212716 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of package parts other than the semiconductor or other solid state devices to be connected Encapsulation
Semiconductor device, semiconductor device manufacturing method, and electronic device
#1502Warpage control in package-on-package structures
#1503Fan-out semiconductor package
#1504Electromagnetic interference shield within integrated circuit encapsulation using photonic bandgap structure
#1505Package with fan-out structures
#1506Fan-out semiconductor package
#1507Semiconductor device and manufacturing method thereof
#1508Integrated circuit (IC) die attached between an offset lead frame die-attach pad and a discrete die-attach pad
#1509Phosphor and light-emitting equipment using phosphor
#1510Acoustic management in integrated circuit using phononic bandgap structure
#1511Optical-semiconductor device including a wavelength converting member and method for manufacturing the same
#1512Thin optoelectronic modules with apertures and their manufacture
#1513Fan-out sensor package and optical-type fingerprint sensor module including the same
#1514Method of manufacturing power semiconductor module including a power semiconductor chip and a control chip formed according to different process rules, and power semiconductor module
#15153D die stacking structure with fine pitches
#1516Package-on-package (PoP) structure including stud bulbs
#1517Integrated circuit package assembly
#1518Integrated fan-out package including voltage regulators and methods forming same
#1519Methods for controlling warpage in packaging
#1520Package assembly
#1521Semiconductor device
#1522Printed circuit boards with anti-warping molding portions and related semiconductor packages and methods of fabricating
#1523Semiconductor package
#1524Leadless semiconductor packages, leadframes therefor, and methods of making
#1525Power semiconductor device
#1526Semiconductor package having inspection structure and related methods
#1527Methods of packaging semiconductor devices including placing semiconductor devices into die caves
#1528Semiconductor device having first and second electrode layers electrically disconnected from each other by a slit
#1529Method for fabricating electronic package
#1530Semiconductor packages and methods of forming the same
#1531Semiconductor package
#1532Packaging method and package structure of wafer-level system-in-package
#1533Semiconductor leadframes and packages with solder dams and related methods
#1534Methods and structures for wafer-level system in package
#1535Package structure and method of forming the same
#1536Chip-on-substrate packaging on carrier
#1537Conductive vias in semiconductor packages and methods of forming same
#1538Semiconductor package with terminal pattern for increased channel density
#1539Semiconductor device with a bridge insulation layer
#1540Lead frame and electronic component device
#1541Power module
#1542Semiconductor device and method of forming dual-sided interconnect structures in FO-WLCSP
#1543Light emitting device
#1544Inverted leads for packaged isolation devices
#1545Light emitting device and method of forming the same
#1546Multi-chip fan out package and methods of forming the same
#1547Microelectronic packages with high integration microelectronic dice stack
#1548Semiconductor device structure comprising a plurality of metal oxide fibers and method for forming the same
#1549Package substrate processing method and protective tape
#1550Packages with Si-substrate-free interposer and method forming same
#1551Chip package
#15523D SEMICONDUCTOR DEVICE AND SYSTEM
#1553Semiconductor device and method of using a standardized carrier in semiconductor packaging
#1554Integrated circuit packages and methods of forming same
#1555Semiconductor device and method of balancing surfaces of an embedded PCB unit with a dummy copper pattern
#1556Curable resin composition, cured product thereof, and semiconductor device
#1557Method for manufacturing package, and method for manufacturing light emitting device
#1558Image sensing apparatus and manufacturing method thereof
#1559Package on package with integrated passive electronics method and apparatus
#1560Thermally coupled package-on-package semiconductor packages
#1561Manufacturing method of semiconductor package
#1562Methods of forming joint structures for surface mount packages
#1563Method for fabricating an electronic device and a stacked electronic device
#1564Electronic device packaging
#1565Power conversion device
#1566Semiconductor device including conductive spacer with small linear coefficient
#1567Semiconductor apparatus
#1568Wafer-level system-in-package structure and electronic apparatus thereof
#1569Semiconductor device, method for producing the same, and laminate
