INCLUDING THE CIRCUIT MEMBER

Method for attaching a semiconductor die to a leadframe, and a semiconductor device

Chip-stacked package structure with asymmetrical leadframe

Flip-chip leadframe semiconductor package

Lead frame and semiconductor device provided with lead frame

Electronic device

Integrated circuit package-in-package system housing a plurality of stacked and offset integrated circuits and method of manufacture therefor

Embedded package security tamper mesh

Integrated circuit package system with shield

Integrated circuit package system for electromagnetic isolation

Light-emitting diode

THERMAL STABLE TRANSPARENT SILICONE RESIN COMPOSITIONS AND METHODS FOR THEIR PREPARATION AND USE

Method of fabricating light emitting diode package with surface treated resin encapsulant and the package fabricated by the method

Surface mount device

Method of fabricating an interconnection element having conductive posts

Leaded stacked packages having elevated die paddle

Light source apparatus and display apparatus and white resist layer

Touch screen system with light reflection

Light-emitting module, and display unit and lighting unit using the same

Light-emitting device, white light-emitting device, illuminator, and image display

Wafer level package integration and method

Multi-chip stack structure and method for fabricating the same

Chip package

COMBINATION SUBSTRATE

Resin-sealed semiconductor device, manufacturing method thereof, base material for the semiconductor device, and layered and resin-sealed semiconductor device

Semiconductor device

INTEGRATED CIRCUIT PACKAGE-ON-PACKAGE SYSTEM WITH STACKING VIA INTERCONNECT

Integrated circuit package-on-package system with anti-mold flash feature

SEMICONDUCTOR DEVICE AND RESIN ADHESIVE USED TO MANUFACTURE THE SAME

Electronic device having profiled elements extending from planar surfaces

Method of fabricating a semiconductor device having a heat sink with an exposed surface

Semiconductor module with switching components and driver electronics

Semiconductor device and method of forming through hole vias in die extension region around periphery of die

Semiconductor power module package without temperature sensor mounted thereon and method of fabricating the same

Packaged semiconductor device and method of manufacturing the packaged semiconductor device

Semiconductor device having a stacked multi structure that has layered insulated gate-type bipolar transistors

LIGHT EMITTING UNIT

Low fabrication cost, high performance, high reliability chip scale package

Method and apparatus for manufacturing semiconductor module

ASSEMBLING OF DOUBLED-SIDE STACKING PULRAL CHIPS

Manufacturing method for electronic devices

Method for manufacturing a microelectromechanical component, and a microelectromechanical component

Adhesive compostion for die bonding in semiconductor assembly, adhesive film prepared therefrom, dicing die-bonding film prepared therefrom, device package including the same, and associated methods

LED lamp

Circuit device and method of manufacturing the same

Integrated circuit package having reversible ESD protection

SEMICONDUCTOR PACKAGE, ELECTRONIC DEVICE INCLUDING THE SEMICONDUCTOR PACKAGE, AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE

Method of producing multiple semiconductor devices

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME, AND ELECTRONIC DEVICE USING THE SEMICONDUCTOR PACKAGE

Integrated circuit packaging system with carrier and method of manufacture thereof

Adhesive on wire stacked semiconductor package

Semiconductor package and packaging method for balancing top and bottom mold flows from window

Semiconductor power device package having a lead frame-based integrated inductor

Leadframe based flash memory cards

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Molded Sensor Package and Assembly Method

LED PACKAGE MODULE AND MANUFACTURING METHOD THEREOF

LIGHT EMITTING ELEMENT AND METHOD FOR PRODUCING THE SAME

Methods of producing light emitting device with phosphor wavelength conversion

White light emitting diode and method of manufacturing the same

LIGHT EMITTING DIODE PACKAGE, METHOD OF FABRICATING THE SAME AND BACKLIGHT ASSEMBLY INCLUDING THE SAME

Module and manufacturing method thereof

Method of writing and reproducing multimedia service by using tag and apparatus therefor

Semiconductor device

Protected solder ball joints in wafer level chip-scale packaging

Substrate based unmolded package

RESIN-ENCAPSULATED SEMICONDUCTOR DEVICE AND LEAD FRAME, AND METHOD FOR MANUFACTURING THE SAME

Silicate phosphor and white light emitting device including the same

Illuminator with fluorescent substance

Circuit device and method of manufacturing the same

SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE

Power module and method of fabricating the same

Stacked-die package for battery power management

HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS OF USE THEREOF

METHOD OF COMPRESSION-MOLDING ELECTRONIC COMPONENTS AND MOLD

Drop-mold conformable material as an encapsulation for an integrated circuit package system

