POWER MODULES HAVING ENCAPSULATION STRESS AND STRAIN MITIGATING CONFIGURATIONS

SEMICONDUCTOR DEVICE PACKAGES, PACKAGING METHODS, AND PACKAGED SEMICONDUCTOR DEVICES

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE

Electronic chip support device and corresponding manufacturing method

Semiconductor device packages, packaging methods, and packaged semiconductor devices

SEMICONDUCTOR DEVICE

Two-step decapsulation technique for semiconductor package having silver bond wires

Package-on-package assembly with wire bonds to encapsulation surface

Sensor package structure

Semiconductor device

Semiconductor device packages, packaging methods, and packaged semiconductor devices

Package structure and manufacturing method thereof

Semiconductor device

Package structure including two joint structures including different materials and method for manufacturing the same

Semiconductor package and method of manufacturing the semiconductor package

Electronic chip support device and corresponding manufacturing method

Floating die package

Package-on-package assembly with wire bonds to encapsulation surface

Integrated semiconductor device and process for manufacturing an integrated semiconductor device

Stack packages including a fan-out sub-package

Electronic device including through conductors in sealing body

Quad flat no lead package and method of making

Method for forming a semiconductor package

Package-on-package assembly with wire bonds to encapsulation surface

Methods and modules related to shielded lead frame packages

Manufacturing method of package structure

Semiconductor device

Semiconductor device packages, packaging methods, and packaged semiconductor devices

Solid-state imaging device, manufacturing method thereof, and electronic apparatus

Method for forming a semiconductor package

Semiconductor package

Semiconductor device

Lead frame and method of manufacturing lead frame

Semiconductor package device and method of manufacturing the same

Package-on-package assembly with wire bonds to encapsulation surface

Methods and modules related to shielded lead frame packages

Semiconductor device packages, packaging methods, and packaged semiconductor devices

Integrated antenna for direct chip attach connectivity module package structures

Hall element

Stackable microelectronic package structures

Lead frame

Method for fabricating a semiconductor package

LEAD CARRIER STRUCTURE AND PACKAGES FORMED THEREFROM WITHOUT DIE ATTACH PADS

Stretchable electronics fabrication method with strain redistribution layer

Semiconductor chip package with resilient conductive paste post and fabrication method thereof

Wafer level chip scale semiconductor package

Floating die package

Package-on-package assembly with wire bonds to encapsulation surface

CARRIERLESS CHIP PACKAGE FOR INTEGRATED CIRCUIT DEVICES, AND METHODS OF MAKING SAME

Chip card manufacturing method, and chip card obtained by said method

Semiconductor device and method for making semiconductor device

Solid-state imaging device, manufacturing method thereof, and electronic apparatus

Semiconductor device packages, packaging methods, and packaged semiconductor devices

Substrate less die package having wires with dielectric and metal coatings and the method of manufacturing the same

Package structure and three dimensional package structure

Semiconductor package and fabrication method thereof

Multi-die wirebond packages with elongated windows

Electronic component, semiconductor package, and electronic device using the same

Package-on-package assembly with wire bonds to encapsulation surface

Packaged semiconductor devices having ribbon wires

Multi-chips in system level and wafer level package structure

Memory module in a package

Semiconductor package including a plurality of stacked chips

FIRST-PACKAGED AND LATER-ETCHED NORMAL CHIP THREE DIMENSION SYSTEM-IN-PACKAGE METAL CIRCUIT BOARD STRUCTURE AND PROCESSING METHOD THEREOF

Methods of fabricating QFN semiconductor package and metal plate

Quad flat no lead package and method of making

Integrated electronic package and method of fabrication

Microelectronic packages having cavities for receiving microelectronic elements

Optoelectronic package and method of manufacturing the same

Exposed die power semiconductor device

Multiple die in a face down package

Stackable microelectronic package structures

Stub minimization for multi-die wirebond assemblies with parallel windows

Stackable microelectronic package structures

Solid-state imaging device, manufacturing method thereof, and electronic apparatus

Semiconductor device and method of forming interposer frame electrically connected to embedded semiconductor die

Multi-die wirebond packages with elongated windows

Integrated camera module and method of making same

Semiconductor device sealed in a resin section and method for manufacturing the same

