Optical semiconductor device and method of manufacturing thereof

Set of resin compositions for preparing system-in-package type semiconductor device

Phosphor-based LED apparatus with UV reflector

LIGHT EMITTING MODULE

Semiconductor apparatus and method of producing the same

Integrated circuit package system with encapsulation lock

Semiconductor assembly with component attached on die back side

Structure and manufacturing method of a chip scale package with low fabrication cost, fine pitch and high reliability solder bump

Castellation wafer level packaging of integrated circuit chips

Semiconductor device and method for fabricating the same

Semiconductor device with a semiconductor chip stack and plastic housing, and methods for producing the same

Modularized Die Stacking System and Method

Semiconductor device package with groove

Stack semiconductor package including an interposer chip having an imposed diode or capacitor

Stacked die semiconductor device having circuit tape

Stacked multi-chip package with EMI shielding

Reduction in thickness of semiconductor component on substrate

Electronic component package with EMI shielding

Semiconductor device, lead-frame product used for the same and method for manufacturing the same

SEMICONDUCTOR DEVICE

SEMICONDUCTOR LEADFRAME FOR UNIFORM MOLD COMPOUND FLOW

Microelectronic component assemblies and microelectronic component lead frame structures

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Packaged microelectronic components with terminals exposed through encapsulant

Package semiconductor and fabrication method thereof

Integrated circuit package system with encapsulation lock

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH ENCAPSULATION LOCK

Image display device and light emission device

Electronic packages with fine particle wetting and non-wetting zones

Process for manufacturing semiconductor devices

METHOD OF FABRICATING A SEMICONDUCTOR PACKAGE

System and method for increasing the strength of a bond made by a small diameter wire in ball bonding

Methods using die attach paddle for mounting integrated circuit die

Manufacturing method of semiconductor device, adhesive sheet used therein, and semiconductor device obtained thereby

Perimeter matrix ball grid array circuit package with a populated center

LIGHT EMITTING APPARATUS AND METHOD FOR THE SAME

GNSS receiver package

Semiconductor Component Arrangement

SYSTEM AND METHOD FOR THERMAL EXPANSION PRE-COMPENSATED PACKAGE SUBSTRATE

WIRE-BONDED PACKAGE WITH ELECTRICALLY INSULATING WIRE ENCAPSULANT AND THERMALLY CONDUCTIVE OVERMOLD

Packaging board, semiconductor module, and portable apparatus

Power semiconductor module

Methods for packaging and sealing an integrated circuit die

Method for producing a circuit module comprising at least one integrated circuit

Stacked chip package structure with leadframe having bus bar

Die attach paddle for mounting integrated circuit die

Method of producing a semiconductor package

Semiconductor component having a semiconductor die and a leadframe

Chip-stacked package structure having leadframe with multi-piece bus bar

Chip-stacked package structure for lead frame having bus bars with transfer pads

Electronic device having wiring substrate and lead frame

INTEGRATED CIRCUIT PACKAGE

Semiconductor device package and manufacturing method

SEMICONDUCTOR PACKAGE HAVING ELECTROMAGNETIC SHIELDING PART

Method of manufacturing a semiconductor device

Map type semiconductor package

FABRICATION METHOD OF SEMICONDUCTOR DEVICE

Optical coupling element and electronic device

High temperature operating package and circuit design

IC package with a protective encapsulant and a stiffening encapsulant

Semiconductor apparatus and manufacturing method of semiconductor apparatus

Structure of wafer level package with area bump

Semiconductor chip and method for fabricating the same

SEMICONDUCTOR COMPONENT WITH COOLING APPARATUS

Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging

Chip package and method for fabricating the same

POP package and method of fabricating the same

High density stacked die assemblies, structures incorporated therein and methods of fabricating the assemblies

Embedded package in package

Spacers for separating components of semiconductor device assemblies, semiconductor device assemblies and systems including spacers and methods of making spacers

Stacked-die electronics package with planar and three-dimensional inductor elements

