212725 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of package parts other than the semiconductor or other solid state devices to be connected; Encapsulation; Connection portion, e.g. seal being an anchoring portion, i.e. mechanical interlocking between the encapsulation resin and another package part
Semiconductor device
#302Stacked package electronic device
#303Partially patterned lead frames and methods of making and using the same in semiconductor packaging
#304Method for fabricating leadless packages with mold locking characteristics
#305Integrated ball and via package and formation process
#306Leadless leadframe with an improved die pad for mold locking
#307Semiconductor device and a method of manufacturing the same
#308Semiconductor module mounting structure, a cardlike semiconductor module, and heat receiving members bonded to the cardlike semiconductor module
#309Method for maintaining solder thickness in flipchip attach packaging processes
#310Lead frame, method of manufacturing the same, semiconductor device using lead frame and method of manufacturing semiconductor device
#311Method of manufacturing hybrid integrated circuit device
#312HYBRID INTEGRATED CIRCUIT DEVICE AND MANUFACTURING METHOD THEREOF
#313Semiconductor multi-package module having inverted second package stacked over die-up flip-chip ball grid array (BGA) package
#314Semiconductor device and semiconductor module
#315Semiconductor device
#316Semiconductor chip, semiconductor device, circuit board, and electronic instrument
#317Semiconductor device
#318Circuit device
#319Circuit device
#320Rectifier diode device
#321Semiconductor device having heat radiation plate and bonding member
#322Leadless semiconductor package
#323Structure and method for fine pitch flip chip substrate
#324Methods for enclosing a thermoplastic package
#325Cutting method and method of manufacturing semiconductor device
#326Lead for integrated circuit package
#327Flange for integrated circuit package
#328Thermoplastic material
#329High frequency semiconductor module, high frequency semiconductor device and manufacturing method for the same
#330Partially patterned lead frames and methods of making and using the same in semiconductor packaging
#331Semiconductor device having overlapped via apertures
#332Power semiconductor package device having locking mechanism, and preparation method thereof
#333Integrated circuit package with stand-off legs