212716 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of package parts other than the semiconductor or other solid state devices to be connected Encapsulation
Electronic device
#1802Semiconductor chip package having a cooling surface and method of manufacturing a semiconductor package
#1803Wafer level chip scale packaging intermediate structure apparatus and method
#1804Paste-like adhesive composition, semiconductor device, method for manufacturing semiconductor device, and method for bonding heatsink
#1805Semiconductor device package comprising a dielectric layer with built-in inductor
#1806Packages and packaging methods for semiconductor devices, and packaged semiconductor devices
#1807Package with thinned substrate
#1808Semiconductor devices, methods of manufacture thereof, and packaged semiconductor devices
#1809Solder ball protection in packages
#1810Ultra small molded module integrated with die by module-on-wafer assembly
#1811Microelectronic structures having multiple microelectronic devices connected with a microelectronic bridge embedded in a microelectronic substrate
#1812Resin composition for encapsulation, and semiconductor device
#1813Post-passivation interconnect structure and method of forming the same
#1814Integrated circuit package including miniature antenna
#1815Light emitting element-mounting substrate and light emitting apparatus
#1816Proximity coupling interconnect packaging systems and methods
#1817Semiconductor packages
#1818Microelectronic package having stub minimization using symmetrically-positioned duplicate sets of terminals for wirebond assemblies without windows
#1819Method of fabricating a semiconductor package
#1820Electronic component package
#1821Universal surface-mount semiconductor package
#1822Semiconductor device and manufacturing method thereof
#1823Semiconductor device with first and second semiconductor chips connected to insulating element
#1824Lead frame
#1825Die package component with jumper structure and manufacturing method thereof
#1826Die package component with jumper structure
#1827Semiconductor device and method of forming a fan-out PoP device with PWB vertical interconnect units
#1828Semiconductor chip, semiconductor device, and electronic device
#1829Pre-molded active IC of passive components to miniaturize system in package
#1830Packages with through-vias having tapered ends
#1831Semiconductor bonding structures and methods
#1832Package structures and method of forming the same
#1833Method of fabricating low-profile footed power package
#1834Method of making fully molded peripheral package on package device
#1835Condensation reaction-type die bonding agent, LED light emitting device and method for manufacturing same
#1836Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods
#1837Method of manufacturing semiconductor device
#1838Semiconductor package having routable encapsulated conductive substrate and method
#1839Multi-layer substrate for semiconductor packaging
#1840Power module
#1841Fan-out semiconductor package
#1842Electronic package and method for fabricating the same
#1843Light source circuit unit, illuminator, and display
#1844INTEGRATED CIRCUIT PACKAGE HAVING WIREBONDED MULTI-DIE STACK
#1845Semiconductor packages and devices
#1846Shielded module having compression overmold
#1847Electronic package and method for fabricating the same
#1848Semiconductor device and semiconductor package including plural solder ball sets each corresponding to a pair of differential input and differential output signals
#1849Package-on-package semiconductor assemblies and methods of manufacturing the same
#1850Positional relationship among components of semiconductor device
#1851Semiconductor device and method of manufacturing the same
#1852Semiconductor device and method of manufacturing the same
#1853Package structure
#1854Wafer level dicing method and semiconductor device
#1855Ceramic substrate and electronic device
#1856RADIO-FREQUENCY SWITCHES HAVING SILICON-ON-INSULATOR FIELD-EFFECT TRANSISTORS WITH REDUCED LINEAR REGION RESISTANCE
#1857Semiconductor device and method of manufacture
#1858Semiconductor device with discrete blocks
#1859Package assembly for embedded die and associated techniques and configurations
#1860Package structure and method for forming the same
#1861Thin recon interposer package without TSV for fine input/output pitch fan-out
#1862SEMICONDUCTOR MODULE
#1863Semiconductor device with through-mold via
#1864Method of manufacturing a semiconductor package including a shield layer
#1865Systems and methods for improved delamination characteristics in a semiconductor package
#1866SEMICONDUCTOR DEVICE
#1867Magnetic detection device, current detection device, method for manufacturing magnetic detection device, and method for manufacturing current detection device
#1868Power semiconductor device and power conversion device
#1869Molded Circuit Substrates
#1870Light emitting device