Memory module in a package

Package-on-package structure with reduced height

Semiconductor package with cantilever leads

Stackable microelectronic package structures

Die package structure

Optoelectronic package and method of manufacturing the same

Stacked type power device module

Electronic devices with embedded die interconnect structures, and methods of manufacture thereof

Semiconductor device and manufacturing method thereof

Multiple die in a face down package

Lead carrier with print-formed terminal pads

Stacked microelectronic packages having patterned sidewall conductors and methods for the fabrication thereof

Stacked microelectronic packages having sidewall conductors and methods for the fabrication thereof

Microelectronic packages having cavities for receiving microelectronic elements

Semiconductor package structure having an air gap and method for forming

Method of manufacturing semiconductor package having no chip pad

Semiconductor device manufacturing method and semiconductor device

Integrated circuit packaging system with encapsulation and leadframe etching and method of manufacture thereof

PROTECTIVE LAYERS IN SEMICONDUCTOR PACKAGING

Semiconductor component and corresponding production method

Package leadframe for dual side assembly

Stackable microelectronic package structures

Semiconductor device and method of forming interposer frame electrically connected to embedded semiconductor die

Semiconductor package

ELECTRONIC ASSEMBLY HAVING MIXED INTERFACE INCLUDING TSV DIE

Component assembly using a temporary attach material

Multiple die in a face down package

Manufacturing method using multi-step adhesive curing for sealed semiconductor device

Exposed die package for direct surface mounting

Stackable integrated circuit package system

Memory module in a package

Memory module in a package

De-skewed multi-die packages

Semiconductor device and method for manufacturing the same

Integrated circuit packaging system with intra substrate die and method of manufacture thereof

Semiconductor device and method of mounting die with TSV in cavity of substrate for electrical interconnect of Fi-PoP

Semiconductor wafer-to-wafer bonding for dissimilar semiconductor dies and/or wafers

METHODS AND DEVICES FOR RESCUING A DISTRESSED DIVER

LIGHT EMITTING DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

Exposed die package for direct surface mounting

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH LEVELING STANDOFF AND METHOD OF MANUFACTURE THEREOF

Semiconductor device and method of forming leadframe with notched fingers for stacking semiconductor die

LED package, method for making the LED package and light source having the same

Integrated circuit packaging system with lead frame stacking module and method of manufacture thereof

Light emitting diode package and light emitting device having the same

Manufacturing method of semiconductor device

ELECTRONIC DEVICE HAVING STACK-TYPE SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

Semiconductor package with cantilever leads

SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Integrated circuit packaging system with vertical interconnection and method of manufacture thereof

Integrated circuit packaging system with vertical interconnection and method of manufacture thereof

SEMICONDUCTOR DEVICE, ELECTRONIC APPARATUS AND SEMICONDUCTOR DEVICE FABRICATING METHOD

Semiconductor device and method of forming interposer frame electrically connected to embedded semiconductor die

Integrated circuit packaging system with connection structure and method of manufacture thereof

BACKMETAL REPLACEMENT FOR USE IN THE PACKAGING OF INTEGRATED CIRCUITS

Semiconductor device and method for manufacturing thereof

High temperature operating package and circuit design

Die pad package with a concave portion in the sealing resin

Ultra-thin quad flat no-lead (QFN) package

Thin semiconductor package and method for manufacturing same

Microelectronic packages having cavities for receiving microelectronic elements

Integrated circuit package system with offset stacked die

THIN QUAD FLAT PACKAGE WITH NO LEADS (QFN) FABRICATION METHODS

Semiconductor package with penetrable encapsulant joining semiconductor die and method thereof

Quad flat non-leaded semiconductor package and fabrication method thereof

Arrangement having at least two light-emitting semiconductor components and method for the production of such an arrangement

Integrated circuit package-in-package system with wire-in-film encapsulant and method for manufacturing thereof

CONDUCTOR PACKAGE STRUCTURE AND METHOD OF THE SAME

Semiconductor device sealed in a resin section and method for manufacturing the same

PACKAGE SUBSTRATE AND METHOD OF FABRICATING THE SAME

Integrated circuit package system employing device stacking

Integrated circuit packaging system with package stacking and method of manufacture thereof