Semiconductor device and manufacturing method thereof

Semiconductor package and method therefor

Semiconductor device

Integrated circuit package system with interlock

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURE

POWER SEMICONDUCTION DEVICE AND CIRCUIT MODULE HAVING SUCH POWER SEMICONDUCTION DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Wire bonders and methods of wire-bonding

Semiconductor component with plastic housing, and process for producing the same

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

Method of manufacturing a single chip semiconductor integrated circuit device including a mask ROM in a short time

Adhesion by plasma conditioning of semiconductor chip

Methods for a multiple die integrated circuit package

Integrated circuit tampering protection and reverse engineering prevention coatings and methods

Au Alloy Bonding Wire

Semiconductor integrated circuit device including semiconductor integrated circuit board supplied with no high voltage

PRINTED CIRCUIT BOARD HAVING SUPPORTING PATTERNS

Peripheral card with sloped edges

Thin flip-chip method

Multi-chip module

Stacked structure of chips and water structure for making the same

Electronic Device and Package Used for the Same

Semiconductor device, substrate for producing semiconductor device and method of producing them

Metal core foldover package structures

Stackable packages for three-dimensional packaging of semiconductor dice

Semiconductive device having improved copper density for package-on-package applications

Systems and methods for low profile die package

Pre-encapsulated lead frames for microelectronic device packages, and associated methods

Light emitting apparatus with an opening part, manufacturing method thereof, and light unit

LED with phosphor tile and overmolded phosphor in lens

Packaged integrated circuit having gold removed from a lead frame

Manufacturing method for resin sealed semiconductor device

Method to provide substrate-ground coupling for semiconductor integrated circuit dice constructed from SOI and related materials in stacked-die packages

Semiconductor die package using leadframe and clip and method of manufacturing

Method for forming filling paste structure of WL package

Semiconductor device including semiconductor element surrounded by an insulating member and wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof

Methods of forming semiconductor light emitting device packages by liquid injection molding

Resin composition, cured resin, sheet-like cured resin, laminated body, prepreg, electronic parts and multilayer boards

Wiring Board for Light-Emitting Element

IMAGE DISPLAY DEVICE AND LIGHT EMISSION DEVICE

Plastic overmolded packages with molded lid attachments

Semiconductor device package and manufacturing method

BGA package with leads on chip field of the invention

CHIP SCALE MODULE PACKAGE IN BGA SEMICONDUCTOR PACKAGE

Integrated circuit package with a heat dissipation device

MICRO-ELECTROMECHANICAL SYSTEMS DEVICE AND MANUFACTURING METHOD THEREOF

Semiconductor device, method of manufacturing the same, circuit board, and electronic instrument

CHIP PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF

Semiconductor device and manufacturing method of the same

Stack type ball grid array package and method for manufacturing the same

Microelectronic package

Integrated circuit including clip

SURFACE MOUNT LIGHT EMITTING DIODE PACKAGE

Semiconductor light-emitting device and light-emitting display therewith

Apparatus, system and method for use in mounting electronic elements

Semiconductor element and manufacturing method thereof

Interconnect for improved die to substrate electrical coupling

Method of manufacturing semiconductor device

LED of side view type and the method for manufacturing the same

Light emitting device

Systems and methods for integrated antennae structures in multilayer organic-based printed circuit devices

Method for producing a component and device having a component

SEMICONDUCTOR PACKAGE, METHOD OF PRODUCTION THEREOF AND ENCAPSULATION RESIN

Semiconductor multi-package module having package stacked over die-up flip chip ball grid array package and having wire bond interconnect between stacked packages

Semiconductor apparatus having improved thermal fatigue life

Circuit board including solder ball land having hole and semiconductor package having the circuit board

Multi-chip package having a stacked plurality of different sized semiconductor chips, and method of manufacturing the same

WIREBOND-LESS SEMICONDUCTOR PACKAGE

Bond Wireless Package

Production equipment of resin molding semiconductor device, method of manufacturing resin molding semiconductor device, and resin molding semiconductor device

Package structure with leadframe on offset chip-stacked structure

Electronic device and method for producing a device

Semiconductor package having flexible lead connection plate for electrically connecting base and chip

Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant

Packaging system for semiconductor devices

REINFORCED MICRO-ELECTROMECHANICAL SYSTEM PACKAGE STRUCTURE

Integrated circuit package system with supported stacked die

Quad flat package

Package with solder-filled via holes in molding layers

STACKED INTEGRATION MODULE AND METHOD FOR MANUFACTURING THE SAME

Lead frame with included passive devices

Chip scale package for power devices and method for making the same

Acceleration sensor

Inertial sensor

Integrated circuit package system with down-set die pad and method of manufacture thereof

Thermally Enhanced BGA Package Substrate Structure and Methods

Method for fabricating chip-stacked semiconductor package

Method of fabricating a stacked die having a recess in a die BGA package

Method of fabricating microelectronic devices

Molded semiconductor device, apparatus for producing the same, and method for manufacturing the same

Integrated circuit package system

Intergrated circuit utilizing down bond to define the function of the die and the implementing method thereof

Power semiconductor devices having integrated inductor

Semiconductor switching module and method

Integrated circuit package-in-package system

Chip-stacked package structure

MULTICHIP DEVICE AND METHOD FOR PRODUCING A MULTICHIP DEVICE

Integrated circuit package system with molding vents

Vertical stack type multi-chip package having improved grounding performance and lower semiconductor chip reliability

Integrated circuit package system for package stacking and manufacturing method thereof

Stackable multi-chip package system with support structure

Electronic Device and Method For Producing the Same

Micro chip-scale-package system

SEMICONDUCTOR DEVICE WITH INTERNAL HEAT SINK

Integrated circuit package-on-package stacking system

LEADFRAME AND NON-LEAD PACKAGE THEREWITH

Lead Frame and Fabrication Method thereof

Electrical through contact

LED module and method of manufacturing the same

Method for identifying semiconductor integrated circuit device, method for manufacturing semiconductor integrated circuit device, semiconductor integrated circuit device and semiconductor chip

SEMICONDUCTOR MULTI-CHIP PACKAGE AND FABRICATION METHOD

Electronic packages with roughened wetting and non-wetting zones

Multi-die DC-DC buck power converter with efficient packaging

Semiconductor device and its wiring method

Semiconductor device and its wiring method

Semiconductor device

Semiconductor device and manufacturing method for the same

Semiconductor package

STACKED BALL GRID ARRAY SEMICONDUCTOR PACKAGE

Semiconductor package having passive component and semiconductor memory module including the same

Dual side cooling integrated power device package and module with a clip attached to a leadframe in the package and the module and methods of manufacture

Array-Processed Stacked Semiconductor Packages

Semiconductor device

LED LAMP

Nonvolatile memory apparatus

Semiconductor device encapsulated by silicone resin composition, and silicone resin tablet for encapsulating semiconductor device

Multi Lead Frame Power Package

Method for making a semiconductor multi-package module having inverted wire bond carrier second package

Phosphor for white light-emitting device and white light-emitting device including the same

Luminescent material

Semiconductor device and method for manufacturing same

SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE

Flip chip mounting process and flip chip assembly

Leaded stacked packages having elevated die paddle

Semiconductor device with reduced contact resistance

Electronic component of VQFN design and method for producing the same

Heat dissipating semiconductor package and heat dissipating structure thereof

Semiconductor device and manufacturing method therefor

Electronic circuit in a package-in-package configuration and production method

Brick type stackable semiconductor package

Stack type semiconductor package and method of fabricating the same

Electronic circuit in a package-on-package configuration and method for producing the same

Pillar Bump Package Technology

Chip package structure and manufacturing method thereof

Integrated circuit package system with laminate base

Surface mount multichip devices

Chip package structure

Leaded stacked packages having integrated upper lead

Interconnect structure for semiconductor package

Integrated circuit package system with offset stacked die

Semiconductor module with a power semiconductor chip and a passive component and method for producing the same

Power semiconductor apparatus

Yellow Emitting Phosphor And White Semiconductor Light Emitting Device Incorporating The Same

Semiconductor light-emitting means and light-emitting panel comprising the same

Leadframes for improved moisture reliability and enhanced solderability of semiconductor devices