#1871Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body
#1872Multiple bond via arrays of different wire heights on a same substrate
#1873Single layer low cost wafer level packaging for SFF SiP
#1874Semiconductor device including solder bracing material with a rough surface, and manufacturing method thereof
#1875Semiconductor device
#1876Package structure
#1877Semiconductor device
#1878Integration of a passive component in an integrated circuit package
#18793D semiconductor device and system
#1880Embedded 3D interposer structure
#1881Substrate design for semiconductor packages and method of forming same
#1882Method for forming a matrix composite layer and workpiece with a matrix composite layer
#1883Semiconductor structures and methods
#1884Stacked package assembly with voltage reference plane
#1885Semiconductor chip having multiple pads and semiconductor module including the same
#1886Semiconductor device package and method for manufacturing the same
#1887Semiconductor package structure
#1888Dummy features in redistribution layers (RDLS) and methods of forming same
#1889Packages with Si-substrate-free interposer and method forming same
#1890Package with component connected with carrier via spacer particles
#1891Magneto-resistive effect element
#1892Methods and apparatus for a substrate core layer
#1893Semiconductor device packages, packaging methods, and packaged semiconductor devices
#1894Power semiconductor module for an inverter circuit and method of manufacturing the same
#1895Integrated fan-out structure with guiding trenches in buffer layer
#1896Plurality of semiconductor devices encapsulated by a molding material attached to a redistribution layer
#1897Electronic component module and method of manufacturing the same
#1898Interposer substrate and method of fabricating the same
#1899Semiconductor device and method of manufacturing semiconductor device
#1900Method of packaging a semiconductor die
#1901Wiring board, electronic device, and electronic module
#1902Semiconductor device and power converter
#1903Electronic device with embedded electronic component
#1904Power conversion device
#1905Hall element
#1906Display unit
#1907Semiconductor device and manufacturing method thereof
#1908Embedded-bridge substrate connectors and methods of assembling same
#1909Thermal bonding sheet and thermal bonding sheet with dicing tape
#1910Solder joining
#1911Packages with interposers and methods for forming the same
#1912Semiconductor device and method of manufacturing thereof
#1913Semiconductor device and method for manufacturing the same
#1914Semiconductor device and method of manufacturing the same
#1915Methods and apparatus for semiconductor device having bi-material die attach layer
#1916Semiconductor device, manufacturing method for semiconductor device, and electrode plate
#1917Through-mold structures
#1918Shielded module
#1919Press, actuator set and method for encapsulating electronic components with at least two individual controllable actuators
#1920Manufacturing method of semiconductor device and semiconductor device
#1921Semiconductor light emitting device, backlight, color image display device and phosphor to be used for them
#1922Sheet and composite sheet
#1923Exposed-die mold package for a sensor and method for encapsulating a sensor that interacts with the environment
#1924Semiconductor package device and method of manufacturing the same
#1925Semiconductor structure and manufacturing method thereof
#1926Method of manufacturing illumination device, illumination device, illumination device manufacturing system, and method of classifying color tone of light emitting devices
#1927Semiconductor device and method for manufacturing the same
#1928Semiconductor device
#1929Method of manufacturing semiconductor package
#1930SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#1931Substrate construction and electronic package including the same
#1932Semiconductor device
#1933Electronic device
#1934Methods and apparatus for an improved integrated circuit package
#1935SEMICONDUCTOR PACKAGES AND METHODS OF FABRICATING THE SAME
#1936Semiconductor package device
#1937Sensor package and manufacturing method thereof
#1938Semiconductor device package with warpage prevention
#1939VISIBILITY EVENT NAVIGATION METHOD AND SYSTEM
#1940Thermal airflow sensor
#1941Composition for removing silicone resins and method of thinning substrate by using the same
#1942Thermal bonding sheet and thermal bonding sheet with dicing tape
#1943FLEXIBLE ELECTRONIC ASSEMBLY METHOD
#1944Method of producing an optoelectronic semiconductor component, optoelectronic semiconductor component, and temporary carrier
#1945Semiconductor device and an electronic device
#1946Routing design of dummy metal cap and redistribution line
#1947Warpage balancing in thin packages
#1948Semiconductor package with lead frame and recessed solder terminals
#1949Semiconductor package structure
