212716 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of package parts other than the semiconductor or other solid state devices to be connected Encapsulation
Method of manufacturing a semiconductor device
#13202Manufacturing method for a leadless multi-chip electronic module
#13203Illuminated electric toothbrushes emitting high luminous intensity toothbrush
#13204Illuminated electric toothbrushes emitting high luminous intensity toothbrush
#13205Illuminated electric toothbrushes emitting high luminous intensity toothbrush
#13206Encapsulated optoelectronic device
#13207BONDING MATERIALS HAVING PARTICLE WITH ANISOTROPIC SHAPE
#13208Ceramic substrate for light emitting diode where the substrate incorporates ESD protection
#13209SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#13210Integrated circuit package system with offset stack
#13211SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
#13212RF power transistor having an encapsulated chip package
#13213Semiconductor device having heat spreader with center opening
#13214Compliant integrated circuit package substrate
#13215Semiconductor apparatus with decoupling capacitor
#13216Micro universal serial bus (USB) memory package
#13217Light-Emitting Device
#13218Electroluminescent device with high refractive index and UV-resistant encapsulant
#13219METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE USING A LEAD FRAME HAVING THROUGH HOLES OR HOLLOWS THEREIN
#13220Manufacturing method of semiconductor device
#13221Method of fabricating a semiconductor multi-package module having wire bond interconnect between stacked packages
#13222IC packages with internal heat dissipation structures
#13223Micro power converter and method of manufacturing same
#13224Method And System For Using One-Time Programmable (OTP) Read-Only Memory (ROM) To Configure Chip Usage Features
#13225Integrated circuit and method for writing information
#13226Integrated circuit (IC) package stacking and IC packages formed by same
#13227Mold for forming conductive bump, method of fabricating the mold, and method of forming bump on wafer using the mold
#13228Electronic device including a component stack and connecting elements, and connecting elements, and method for producing the electronic device
#13229Stacked die package for MEMS resonator system
#13230Semiconductor package having dimpled plate interconnections
#13231High frequency semiconductor device
#13232Stacking structure of chip package
#13233Semiconductor device having an element mounted on a substrate and an electrical component connected to the element
#13234Thermal improvement for hotspots on dies in integrated circuit packages
#13235Nested integrated circuit package on package system
#13236MULTI-CHIP PACKAGE STRUCTURE
#13237Power semiconductor module and fabrication method thereof
#13238Multi-chip stacked package with reduced thickness
#13239Packaged light emitting devices
#13240Package-on-package system
#13241Coreless cavity substrates for chip packaging and their fabrication
#13242Methods of forming solder connections and structure thereof
#13243Substrate treating method and method of manufacturing semiconductor apparatus
#13244Fabrication method of semiconductor integrated circuit device
#13245Semiconductor package and method of assembling the same
#13246Stacked Chips with Underpinning
#13247Methods of manufacturing microelectronic imaging units on a microfeature workpiece
#13248Method of making light emitting device with multilayer silicon-containing encapsulant
#13249Intumescent paint coatings for inhibiting tin whisker growth and methods of making and using the same
#13250Magnetic shielding for magnetic random access memory
#13251Computer systems having an interposer including a flexible material
#13252STACKED CHIP PACKAGE
#13253Semiconductor device, manufacturing method of the semiconductor device, and mounting method of the semiconductor device
#13254Semiconductor device having improved contacts
#13255Semiconductor Device
#13256Method of making thermally enhanced substrate-base package
#13257Power semiconductor device connected in distinct layers of plastic
#13258System-in-package device
#13259Semiconductor device with improved high current performance
#13260Interconnections resistant to wicking
#13261Package structure and lead frame using the same
#13262Methods and apparatus for a semiconductor device package with improved thermal performance
#13263SEMICONDUCTOR DEVICE, MAGNETIC SENSOR, AND MAGNETIC SENSOR UNIT
#13264LED device with re-emitting semiconductor construction and reflector
#13265GaN-based semiconductor light-emitting device, light illuminator, image display planar light source device, and liquid crystal display assembly
#13266SAWN INTEGRATED CIRCUIT PACKAGE SYSTEM
#13267Advanced multilayer coreless support structures and method for their fabrication
#13268Method of forming semiconductor packaged device
#13269METHOD OF FORMING A TRACE EMBEDDED PACKAGE
#13270Multiple row exposed leads for MLP high density packages
#13271Chip stack package and manufacturing method thereof
#13272Semiconductor device encapsulated with resin composition
#13273INTEGRATED CURRENT SENSOR
#13274Method of producing a surface acoustic wave device
#13275Semiconductor package and method for fabricating the same
#13276Encapsulated electronic device
#13277Semiconductor device