#1570Opening in the pad for bonding integrated passive device in InFO package
#1571CIRCUIT HAVING SNUBBER CIRCUIT IN POWER SUPPLY DEVICE
#1572HIGH RELIABILITY HOUSING FOR A SEMICONDUCTOR PACKAGE
#1573Semiconductor packages and methods of manufacturing the same
#1574Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices
#1575Semiconductor package having a high reliability
#1576Package structure and method of manufacturing the same
#1577Substrate-less stackable package with wire-bond interconnect
#1578Multi-row wiring member for semiconductor device and method for manufacturing the same
#1579Tapeless leadframe package with underside resin and solder contact
#1580Package with lead frame with improved lead design for discrete electrical components and manufacturing the same
#15813DIC packaging with hot spot thermal management features
#1582Package of integrated circuits having a light-to-heat-conversion coating material
#1583Package structure and chip structure
#1584Package and light-emitting device
#1585Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body
#1586Semiconductor package, semiconductor device and method of forming the same
#1587Semiconductor device and electronic apparatus including semiconductor chips including an insulated gate bipolar transistor and a diode
#1588Semiconductor device package and method of manufacturing the same
#1589Integrated circuit stacking approach
#1590"Lead-Free Solder Ball"
#1591Via structure for packaging and a method of forming
#1592Methods of forming leadless semiconductor packages with plated leadframes and wettable flanks
#1593Semiconductor device
#1594Discrete power transistor package having solderless DBC to leadframe attach
#1595Semiconductor device
#1596Face down dual sided chip scale memory package
#1597Semiconductor device with copper corrosion inhibitors
#1598Composite wafer, semiconductor device, electronic component and method of manufacturing a semiconductor device
#1599SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
#1600Thermosonically bonded connection for flip chip packages
#1601Light emitting device
#1602Integrated device comprising embedded package on package (PoP) device
#1603Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
#1604Semiconductor package having an electro-magnetic interference shielding or electro-magnetic wave scattering structure
#1605Semiconductor device
#1606Semiconductor device with external terminal
#1607Electrical connection structure, semiconductor package and method of forming the same
#1608Semiconductor device
#1609Flexible semiconductor package and method for fabricating the same
#1610Light emitting device
#1611Orthogonal transistor layouts
#1612Integrated fan-out stacked package with fan-out redistribution layer (RDL)
#1613Interposer substrate and method for manufacturing the same
#1614Leadframe package with side solder ball contact and method of manufacturing
#1615Power semiconductor device
#16163D SEMICONDUCTOR DEVICE AND SYSTEM
#1617Electronic package and its package substrate
#1618Electronic package and manufacturing method thereof
#1619Shaped phosphor to reduce repeated reflections
#1620Electronic unit
#1621Stacked semiconductor dies including inductors and associated methods
#1622Electronic device
#1623Chip packaging structure and packaging method
#1624Integrated circuit component package and method of fabricating the same
#1625Wiring substrate and semiconductor device
#1626Radar module with wafer level package and underfill
#1627Package with interlocking leads and manufacturing the same
#1628Semiconductor packages
#1629Molded intelligent power module and method of making the same
#1630Power module and method of manufacturing the same, and power electronic apparatus and method of manufacturing the same
#1631Semiconductor device
#1632Heat spreading device and method
#1633Power module, power semiconductor device and power module manufacturing method
#1634Arrangement and thermal management of 3D stacked dies
#1635Die-on-interposer assembly with dam structure and method of manufacturing the same
#1636Non-vertical through-via in package
#1637Integrated circuit package with stress directing material
#16383D SEMICONDUCTOR DEVICE AND SYSTEM
#16393D SEMICONDUCTOR DEVICE AND SYSTEM
#1640Multi-blade and processing method of workpiece
#1641Package structure of fingerprint identification chip
#1642Proximity detector device with interconnect layers and related methods
#1643Stack type sensor package structure
#1644Fan-out semiconductor package
#1645Fan-out wafer level package structure
#1646PACKAGE METHOD FOR GENERATING PACKAGE STRUCTURE WITH FAN-OUT INTERFACES
#1647Power semiconductor apparatus and manufacturing method therefor
#1648Assembly and method for mounting an electronic component to a substrate
#1649Electronic device and method of manufacturing the same