#1950Semiconductor module comprising an encapsulating compound that covers at least one semiconductor component
#1951Releasable carrier method
#1952SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#1953Combined structure of flexible semiconductor device package and method of transporting the flexible semiconductor device
#1954Sheet and composite sheet
#1955Light emitting apparatus
#1956Semiconductor packages having asymmetric chip stack structure
#1957Substrate structure, electronic package having the same, and method for fabricating the same
#1958Semiconductor device package and a method of manufacturing the same
#1959Power semiconductor module with heat dissipation plate
#1960Semiconductor device and method of packaging
#1961Mold
#1962Phosphor containing particle, and light emitting device and phosphor containing sheet using the same
#1963Copper paste for joining, method for producing joined body, and method for producing semiconductor device
#1964Semiconductor package
#1965Wiring board, electronic device, and electronic module
#1966Semiconductor device and manufacturing method thereof
#19673-D STACKING OF ACTIVE DEVICES OVER PASSIVE DEVICES
#1968Antenna apparatus and method
#1969Semiconductor light emitting device and method of manufacturing the same
#1970Stacked semiconductor die assemblies with die support members and associated systems and methods
#1971Semiconductor package structure and semiconductor process
#1972Method of forming contact holes in a fan out package
#1973Method of fabricating packaging substrate
#1974Lead frame
#1975Semiconductor chip, method for mounting semiconductor chip, and module in which semiconductor chip is packaged
#1976CONDUCTIVE BALL
#1977Semiconductor device and method for manufacturing the same using an adhesive
#1978Control circuitry for silicon-on-insulator chip
#1979LED assembly for omnidirectional light appliances
#1980Methods of forming integrated circuit package with thermally conductive pillar
#1981Manufacturing method of semiconductor package
#1982Integrated circuit package including shielding between adjacent chips
#1983Substrate-less stackable package with wire-bond interconnect
#1984PoP device
#1985RECONSTITUTED INTERPOSER SEMICONDUCTOR PACKAGE
#1986Semiconductor chip package having heat dissipating structure
#1987Semiconductor package device
#1988Molding compound including a carbon nano-tube dispersion
#1989Magnetically coupled galvanically isolated communication using lead frame
#1990Light-emitting element package
#1991Semiconductor device assembly with through-package interconnect and associated systems, devices, and methods
#1992Interconnect structures and methods of forming same
#1993Package with solder regions aligned to recesses
#1994Warpage control in package-on-package structures
#1995Semiconductor device and manufacturing method thereof
#1996Systems and methods for electromagnetic interference shielding
#1997Semiconductor package and method of fabricating the same
#1998Fan-out semiconductor package and method of manufacturing the same
#1999Integrated circuit (IC) package with a solder receiving area and associated methods
#2000Semiconductor package
#2001Circuit packages comprising epoxy mold compounds and methods of compression molding
#2002Method for fabricating a semiconductor chip panel
#2003Method for manufacturing semiconductor device
#2004Device including a compound semiconductor chip
#2005Light-emitting device having surface-modified luminophores
#2006Light emitting diode and light emitting diode package
#2007Protective layer for contact pads in fan-out interconnect structure and method of forming same
#2008Backside redistribution layer (RDL) structure
#2009Power module
#20103D semiconductor device, fabrication method and system
#2011Adhesive composition, cured article, semiconductor device, and production method for same
#2012Light-emitting device package
#2013LED lamp with siloxane particle material
#2014Thin fan-out multi-chip stacked package structure and manufacturing method thereof
#2015Package with metal-insulator-metal capacitor and method of manufacturing the same
#2016Preformed lead frame and lead frame packaged structure including the same
#2017PRE-MOLDED INTEGRATED CIRCUIT PACKAGES
#2018Interconnect structure for package-on-package devices
#2019Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components
#2020Resin composition, method for manufacturing semiconductor device using resin composition, and solid-state imaging element
#2021SGS or GSGSG pattern for signal transmitting channel, and PCB assembly, chip package using such SGS or GSGSG pattern
#2022Semiconductor memory device and structure
#2023Chip integration module, chip package structure, and chip integration method
#2024Substrates, assembles, and techniques to enable multi-chip flip chip packages
#2025Semiconductor device and semiconductor module
#2026Packaging through pre-formed metal pins