#13278Stackable semiconductor package
#13279Semiconductor module featuring solder balls having lower melting point than that of solder electrode terminals of passive element device
#13280Process to reform a plastic packaged integrated circuit die
#13281Multilayer electronic component, electronic device, and method for producing multilayer electronic component
#13282Semiconductor circuit arrangement
#13283Semiconductor package structure having enhanced thermal dissipation characteristics
#13284Semiconductor package substrate and semiconductor package having the same
#13285Semiconductor multipackage module including die and inverted land grid array package stacked over ball grid array package
#13286Producing thin integrated semiconductor devices
#13287Semiconductor device having a bonding wire and method for manufacturing the same
#13288Stacked package electronic device
#13289Stackable multi-chip package system
#13290Circuit Arrangement, System Carrier and Methods for Producing Same
#13291Microelectronic package having solder-filled through-vias
#13292Lead frame and method of manufacturing the same and semiconductor device
#13293Leadframe IC packages having top and bottom integrated heat spreaders
#13294Method and structure for improving the reliability of leadframe integrated circuit packages
#13295Semiconductor device and method for manufacturing the same
#13296Semiconductor device with reduced parasitic inductance
#13297Light-emitting device manufacturing method and light-emitting device
#13298Light emitting device and a lighting apparatus
#13299Full spectrum phosphor blends for white light generation with LED chips
#13300Fabrication method of semiconductor device
#13301Separation method of semiconductor device
#13302Integrated circuit, and a mobile phone having the integrated circuit
#13303Curable organopolysiloxane composition, use of the cured product of the composition, and semiconductor device
#13304Semiconductor device and method of manufacturing thereof
#13305Interconnect structure and formation for package stacking of molded plastic area array package
#13306Semiconductor component with connecting elements and method for producing the same
#13307Integrated circuit package having exposed thermally conducting body
#13308Semiconductor device
#13309Semiconductor package, chip carrier structure thereof, and method for fabricating the chip carrier
#13310Quad flat no-lead chip carrier with stand-off
#13311SYSTEM IN PACKAGE MODULE
#13312Packaging for micro electro-mechanical systems and methods of fabricating thereof
#13313Design and Method for Attaching a Die to a Leadframe in a Semiconductor Device
#13314Optical sensor assemblage and corresponding manufacturing method
#13315LED device with improved life performance
#13316Optically coupled semiconductor device and electronic device
#13317IMAGE CHIP PACKAGE STRUCTURE AND THE METHOD OF MAKING THE SAME
#13318Image sensor package having mount holder attached to image sensor die
#13319Method and apparatus for depositing coplanar microelectronic interconnectors using a compliant mold
#13320High density integrated circuit apparatus, test probe and methods of use thereof
#13321Integrated circuit encapsulation and method therefor
#13322Semiconductor device having post-mold nickel/palladium/gold plated leads
#13323Method for producing an optoelectronic device with patterned-metallized package body and method for the patterned metalization of a plastic-containing body
#13324Electronic device substrate, electronic device and methods for making same
#13325Electronic device substrate, electronic device and methods for fabricating the same
#13326Electronic module with a semiconductor chip and a component housing and methods for producing the same
#13327Heat sink electronic package having compliant pedestal
#13328SPACERLESS SEMICONDUCTOR PACKAGE CHIP STACKING SYSTEM
#13329Integrated circuit package and multi-layer lead frame utilized
#13330Dual MOSFET package
#13331Method and apparatus for cooling semiconductor device hot blocks and large scale integrated circuit (IC) using integrated interposer for IC packages
#13332Power semiconductor module
#13333PACKAGED DEVICES AND METHODS FOR FORMING PACKAGED DEVICES
#13334Semiconductor device and method of manufacturing the same
#13335No-lead IC packages having integrated heat spreader for electromagnetic interference (EMI) shielding and thermal enhancement
#13336Circuit card module and method for fabricating the same
#13337Integrated circuit package system with different mold locking features
#13338Electronic component having a semiconductor power device
#13339Flip chip MLP with folded heat sink
#13340Copper straps
#13341Dual side cooling integrated power device module and methods of manufacture
#13342Solid state imaging device, semiconductor wafer, optical device module, method of solid state imaging device fabrication, and method of optical device module fabrication
#13343Method of producing an electronic component
#13344Method and apparatus for manufacture and inspection of semiconductor device
#13345Light emitting device using a thermally activated coating and method of manufacturing
#13346Jacketed LED assemblies and light strings containing same
#13347High Withstand Voltage Semiconductor Device Covered with Resin and Manufacturing Method Therefor
