212725 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of package parts other than the semiconductor or other solid state devices to be connected; Encapsulation; Connection portion, e.g. seal being an anchoring portion, i.e. mechanical interlocking between the encapsulation resin and another package part
SEMICONDUCTOR PACKAGE ELECTRICAL CONTACT STRUCTURES AND RELATED METHODS
#2FAN-OUT SEMICONDUCTOR PACKAGE HAVING UNDER-BUMP METALLURGY
#3Bi-Layer Nanoparticle Adhesion Film
#4SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES
#5SEMICONDUCTOR DEVICE
#6SENSOR PACKAGES
#7SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#8SEMICONDUCTOR PACKAGE
#9RELIABLE SEMICONDUCTORS PACKAGES
#10SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREFOR
#11SEMICONDUCTOR PACKAGE WITH BINDING REINFORCEMENT LAYER
#12SEMICONDUCTOR DEVICE
#13METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE PACKAGE COMPRISING A PIN IN THE FORM OF A DRILLING SCREW
#14DIE PACKAGE WITH SEALED DIE ENCLOSURES
#15SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES
#16ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
#17SEMICONDUCTOR DEVICE
#18Semiconductor device and method for manufacturing semiconductor device
#19Packaging of a semiconductor device with a plurality of leads
#20SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
#21SEMICONDUCTOR PACKAGE
#22SEMICONDUCTOR PACKAGE
#23SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#24SEMICONDUCTOR PACKAGE ELECTRICAL CONTACT STRUCTURES AND RELATED METHODS
#25SEMICONDUCTOR DEVICE
#26SEMICONDUCTOR DEVICE
#27SEMICONDUCTOR DEVICE
#28Semiconductor device and manufacturing method therefor
#29Semiconductor package, semiconductor package manufacturing method, and electronic device
#30Semiconductor device and method for manufacturing semiconductor device
#31Semiconductor device package comprising a pin in the form of a drilling screw
#32Packaging of a semiconductor device with a plurality of leads
#33Reliable semiconductor packages
#34Semiconductor device
#35Packaging of a semiconductor device with a plurality of leads
#36Surface treatment method and apparatus for semiconductor packaging
#37Electronic module with a groove and press hole on the surface of a conductor
#38SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#39Die stack structure, semiconductor package having the same and method of manufacturing the same
#40Surface treatment method and apparatus for semiconductor packaging
#41Method of manufacturing light emitting device and light emitting device
#42Semiconductor device
#43Packaged semiconductor device having nanoparticle adhesion layer patterned into zones of electrical conductance and insulation
#44Electronic substrate and electronic apparatus
#45Semiconductor device
#46Semiconductor device and method for manufacturing semiconductor device
#47Semiconductor device
#48Semiconductor device
#49Semiconductor device and method for manufacturing semiconductor device
#50Packaging structure with recessed outer and inner lead surfaces
#51Semiconductor device, and method for manufacturing semiconductor device
#52Light emitting apparatus
#53Semiconductor device
#54Semiconductor device
#55Electronic device and method for manufacturing the same
#56Method of manufacturing light emitting device and light emitting device
#57Method of producing an optoelectronic semiconductor component, optoelectronic semiconductor component, and temporary carrier
#58Semiconductor device
#59Semiconductor device having semiconductor chip with large and small irregularities on upper and lower side surface portions thereof
#60Leadframe and method of manufacturing the same
#61Chip carrier configured for delamination-free encapsulation and stable sintering
#62Encapsulated semiconductor package and method of manufacturing thereof
#63LEAD CARRIER WITH PRINT FORMED PACKAGE COMPONENTS AND CONDUCTIVE PATH REDISTRIBUTION STRUCTURES
#64Semiconductor device and manufacturing method thereof
#65Method of manufacturing light-emitting device
#66Semiconductor light-emitting device and method for manufacturing the same
#67Semiconductor device
#68Wafer level chip scale semiconductor package
#69Power module
#70Electronic part mounting heat-dissipating substrate
#71METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
#72Power quad flat no-lead (PQFN) package in a single shunt inverter circuit