Integrated circuit package system with package substrate having corner contacts

Semiconductor module

Integrated circuit chip component, multi-chip module, their integration structure, and their fabrication method

MOUNTABLE INTEGRATED CIRCUIT PACKAGE SYSTEM WITH PROTRUSION

Semiconductor chip, method of manufacturing semiconductor chip, and semiconductor device

THERMAL CONDUCTOR LIDS FOR AREA ARRAY PACKAGED MULTI-CHIP MODULES AND METHODS TO DISSIPATE HEAT FROM MULTI-CHIP MODULES

SURFACE MOUNT PACKAGE WITH ENHANCED STRENGTH SOLDER JOINT

SEMICONDUCTOR MODULE AND IMAGE PICKUP APPARATUS

SEMICONDUCTOR MODULE AND IMAGE PICKUP APPARATUS

Semiconductor power module packages with simplified structure and methods of fabricating the same

Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices

PACKAGE-ON-PACKAGE WITH IMPROVED JOINT RELIABILITY

POP (package-on-package) semiconductor device

Power device packages and methods of fabricating the same

LEADFRAME FOR LEADLESS PACKAGE

Integrated circuit package system with insulator over circuitry

CHIP PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

Integrated circuit package-in-package system with wire-in-film encapsulant

POP (package-on-package) device encapsulating soldered joints between external leads

Multi-Terminal Package Assembly For Semiconductor Devices

Back to Back Die Assembly For Semiconductor Devices

Electrical device and method

Optoelectronic device

Light-emitting diode

LUMINESCENT MATERIAL

Substrate for mounting electronic part and electronic part

MANUFACTURING METHOD OF LOW TEMPERATURE CO-FIRED CERAMICS SUBSTRATE

Inertia sensor and inertia detector device

Semiconductor device having through electrode and method of fabricating the same

Semiconductor device and method of manufacturing semiconductor device

Method for removing bubbles from adhesive layer of semiconductor chip package

Light source unit

Cerium and europium doped single crystal phosphors

Phosphor, method for producing same, and light-emitting device

Semiconductor package and mounting method thereof

Fully testable surface mount die package configured for two-sided cooling

SEMICONDUCTOR MODULE AND IMAGE PICKUP APPARATUS

Assemblies and multi-chip modules including stacked semiconductor dice having centrally located, wire bonded bond pads

Semiconductor device manufacturing method comprising a metal pattern and laser modified regions in a cutting region

Integrated circuit package system with package integration

Semiconductor chip package

Self-aligning structures and method for integrated circuits

Clip mount for integrated circuit leadframes

Lead frame structure and applications thereof

Semiconductor device having spacer formed on semiconductor chip connected with wire

SOLID-STATE IMAGE PICKUP DEVICE, PROCESS FOR PRODUCING THE SAME AND ELECTRONIC DEVICE

HIGH LIGHT EXTRACTION EFFICIENCY LIGHT EMITTING DIODE (LED) USING GLASS PACKAGING

Method for manufacturing circuit device

Curable composition and fluorinated cured product

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THEREOF

Semiconductor Package Thermal Performance Enhancement and Method

Interposer and semiconductor device

Semiconductor package

Multipiece apparatus for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages and method of making the same

Structures and methods for stack type semiconductor packaging

Mountable integrated circuit package system with mounting interconnects

Integrated circuit package system with array of external interconnects

Semiconductor packages and methods of fabricating the same

Integrated circuit package with integrated heat sink

SEMICONDUCTOR CHIP PACKAGE HAVING METAL BUMP AND METHOD OF FABRICATING SAME

Integrated circuit package

Reduction of package height in a stacked die configuration

Integrated circuit package system with dual connectivity

SEMICONDUCTOR DEVICE HAVING THROUGH-SILICON VIAS FOR HIGH CURRENT,HIGH FREQUENCY, AND HEAT DISSIPATION

Light source and method of controlling light spectrum of an LED light engine

Wafer-level chip scale package and method for fabricating and using the same

Stack MCP and manufacturing method thereof

High-Density Fine Line Structure And Method Of Manufacturing The Same

Adhesive film composition, associated dicing die bonding film, die package, and associated methods

Assembly comprising a functional device and a resonator and method of making same

DIE-ATTACH MATERIAL OVERFLOW CONTROL FOR DIE PROTECTION IN INTEGRATED CIRCUIT PACKAGES

Wiring board of semiconductor device, semiconductor device, electronic apparatus, mother board, method of manufacturing wiring board of semiconductor device, method of manufacturing mother board and method of manufacturing electronic apparatus