#13348Module With Built-In Semiconductor And Method For Manufacturing The Module
#13349Method for fabricating semiconductor package with multi-layer die contact and external contact
#13350Semiconductor device having a chip stack on a rewiring plate
#13351Semiconductor device
#13352Manufacturing method of resin-molding type semiconductor device, and wiring board therefor
#13353Stack MCP and manufacturing method thereof
#13354Electronic device with integrated heat distributor
#13355Method of fabricating microelectronic devices
#13356THREE-DIMENSIONAL PACKAGING SCHEME FOR PACKAGE TYPES UTILIZING A SACRIFICIAL METAL BASE
#13357INTERCONNECTED IC PACKAGES WITH VERTICAL SMT PADS
#13358Integrated circuit device with semiconductor device components embedded in plastic housing composition
#13359Semiconductor device having shifted stacked chips
#13360Semiconductor Housings Having Coupling Coatings
#13361Integrated circuit encapsulation system with vent
#13362Thermoset polyimides for microelectronic applications
#13363Lead frame and semiconductor device using the same
#13364Semiconductor device embedded with pressure sensor and manufacturing method thereof
#13365Side-view surface mount white LED
#13366Light emitting device having a package formed with fibrous fillers
#13367Light emitting device with a porous alumina reflector made of aggregation of alumina particles
#13368Semiconductor device and method for manufacturing the same
#13369Semiconductor light emitting device and a method for producing the same
#13370Phosphor composition and method for producing the same, and light-emitting device using the same
#13371Printed circuit board
#13372High-power ball grid array package, heat spreader used in the BGA package and method for manufacturing the same
#13373Semiconductor module
#13374Fluorescent material, fluorescent device using the same, and image display device and lighting equipment
#13375Electric rotating machine
#13376Package structure
#13377SEMICONDUCTOR MODULE
#13378Semiconductor chip capable of being laminated and a semiconductor device including the lamination of a plurality of semiconductor chips
#13379CHIP PACKAGE
#13380Test pads on flash memory cards
#13381Wafer level stack structure for system-in-package and method thereof
#13382Multiple chip package module and method of fabricating the same
#13383Semiconductor device and method for manufacturing same
#13384Package structure to reduce warpage
#13385Phosphor
#13386CERAMIC MULTILAYER SUBSTRATE AND ITS MANUFACTURING METHOD
#13387Method for positioning of wireless medical devices with short-range radio frequency technology
#13388Semiconductor sealing resin sheet and semiconductor device manufacturing method using the same
#13389Method of forming stackable package
#13390Method of making wirebond electronic package with enhanced chip pad design
#13391Method for manufacturing stacked package structure
#13392Encapsulation for particle entrapment
#13393Attaching heat sinks to integrated circuit packages
#13394Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device
#13395Stackable semiconductor package
#13396Circuit Apparatus
#13397Hybrid integrated circuit device, and method for fabricating the same, and electronic device
#13398Memory package structure
#13399Stackable integrated circuit structures and systems devices and methods related thereto
#13400Molded SiP package with reinforced solder columns
#13401Structure of electronic package and printed circuit board thereof
#13402Circuit apparatus and method of fabricating the apparatus
#13403System and method for providing a power bus in a wirebond leadframe package
#13404Semiconductor device, method for manufacturing semiconductor device, and electronic appliance having the semiconductor device
#13405Electric circuit device, electric circuit module, and power converter
#13406Chip structure with half-tunneling electrical contact to have one electrical contact formed on inactive side thereof and method for producing the same
#13407Method of manufacturing semiconductor apparatus
#13408Method for fabricating semiconductor package free of substrate
#13409Carrierless chip package for integrated circuit devices, and methods of making same
#13410Semiconductor device and method of manufacturing the semiconductor device
#13411Semiconductor die package including multiple dies and a common node structure
#13412Surface mounting electronic component and manufacturing method thereof
#13413Inductor element and method for production thereof, and semiconductor module with inductor element
#13414Blue-light light-emitting diode
#13415Semiconductor device, electronic apparatus and semiconductor device fabricating method
#13416Semiconductor device
#13417Integrated circuit devices with stacked package interposers
#13418Power semiconductor component, power semiconductor device as well as methods for their production
#13419IC chip package with minimized packaged-volume
#13420Semiconductor power module including epoxy resin coating
#13421Utra-thin substrate package technology
#13422Semiconductor components having encapsulated through wire interconnects (TWI)
#13423Semiconductor module featuring solder balls having lower melting point than that of solder electrode terminals of electronic device containing additional metal powder component
#13424Stackable semiconductor package