#73Semiconductor device
#74SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SAME, AND ELECTRONIC APPARATUS
#75Semiconductor device and method for manufacturing semiconductor device
#76SEMICONDUCTOR DEVICE WITH A RESIN LAYER AND METHOD OF MANUFACTURING THE SAME
#77Strip-shaped substrate for producing chip carriers, electronic module with a chip carrier of this type, electronic device with a module of this type, and method for producing a substrate
#78Light emitting device mount, leadframe, and light emitting apparatus
#79Semi-hermetic semiconductor package
#80Power semiconductor package device having locking mechanism, and preparation method thereof
#81Semiconductor device
#82Semiconductor device
#83Plated terminals with routing interconnections semiconductor device
#84Plated terminals with routing interconnections semiconductor device
#85Semiconductor device
#86Plated terminals with routing interconnections semiconductor device
#87Integrated circuit package
#88Light emitting device
#89Molded package and light emitting device
#90Electronic device and actuator using the same
#91Light emitting device mount, leadframe, and light emitting apparatus
#92Light emitting device package and light system including the same
#93Method for manufacturing semiconductor device, and semiconductor device
#94Electronic device provided with an encapsulation structure with improved electric accessibility and method of manufacturing the electronic device
#95Surface-mountable optoelectronic component and method for producing a surface-mountable optoelectronic component
#96Wire bond mold lock method and structure
#97Method for producing a plurality of optoelectronic components and optoelectronic component
#98Semiconductor device and method for manufacturing semiconductor device
#99Method for producing a multiplicity of optoelectronic semiconductor components
#100Semiconductor device having semiconductor chip with large and small irregularities on upper and lower side surface portions thereof
#101Device and method of manufacturing the same
#102Semiconductor device
#103Semiconductor package including a connecting member
#104Semiconductor device including a MOSFET and having a super-junction structure
#105Semiconductor device
#106Semiconductor device
#107Semiconductor device
#108Method of manufacturing substrate for chip packages and method of manufacturing chip package
#109Light emitting device mount, light emitting apparatus including the same, and leadframe
#110Surface treatment method and apparatus for semiconductor packaging
#111Method for preparing semiconductor devices applied in flip chip technology
#112Semiconductor device and method of manufacturing the same
#113Electronic device and semiconductor device
#114Semiconductor package and method of forming the same
#115Semiconductor package and method of fabricating the same
#116Power module
#117Lead frame including an insulating resin layer entirely covering lead surface, and semiconductor device including the same
#118Semiconductor device and method of manufacturing the same
#119Thin multi-layer LED array engine
#120Semiconductor package and method for manufacturing the same and semiconductor package module having the same
#121Protection for circuit boards
#122Semiconductor device
#123Lead carrier with multi-material print formed package components
#124Light emitting diode package and manufacturing method thereof
#125Semiconductor device and method of manufacturing the same
#126Semiconductor device and manufacturing method thereof
#127Semiconductor device
#128Mosfet package
#129Semiconductor device including a lead frame
#130Semiconductor device
#131Lead frame and semiconductor package including the same
#132Semiconductor power device having a super-junction structure
#133Semiconductor device and a method of manufacturing the same and a mounting structure of a semiconductor device
#134Method for manufacturing semiconductor device
#135Semiconductor packages and methods of fabricating the same
#136Light emitting device and method of manufacturing the light emitting device
#137PACKAGE FOR SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING THE SAME AND SEMICONDUCTOR DEVICE
#138Packaged semiconductor device having improved locking properties
#139Method of manufacturing an electronic device with a package locking system
#140Semiconductor device