High capacity memory with stacked layers

Device with a plurality of semiconductor chips

Solder-top enhanced semiconductor device for low parasitic impedance packaging

CHIP PACKAGE STRUCTURE AND ITS FABRICATION METHOD

Semiconductor device

SEMICONDUCTOR PACKAGE

Stacked semiconductor package in which semiconductor packages are connected using a connector

Mountable integrated circuit package system with substrate having a conductor-free recess

Stacked package and method of manufacturing the same

Semiconductor package

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND ITS FABRICATION PROCESS

Non-leaded semiconductor package structure

Direct-connect signaling system

Semiconductor structure and method of manufacture

PRINTED CIRCUIT BOARD HAVING ADHESIVE LAYER AND SEMICONDUCTOR PACKAGE USING THE SAME

Semiconductor cooling apparatus

Power semiconductor module method

Image display unit with light emitting devices having a resin surrounding the light emitting devices

Semiconductor substrate including first and second recognition marks and method for manufacturing semiconductor device

Electrically enhanced wirebond package

Chip package structure and method of manufacturing the same

Semiconductor package and method for fabricating the same

Wafer level stacked die packaging

SEMICONDUCTOR DEVICE, LAYERED TYPE SEMICONDUCTOR DEVICE USING THE SAME, BASE SUBSTRATE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

Device including a housing for a semiconductor chip including leads extending into the housing

Semiconductor package, module, system having solder ball coupled to chip pad and manufacturing method thereof

Semiconductor packaging device

Packaged microchip with spacer for mitigating electrical leakage between components

Integrated circuit package

Method for connecting a die attach pad to a lead frame and product thereof

Integrated circuit package with etched leadframe for package-on-package interconnects

Method of manufacturing a semiconductor component with a low cost leadframe using a non-metallic base structure

PACKAGED SEMICONDUCTOR ASSEMBLIES AND ASSOCIATED SYSTEMS AND METHODS

White light emitting element and white light source

Integrated circuit package including wire bonds

Method of forming premolded lead frame

Method for Singulating a Group of Semiconductor Packages that Contain a Plastic Molded Body

VCSEL DEVICE AND METHOD FOR FABRICATING VCSEL DEVICE

Backlight device and liquid crystal display device

Fluorescent material and light-emitting device

Integrated circuit underfill package system

Semiconductor device and method of manufacturing the same

Semiconductor apparatus, manufacturing method of semiconductor apparatus, and joint material

INTER-CONNECTING STRUCTURE FOR SEMICONDUCTOR PACKAGE AND METHOD OF THE SAME

Semiconductor device and manufacturing method of the same

Semiconductor device

INTER-CONNECTING STRUCTURE FOR SEMICONDUCTOR PACKAGE AND METHOD OF THE SAME

Thermally enhanced wafer level package

Semiconductor device

Stacked semiconductor package that prevents damage to semiconductor chip when wire-bonding and method for manufacturing the same

Semiconductor device

SEMICONDUCTOR DEVICE AND LEAD FRAME USED FOR THE SAME

Package for a power semiconductor device

Semiconductor apparatus with decoupling capacitor

Light-emitting device

Substrate for mounting an optical semiconductor element, manufacturing method thereof, an optical semiconductor device, and manufacturing method thereof

Light emitting device

Wiring board, semiconductor apparatus and method of manufacturing them

BGA package having half-etched bonding pad and cut plating line and method of fabricating same

Method for producing a power semiconductor module comprising surface-mountable flat external contacts

Roll-on encapsulation method for semiconductor packages

Method of manufacturing semiconductor device

Circuit module and radio communications equipment, and method for manufacturing circuit module

Circuit device

Fluorophor and method for production thereof and illuminator

Method of Sealing and Molding an Optical Device With Resin

Dicing die attachment film and method for packaging semiconductor using same

Integrated circuit package system including die having relieved active region

SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR SUBSTRATE

Semiconductor device

Semiconductor package having marking layer

METHOD FOR FORMING AND RELEASING INTERCONNECTS

Semiconductor Device Package

Semiconductor chip package, semiconductor chip assembly, and method for fabricating a device

Memory Packages Having Stair Step Interconnection Layers

Stacked-type chip package structure and method of fabricating the same

Lead frame, electronic component including the lead frame, and manufacturing method thereof

Thermoplastic resin composition for semiconductor, adhesion film, lead frame, and semiconductor device using the same, and method of producing semiconductor device

Wireless semiconductor package for efficient heat dissipation

STACKABLE INTEGRATED CIRCUIT PACKAGE

Semiconductor device

Semiconductor device having grooved leads to confine solder wicking

Stacked semiconductor device and fabricating method thereof