Patents-Review.com
ClassID:

212719 ⎘

H01L2924/1816 - CPC Classification

Classification description:

Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of package parts other than the semiconductor or other solid state devices to be connected; Encapsulation; Shape Exposing the passive side of the semiconductor or solid-state body

Sub-classes:
Recent Application in this class:
#1
20250349728
2025-11-13

ENHANCED REDISTRIBUTION VIA STRUCTURE FOR RELIABILITY IMPROVEMENT IN SEMICONDUCTOR DIE PACKAGING AND METHODS FOR FORMING THE SAME

 #2
20250046753
2025-02-06

INTEGRATED CIRCUIT PACKAGE AND METHOD

 #3
20240120325
2024-04-11

STACKED PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

 #4
20220157700
2022-05-19

TWO SIDED BONDABLE LEAD FRAME

 #5
20210343680
2021-11-04

System on integrated chips and methods of forming same

 #6
20210265174
2021-08-26

Semiconductor device and manufacturing method thereof

 #7
20200152604
2020-05-14

System on integrated chips and methods of forming same

 #8
20200126880
2020-04-23

Molded wafer level packaging

 #9
20200111730
2020-04-09

Semiconductor package

 #10
20200043909
2020-02-06

Method and structure of three-dimensional chip stacking

 #11
20190372271
2019-12-05

Securing a memory card

 #12
20190355651
2019-11-21

TWO SIDED BONDABLE LEAD FRAME

 #13
20190319000
2019-10-17

Package structure and manufacturing method thereof

 #14
20190279881
2019-09-12

Semiconductor device and manufacturing method thereof

 #15
20190189547
2019-06-20

Semiconductor package

 #16
20190050703
2019-02-14

Securing a memory card

 #17
20190027465
2019-01-24

System on integrated chips and methods of forming same

 #18
20180366442
2018-12-20

Heterogenous 3D chip stack for a mobile processor

 #19
20180358288
2018-12-13

Metal core solder ball interconnector fan-out wafer level package

 #20
20180358280
2018-12-13

Methods and apparatus for thermal interface material (TIM) bond line thickness (BLT) reduction and TIM adhesion enhancement for efficient thermal management

 #21
20180340672
2018-11-29

LIGHT EMITTING MODULE AND LENS

 #22
20180294252
2018-10-11

Stacked package assembly with voltage reference plane

 #23
20180261468
2018-09-13

Semiconductor device and manufacturing method thereof

 #24
20180145015
2018-05-24

Method of fabricating packaging layer of fan-out chip package

 #25
20180068896
2018-03-08

Method of fabricating electronic package

 #26
20180019236
2018-01-18

Method and structure of three-dimensional chip stacking

 #27
20170287806
2017-10-05

Electronic device provided with a thermal dissipation member

 #28
20170271175
2017-09-21

EXPOSED DIE MOLD UNDERFILL (MUF) WITH FINE PITCH COPPER (CU) PILLAR ASSEMBLY AND BUMP DENSITY

 #29
20170263522
2017-09-14

Electronic component package having electronic component within a frame on a redistribution layer

 #30
20170263469
2017-09-14

Semiconductor package with sidewall-protected RDL interposer

 #31
20170186719
2017-06-29

SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SAME, AND ELECTRONIC APPARATUS

 #32
20170186678
2017-06-29

Fan-out chip package with dummy pattern and its fabricating method

 #33
20170125264
2017-05-04

Semiconductor device and manufacturing method thereof

 #34
20160307831
2016-10-20

METHOD OF MAKING A QFN PACKAGE

 #35
20160133593
2016-05-12

Electronic package and fabrication method thereof

 #36
20160079206
2016-03-17

Semiconductor package with a lead, package-on-package device including the same, and mobile device including the same

 #37
20150117016
2015-04-30

Light emitting module and lens

 #38
20130135823
2013-05-30

Semiconductor packages usable with a mobile device

 #39
20130037960
2013-02-14

Methods of forming bonded semiconductor structures in 3D integration processes using recoverable substrates, and bonded semiconductor structures formed by such methods

 #40
20120175706
2012-07-12

Chip-exposed semiconductor device

 #41
20110284997
2011-11-24

Chip-exposed semiconductor device and its packaging method

 #42
15643470
2018-10-09

Semiconductor package device and method of manufacturing the same

 #43
15581667
2018-02-20

Semiconductor package structure