Method of forming semiconductor chips, the semiconductor chips so formed and chip-stack package having the same

METHOD AND SYSTEM FOR SEALING PACKAGES FOR OPTICS

Method of fabricating a semiconductor chip package

System and method of attenuating electromagnetic interference with a grounded top film

Chip scale package (CSP) assembly apparatus and method

METHODS AND APPARATUS FOR PASSIVE ATTACHMENT OF COMPONENTS FOR INTEGRATED CIRCUITS

Integrated circuit module

Method for producing a dielectric layer for an electronic component

Heat treatment jig and heat treatment jig set

Method for forming a molded circuit board

Component and method for producing a component

Semiconductor chip package and method manufacturing method thereof

Method for producing chip packages, and chip package produced in this way

Chip structure with redistribution traces

Semiconductor device and method of producing the same

Method of manufacturing semiconductor device

Semiconductor package and method of fabricating the same and semiconductor module and method of fabricating the same

Semiconductor package and fabrication method thereof

Semiconductor device, electronic card and pad rearrangement substrate

Semiconductor device

CHIP PACKAGE STRUCTURE AND FABRICATING METHOD THREROF

Semiconductor Package Having Improved Adhesion and Solderability

Electronic assembly and manufacturing method having a reduced need for wire bonds

Integrated circuit package system employing an exposed thermally conductive coating

Integrated circuit package system including wafer level spacer

Semiconductor device and method of manufacturing the same

Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device

Connection board, and multi-layer wiring board, substrate for semiconductor package and semiconductor package using connection board, and manufacturing method thereof

Apparatus and method for reducing volume of resource allocation information message in a broadband wireless communication system

SEMICONDUCTOR PACKAGE HAVING ELECTROMAGNETIC INTERFERENCE SHIELDING AND FABRICATING METHOD THEREOF

Quad flat no-lead (QFN) chip package assembly apparatus and method

Structure of high performance combo chip and processing method

Integrated circuit package, panel and methods of manufacturing the same

Load driving device

LIQUID CRYSTAL DISPLAY DEVICE

Semiconductor device including semiconductor element surrounded by an insulating member wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof

Bottom substrate of package on package and manufacturing method thereof

Solderability Improvement Method for Leaded Semiconductor Package

Superfine-circuit semiconductor package structure

Semiconductor device for pipe for passing refrigerant liquid

Flip chip package including a non-planar heat spreader and method of making the same

SEMICONDUCTOR PACKAGE

Integrated circuit package system with ground bonds

Composite multi-layer substrate and module using the substrate

Manufacturing process for single-chip MMC/SD flash memory device with molded asymmetric circuit board

Integrated circuit package system with stiffener

Electronic module with switching functions and method for producing the same

Integrated circuit packaging system with ultra-thin die

Multi-chip semiconductor connector assemblies

Chip package structure and fabricating method thereof

Method of Manufacturing a Semiconductor Device

Semiconductor device

LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME

Transfer mold solution for molded multi-media card

Singulation Process for Block-Molded Packages

Phosphor, method for manufacturing same, and light emitting diode

Secure electronic entity such as a passport

Integrated circuit incorporating wire bond inductance

Stack package having pattern die redistribution

Stacked, interconnected semiconductor packages

Semiconductor package having embedded passive elements and method for manufacturing the same

IC chip, antenna, and manufacturing method of the IC chip and the antenna

Chip stack, chip stack package, and method of forming chip stack and chip stack package

Semiconductor package having optimal interval between bond fingers for reduced substrate size

System-in-package structure

Flipped, stacked-chip IC packaging for high bandwidth data transfer buses

Method of stacking and interconnecting semiconductor packages via electrical connectors extending between adjoining semiconductor packages

Exposed top side copper leadframe manufacturing

Method of fabricating an integrated circuit with etched ring and die paddle

Solid state image pickup device, method for manufacturing the same, semiconductor device and method for manufacturing the same

Optoelectronic device

Phosphor, Production Method Thereof and Light Emitting Instrument

Differential pressure sensor having symmetrically-provided sensor chips and pressure introduction passages

Methods of operating electronic devices, and methods of providing electronic devices