Integrated circuit packaging system with flip chip and method of manufacture thereof

Light-emitting diode module and manufacturing method thereof

Integrated circuit package system with dual side connection and method for manufacturing thereof

Stacked integrated circuit and package system and method for manufacturing thereof

Integrated circuit packaging system with cavity and method of manufacture thereof

Methods and devices for manufacturing cantilever leads in a semiconductor package

Thermally improved semiconductor QFN/SON package

Stacked die package for peripheral and center device pad layout device

METHOD OF FORMING TAPE BALL GRID ARRAY PACKAGE

Delamination resistant packaged die having support and shaped die having protruding lip on support

Semiconductor wafer-to-wafer bonding for dissimilar semiconductor dies and/or wafers

Drop-mold conformable material as an encapsulation for an integrated circuit package system and method for manufacturing thereof

Semiconductor Package Thermal Performance Enhancement and Method

Semiconductor device and method of mounting die with TSV in cavity of substrate for electrical interconnect of Fi-PoP

Integrated circuit package system employing device stacking and method of manufacture thereof

Phosphor converting IR LEDs

Semiconductor device and method for manufacturing the same

Plastic package and method of fabricating the same

Quad flat pack in quad flat pack integrated circuit package system and method for manufacturing thereof

MULTI-DIE PACKAGE WITH IMPROVED HEAT DISSIPATION

Structure and Method for Thin Single or Multichip Semiconductor QFN Packages

Lead frame and semiconductor package having the same

Leadless integrated circuit package having standoff contacts and die attach pad

Leadless integrated circuit package having standoff contacts and die attach pad

Semiconductor device and manufacturing method thereof

Integrated circuit package system with offset stacked die

Chip package without core and stacked chip package structure

CHIP PACKAGE WITHOUT CORE AND STACKED CHIP PACKAGE STRUCTURE

Semiconductor device including bonding pads and semiconductor package including the semiconductor device

Thin quad flat package with no leads (QFN) fabrication methods

Silicon substrate and chip package structure with silicon base having stepped recess for accommodating chip

Large die package structures and fabrication method therefor

Interconnect System without Through-Holes

Very extremely thin semiconductor package

Thermally improved semiconductor QFN/SON package

Integrated circuit package system with anti-peel contact pads

Quad flat pack in quad flat pack integrated circuit package system

Leadless semiconductor chip carrier system

Stackable multi-chip package system with support structure

Semiconductor device and manufacturing method thereof

Integrated circuit package system for package stacking and manufacturing method thereof

Method for manufacturing package on package with cavity

Integrated circuit package system with supported stacked die

Stacked integrated circuit package system

System and method for stacking a plurality of electrically coupled semiconductor chips with a conductive pin

Thermally Enhanced Package with Embedded Metal Slug and Patterned Circuitry

STACKED TYPE CHIP PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME

Stacked type chip package structure including a chip package and a chip that are stacked on a lead frame

Integrated circuit package on package system

Semiconductor device and manufacturing method thereof

SEMICONDUCTOR PACKAGE

Thin quad flat package with no leads (QFN) fabrication methods

Semiconductor package with penetrable encapsulant joining semiconductor die and method thereof

Method for forming lead frame land grid array

Semiconductor package, and method of manufacturing semiconductor package

High temperature operating package and circuit design

Stacked semiconductor package assembly having hollowed substrate

Ultra thin image sensor package structure and method for fabrication

System and apparatus for wafer level integration of components

Resin-sealed semiconductor device, manufacturing method thereof, base material for the semiconductor device, and layered and resin-sealed semiconductor device

Drop-mold conformable material as an encapsulation for an integrated circuit package system

Package and Manufacturing Method for a Microelectronic Component

Integrated circuit package system with insulator over circuitry

CHIP PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

Integrated circuit package-in-package system with wire-in-film encapsulant

Semiconductor device and method for manufacturing thereof

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THEREOF

Semiconductor Package Thermal Performance Enhancement and Method

Method of manufacturing a semiconductor component with a low cost leadframe using a non-metallic base structure