#1650MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
#16513D SEMICONDUCTOR DEVICE AND SYSTEM
#1652Circuit board and semiconductor package using the same
#1653Radio frequency shielding within a semiconductor package
#1654Thin optoelectronic modules with apertures and their manufacture
#1655Chip package structure with conductive shielding film
#1656Wire bond connection with intermediate contact structure
#1657Semiconductor packages with electromagnetic interference shielding
#1658Semiconductor package
#1659Through-holes of a semiconductor chip
#1660Module
#1661Semiconductor package device and method of manufacturing the same
#1662Side-solderable leadless package
#1663Substrate-free system in package design
#1664Semiconductor device and method of forming microelectromechanical systems (MEMS) package
#1665Light-emitting element package having lead frame with connection portion
#1666Semiconductor chip for sensing temperature and semiconductor system including the same
#1667Semiconductor module and method for manufacturing the same
#1668Thermal bonding sheet, thermal bonding sheet with dicing tape, bonded body production method, and power semiconductor device
#1669Semiconductor device, semiconductor chip and method of manufacturing the semiconductor device
#1670Method for fabricating electronic package
#1671Cavity wall structure for semiconductor packaging
#1672Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrate
#1673Semiconductor device and method for manufacturing the same
#1674Modified leadframe design with adhesive overflow recesses
#1675Semiconductor device
#1676Antenna module and method of manufacturing the same
#1677Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body
#1678LTHC as charging barrier in InFO package formation
#1679Semiconductor package, package on package structure and method of froming package on package structure
#1680POWER MODULE
#1681Fan-out semiconductor package
#1682Semiconductor device
#1683Semiconductor package
#1684Device and package structure
#1685Electronic module
#1686Semiconductor package with supported stacked die
#1687Ag underlayer-attached metallic member, Ag underlayer-attached insulating circuit substrate,semiconductor device, heat sink-attached insulating circuit substrate, and method for manufacturing Ag underlayer-attached metallic member
#1688Sawn leadless package having wettable flank leads
#1689Semiconductor structure and semiconductor package device using the same
#1690Electronic module having a filler in a sealing resin
#1691Electronic module with sealing resin
#1692Light emitting apparatus
#1693Method for fabricating glass substrate package
#1694Semiconductor package and method of forming the same
#1695Semiconductor package and method of manufacturing the same
#1696Wire bond wires for interference shielding
#1697EMI shield for molded packages
#1698Semiconductor device
#1699A 3D SEMICONDUCTOR DEVICE AND SYSTEM
#1700Semiconductor device
#1701Extremely high frequency systems and methods of operating the same
#1702Logic drive based on standard commodity FPGA IC chips using non-volatile memory cells
#1703Method, apparatus and system to interconnect packaged integrated circuit dies
#1704Phosphor composition, light-emitting device package comprising same, and lighting apparatus
#1705Electrically conductive adhesive film and dicing-die bonding film using the same
#1706Electrically conductive adhesive film and dicing-die bonding film using the same
#1707Light source apparatus and endoscope system
#1708Conductive ball having a tin-based solder covering an outer surface of the copper ball
#1709Semiconductor package with redistribution structure and pre-made substrate on opposing sides for dual-side metal routing
#1710Bridge interconnection with layered interconnect structures
#1711Light emitting module and display device
#1712Light emitting device
#1713Optical coupling device
#1714Integrated circuit packages and methods of forming same
#1715Light emitting device
#1716Semiconductor device including control switches to reduce pin capacitance
#1717Package on package thermal transfer systems and methods
#1718Package structures and methods of forming
#1719Semiconductor package and method
#1720Enhanced thermal transfer in a semiconductor structure
#1721Manufacturing method for semiconductor device and semiconductor device
#1722Solid top terminal for discrete power devices
#1723Method of packaging power semiconductor module including power transistors
#1724Power semiconductor device including a spacer
#17253D SEMICONDUCTOR DEVICE AND SYSTEM
#1726Method for dividing substrate along division lines using abrasive member having projection for cutting substrate
#17273D semiconductor device and structure
#1728Multi-chip structure and method of forming same