#2027Package substrates, packaged semiconductor devices, and methods of packaging semiconductor devices
#2028Chip-on-substrate packaging on carrier
#2029Composite magnetic sealing material and electronic circuit package using the same as mold material
#2030SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#2031High-frequency module
#2032Selective planishing method for making a semiconductor device
#2033High-frequency module
#2034Method of manufacturing light emitting device
#2035Package-on-package structures and methods for forming the same
#2036Packaging mechanisms for dies with different sizes of connectors
#2037Integrated circuit package having wirebonded multi-die stack
#2038Packages with metal line crack prevention design
#2039ANTI-EMI SHIELDING PACKAGE AND METHOD OF MAKING SAME
#2040Wiring board with embedded component and integrated stiffener, method of making the same and face-to-face semiconductor assembly using the same
#2041Semiconductor device
#2042Molding compound structure
#2043Semiconductor device with frame having arms and related methods
#2044Semiconductor device
#2045Semiconductor device, chip module, and semiconductor module
#2046Semiconductor device and its manufacturing method
#2047THERMALLY CONDUCTIVE COMPOSITION, SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND METHOD FOR BONDING HEATSINK
#2048Packaged electronic device having integrated antenna and locking structure
#2049Optical isolation systems and circuits and photon detectors with extended lateral P-N junctions
#2050Semiconductor device
#2051Module and manufacturing method thereof
#2052Semiconductor device comprising PN junction diode and schottky barrier diode
#2053Packaged devices with integrated antennas
#2054Package structure and manufacturing method thereof
#2055Chip package structure and manufacturing method thereof
#2056Packaged semiconductor devices and methods of packaging semiconductor devices
#2057Molding structure for wafer level package
#2058Method of manufacturing an electronic device and electronic device manufactured thereby
#2059Low cost package warpage solution
#2060Electronic document such as a chip card with reduced metallization
#2061Fluoride fluorescent material and light emitting device
#2062Method for producing an electronic module assembly and electronic module assembly
#2063Light emitting device and method of manufacturing the same
#2064Systems and methods for bonding semiconductor elements
#2065Electronic device and mounting structure of the same
#2066Semiconductor device and method of making semiconductor device
#2067Packaging assembly and method of making the same
#2068Signal isolation structures for EM communication
#2069Semiconductor package manufacturing method
#2070Semiconductor device with semiconductor chips of different sizes and manufacturing method threreof
#2071POWER MODULE SEMICONDUCTOR DEVICE AND INVERTER EQUIPMENT, AND FABRICATION METHOD OF THE POWER MODULE SEMICONDUCTOR DEVICE, AND METALLIC MOLD
#2072Integrated LED device
#2073Semiconductor device and method for producing the same
#2074Resin molding, surface mounted light emitting apparatus and methods for manufacturing the same
#2075Semiconductor module including pressure contact adjustment screws
#2076Wire bonded wide I/O semiconductor device
#2077Semiconductor package and method of fabricating the same
#2078Inductive connection structure for use in an integrated circuit
#2079Wiring structure, semiconductor package structure and semiconductor process
#2080Semiconductor device and method with clip arrangement in IC package
#2081Semiconductor package and method for fabricating a semiconductor package
#2082Wafer level flat no-lead semiconductor packages and methods of manufacture
#2083Manufacturing method for semiconductor device
#2084Tablet ultrasound system
#2085Multi-stacked electronic device with defect-free solder connection
#2086Semiconductor device and electronic apparatus
#2087Semiconductor package having multi-tier bonding wires and components directly mounted on the multi-tier bonding wires
#2088Methods, circuits and systems for a package structure having wireless lateral connections
#2089Semiconductor device, electronic component and method
#2090Electronic package structure with improved board level reliability
#2091Current sensor and method of making a current sensor
#2092Light-emitting device
#2093Light emitting device and manufacturing method thereof
#2094Multi-chip package capable of testing internal signal lines
#2095Fan-out package structure, and manufacturing method thereof
#2096Method and apparatus for forming contacts on an integrated circuit die using a catalytic adhesive
#2097Semiconductor device having semiconductor chip with large and small irregularities on upper and lower side surface portions thereof
#2098Semiconductor device and method
#2099Redistribution layer structures for integrated circuit package
#2100Method of forming a molded substrate electronic package and structure