Semiconductor device

Method for thin semiconductor packages

Manufacturing process for a chip package structure

Manufacturing process for a chip package structure

Electronic device having stack-type semiconductor package and method of forming the same

Semiconductor memory package

Package structure and manufacturing method thereof

STACK PACKAGE AND METHOD OF FABRICATING THE SAME

Multi-substrate region-based package and method for fabricating the same

Thin semiconductor die packages and associated systems and methods

Semiconductor device sealed in a resin section and method for manufacturing the same

Semiconductor device and method of manufacturing the same

Integrated circuit package system with multiple molding

Semiconductor Device Package Disassembly

METHOD OF PACKAGE STACKING USING UNBALANCED MOLDED TSOP

Integrated circuit package system with dual side connection

Integrated circuit package in package system with adhesiveless package attach

PACKAGE STACKING USING UNBALANCED MOLDED TSOP

CHIP PACKAGE

Integrated circuit package system employing device stacking

Integrated circuit package system having perimeter paddle

Chip package without core and stacked chip package structure

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR DEVICE PRODUCT

Semiconductor package and method for fabricating the same

Integrated circuit package system with contoured die

Microelectronic packages having cavities for receiving microelectric elements

METHOD OF PACKAGING INTEGRATED CIRCUITS

Integrated circuit package system with thin profile

Semiconductor Package, Method of Fabricating the Same and Semiconductor Package Module For Image Sensor

Stacked die package for peripheral and center device pad layout device

Same size die stacked package having through-hole vias formed in organic material

SEMICONDUCTOR CHIP PACKAGE AND METHOD OF MANUFACTURE

Plastic package and method of fabricating the same

Stacked package module and board having exposed ends

Stacked package module

Base substrate for chip scale packaging

Package structure and stacked package module using the same

Removal of integrated circuits from packages

Package structure and manufacturing method thereof

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

CMOS IMAGE SENSOR CHIP SCALE PACKAGE WITH DIE RECEIVING OPENING AND METHOD OF THE SAME

Image sensor package with die receiving opening and method of the same

SEMICONDUCTOR PACKAGE

Die package with asymmetric leadframe connection

Optical device and a method of manufacturing an optical device having a photoelectric conversion element and an optical adjustment element

Stress free package and laminate-based isolator package

STACK PACKAGE AND METHOD OF MANUFACTURING THE SAME

Mountable integrated circuit package-in-package system with adhesive spacing structures

SEMICONDUCTOR PACKAGE WITH REDISTRIBUTION LAYER OF SEMICONDUCTOR CHIP DIRECTLY CONTACTED WITH SUBSTRATE AND METHOD OF FABRICATING THE SAME

Integrated circuit package system employing thin profile techniques

Stackable integrated circuit package system

Carrierless chip package for integrated circuit devices, and methods of making same

HEAT SPREADER FOR AN ELECTRICAL DEVICE

Multi stack package and method of fabricating the same

Package structure and package substrate thereof

Integrated Circuit Package and Method for Manufacturing an Integrated Circuit Package

Chip package, method of making same and digital camera module using the package

Low profile ball grid array (BGA) package with exposed die and method of making same

Dual-die package structure having dies externally and simultaneously connected via bump electrodes and bond wires

Semiconductor device and manufacturing method thereof

Semiconductor dies and methods and apparatus to mold lock a semiconductor die

Semiconductor device, lead-frame product used for the same and method for manufacturing the same

High temperature operating package and circuit design

Stacked structure of chips and water structure for making the same

Semiconductor device, substrate for producing semiconductor device and method of producing them

Stack type ball grid array package and method for manufacturing the same

Integrated circuit package system with supported stacked die

Integrated circuit package system for package stacking and manufacturing method thereof

Stackable multi-chip package system with support structure

Electronic Device and Method For Producing the Same

Electronic component of VQFN design and method for producing the same

Integrated circuit package system with offset stacked die

Integrated circuit package, panel and methods of manufacturing the same

Heat dissipating structure and method for fabricating the same

MULTI-CHIP PACKAGE STRUCTURE

Process to reform a plastic packaged integrated circuit die

Stackable multi-chip package system

Integrated circuit package having exposed thermally conducting body

Circuit card module and method for fabricating the same

Method for fabricating semiconductor package free of substrate