#1729Resin-molding device and method for producing resin-molded product
#1730Printed circuit board and semiconductor package structure
#1731Packaged die and RDL with bonding structures therebetween
#1732Conductive wire through-mold connection apparatus and method
#1733Semiconductor package
#1734Semiconductor packages with thermal-electrical-mechanical chips and methods of forming the same
#1735Chip on package structure and method
#1736Vertical wire connections for integrated circuit package
#1737Semiconductor device
#1738System and method for an improved interconnect structure
#1739Semiconductor device including a pad and a wiring line arranged for bringing a probe into contact with the pad and method of manufacturing the same
#1740Printed circuit board and semiconductor package structure
#1741Printed circuit board and semiconductor package structure
#1742Power module, power converter and manufacturing method of power module
#1743Packaged light emitting devices including electrode isolation structures and methods of forming packaged light emitting devices including the same
#1744Dynamic random access memory (DRAM) mounts
#1745Semiconductor device manufacturing method and semiconductor device
#1746Heterogenous 3D chip stack for a mobile processor
#1747Die stack with cascade and vertical connections
#1748Semiconductor device and method for manufacturing the same
#1749Semiconductor device having upper and lower redistribution layers
#1750Heterogeneous fan-out structures for memory devices
#1751Semiconductor device
#1752Power module based on multi-layer circuit board
#1753Semiconductor device
#1754Integrated circuit package with pre-wetted contact sidewall surfaces
#1755Package structure for power converter and manufacture method thereof
#1756Glass interposer module, imaging device, and electronic apparatus
#1757Semiconductor device
#1758Methods of determining racetrack layout for radio frequency isolation structure
#1759Optical device
#1760Radiation-emitting optoelectronic device
#1761Light emitting device, light emitting element package, and light emitting device
#1762Stacked microfeature devices and associated methods
#1763Packaged microelectronic devices having stacked interconnect elements and methods for manufacturing the same
#1764Semiconductor device
#1765Conical-shaped or tier-shaped pillar connections
#1766Semiconductor package structure and method of making the same
#1767Wrapped signal shielding in a wafer fanout package
#1768Wavelength conversion member, molded body, wavelength conversion apparatus, sheet member, light emitting apparatus, light guide apparatus and display apparatus
#1769Light emitting device
#1770Semiconductor package and manufacturing method of the same
#1771Package structure and method of forming the same
#1772Semiconductor device comprising PN junction diode and Schottky barrier diode
#1773Memory devices with controllers under memory packages and associated systems and methods
#1774Integrated fan-out package structures with recesses in molding compound
#1775Package-on-package assembly with wire bonds to encapsulation surface
#1776Packaged semiconductor devices, methods of packaging semiconductor devices, and PoP devices
#1777Thermal interface material having different thicknesses in packages
#1778Thermal interface material having different thicknesses in packages
#1779Method of forming a packaged semiconductor device using ganged conductive connective assembly and structure
#1780Semiconductor dies with recesses, associated leadframes, and associated systems and methods
#1781Package with component connected at carrier level
#1782Electronic package that includes lamination layer
#1783SYSTEM IN PACKAGE PROCESS FLOW
#17843D SEMICONDUCTOR DEVICE AND SYSTEM
#17853D SEMICONDUCTOR DEVICE AND SYSTEM
#17863D SEMICONDUCTOR DEVICE AND SYSTEM
#17873D SEMICONDUCTOR DEVICE AND SYSTEM
#1788Method of manufacturing a semiconductor device including through silicon plugs
#1789Semiconductor package and semiconductor process
#1790Electrically conductive adhesive agent composition, and electrically conductive adhesive film and dicing-die-bonding film using the same
#1791Electrically conductive adhesive film and dicing-die bonding film using the same
#1792Electrically conductive adhesive film and dicing-die bonding film using the same
#1793Integrated circuit comprising at least an integrated antenna
#1794Red flip chip light emitting diode, package, and method of making the same
#1795Electronic package with conductive pillars
#1796Microelectronic devices and methods for filling vias in microelectronic devices
#1797Semiconductor package device and method of manufacturing the same
#1798Fan-out semiconductor package
#1799Semiconductor package with leadframe
#1800Semiconductor device and method for manufacturing the same