#13425Embedded integrated circuit package-on-package system
#13426Leadframe enhancement and method of producing a multi-row semiconductor package
#13427Power semiconductor module having surface-mountable flat external contacts and method for producing the same
#13428Memory circuit system having semiconductor devices and a memory
#13429Oxynitride phosphor and a light emitting device
#13430Semiconductor device using semiconductor chip
#13431Sealed LED having improved optical transmissibility
#13432Fill head for injection molding of solder
#13433Universal mold for injection molding of solder
#13434Three-dimensional force input control device and fabrication
#13435Manufacturing method of semiconductor device and semiconductor device corresponding to loop back test
#13436POP Semiconductor Device Manufacturing Method
#13437Semiconductor package, array arranged substrate structure for the semiconductor package and fabrication method of the semiconductor package
#13438Palladium-spot leadframes for high adhesion semiconductor devices and method of fabrication
#13439High-Power LED Chip Packaging Structure And Fabrication Method Thereof
#13440Semiconductor laser device and method of manufacturing the same, and optical transmission module and optical disk apparatus using the semiconductor laser device
#13441Electronic device with lead-free metal thin film formed on the surface thereof
#13442Semiconductor memory device and defect remedying method thereof
#13443Multilayer wiring board
#13444Yellow light emitting Ce-activated silicate phosphor with new composition, manufacturing method thereof and white LEDs including phosphor
#13445High light output lamps having a phosphor embedded glass/ceramic layer
#13446ELECTRODE, MANUFACTURING METHOD OF THE SAME, AND SEMICONDUCTOR DEVICE HAVING THE SAME
#13447Wiring board, semiconductor device using the same, and method for manufacturing wiring board
#13448Stacked integrated circuit package-in-package system
#13449Semiconductor device
#13450Semiconductor device, substrate for producing semiconductor device and method of producing them
#13451Overmolded semiconductor package with a wirebond cage for EMI shielding
#13452Stacked semiconductor device
#13453Adhesive bonding sheet, semiconductor device using the same, and method for manufacturing such semiconductor device
#13454Etched leadframe flipchip package system
#13455Alternative flip chip in leaded molded package design and method for manufacture
#13456Photo coupler
#13457Semiconductor light emitting device with first and second leads
#13458Circuit device
#13459Lead frame based, over-molded semiconductor package with integrated through hole technology (THT) heat spreader pin(s) and associated method of manufacturing
#13460Semiconductor device having heat radiation member and semiconductor chip and method for manufacturing the same
#13461Hybrid stacking package system
#13462High frequency IC package and method for fabricating the same
#13463Semiconductor module having discrete components and method for producing the same
#13464Single package wireless communication device
#13465Hybrid flip-chip and wire-bond connection package system
#13466Semiconductor device having an adhesion promoting layer and method for producing it
#13467Integrated circuit package system with ground ring
#13468Chip package structure
#13469METHOD AND SYSTEM FOR SEALING PACKAGES FOR OPTICS
#13470Semiconductor package and method using isolated Vplane to accommodate high speed circuitry ground isolation
#13471Integrated circuit package system with net spacer
#13472Electronic device with selective nickel palladium gold plated leadframe and method of making the same
#13473White light LED devices with flat spectra
#13474Light source with compliant interface
#13475Multichip package system
#13476Multiple flip-chip integrated circuit package system
#13477Semiconductor encapsulant of epoxy resin, polyphenolic compound, filler and accelerator
#13478Cap attachment structure, semiconductor sensor device and method
#13479Semiconductor device and manufacturing method thereof
#13480Singulating surface-mountable semiconductor devices and fitting external contacts to said devices
#13481Methods of Packaging Using Fluid Resin
#13482Cured mold compound spacer for stacked-die package
#13483Semiconductor device fabricating method
#13484Semiconductor device manufacturing method
#13485Mold for resin molding, resin molding apparatus, and semiconductor device manufacture method
#13486Optical Communication Module
#13487Flip chip bonding structure
#13488Circuit board and electronic apparatus having the same
#13489Circuit device
#13490Stacked integrated circuit package system with connection protection
#13491White light emitting device
#13492Piezoelectric device and method for manufacturing the same
#13493UNIVERSAL CHIP PACKAGE STRUCTURE
#13494SEMICONDUCTOR DEVICE HAVING STACKED STRUCTURE AND METHOD OF MANUFACTURING THE SAME
#13495Packaged microelectronic devices recessed in support member cavities, and associated methods
#13496Semiconductor chip comprising a metal coating structure and associated production method
#13497Ball grid array housing having a cooling foil
#13498Flip chip bonded package applicable to fine pitch technology
#13499High-performance semiconductor package
#13500Semiconductor device and manufacturing method thereof