#141THIN QUAD FLAT PACKAGE WITH NO LEADS (QFN) FABRICATION METHODS
#142Semiconductor device
#143Wiring board, semiconductor device and method for manufacturing the same
#144Structure for inhibiting back end of line damage from dicing and chip packaging interaction failures
#145Integrated circuit package system for electromagnetic isolation and method for manufacturing thereof
#146Circuit member, manufacturing method of the circuit member, and semiconductor device including the circuit member
#147Structure with electronic component mounted therein and method for manufacturing such structure
#148Semiconductor package with metal straps
#149Method of manufacturing a lead frame with a nickel coating
#150Semiconductor device and manufacturing method thereof
#151Light emitter
#152Semiconductor device
#153Substrate for semiconductor device, resin-sealed semiconductor device, method for manufacturing said substrate for semiconductor device and method for manufacturing said resin-sealed semiconductor device
#154Leadframe having delamination resistant die pad
#155Package and the Method for Making the Same, and a Stacked Package
#156Circuit member, manufacturing method for circuit members, semiconductor device, and surface lamination structure for circuit member
#157Semiconductor power module
#158Semiconductor device
#159PRINTED CIRCUIT BOARD AND ELECTRONIC APPARATUS HAVING A PRINTED CIRCUIT BOARD
#160Thermoplastic material
#161Semiconductor device having recess with varying width and method of manufacturing the same
#162Thin quad flat package with no leads (QFN) fabrication methods
#163Thermally enhanced thin semiconductor package
#164Lead frame and method of manufacturing the same
#165Integrated circuit package system with anti-peel contact pads
#166Electronic device and method of manufacturing same
#167Method of manufacturing semiconductor device
#168Semiconductor package which includes an insulating layer located between package substrates which may prevent an electrical short caused by a bonding wire
#169Semiconductor device
#170SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
#171Integrated circuit package system with chip on lead
#172Method of fabricating a circuit apparatus
#173PACKAGE STRUCTURE FOR RADIO FREQUENCY MODULE AND MANUFACTURING METHOD THEREOF
#174Semiconductor device
#175Leadframe having delamination resistant die pad
#176Thermoplastic-thermosetting composite and method for bonding a thermoplastic material to a thermosetting material
#177METHOD OF PRODUCING SEMICONDUCTOR PACKAGES
#178Mock bump system for flip chip integrated circuits
#179Semiconductor package having substrate ID code and its fabricating method
#180Thin quad flat package with no leads (QFN) fabrication methods
#181Integrated circuit package system with external interconnects within a die platform
#182Semiconductor device and manufacturing method thereof
#183Method for mounting an electronic component on a preferably soft support, and resulting electronic entity, such as a passport
#184LIGHT EMITTING ELEMENT, PRODUCTION METHOD THEREOF, BACKLIGHT UNIT HAVING THE LIGHT EMITTING ELEMENT, AND PRODUCTION METHOD THEREOF
#185SEMICONDUCTOR DEVICE
#186Substrate for semiconductor device, resin-sealed semiconductor device, method for manufacturing said substrate for semiconductor device and method for manufacturing said resin-sealed semiconductor device
#187Electronic device and method of manufacturing thereof
#188Method of manufacturing semiconductor device having semiconductor formation regions of different planar sizes
#189Semiconductor device
#190CIRCUIT MEMBER, MANUFACTURING METHOD OF THE CIRCUIT MEMBER, AND SEMICONDUCTOR DEVICE INCLUDING THE CIRCUIT MEMBER
#191Integrated circuit package system for electromagnetic isolation
#192Electronic device having profiled elements extending from planar surfaces
#193Semiconductor device having spacer formed on semiconductor chip connected with wire
#194Method of manufacturing a semiconductor component with a low cost leadframe using a non-metallic base structure
#195Method of manufacturing substrate
#196SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR SUBSTRATE
#197Semiconductor device and manufacturing method of the same
#198Singulated semiconductor package
#199Semiconductor package and method of assembling a semiconductor package
#200THERMALLY ENHANCED THIN SEMICONDUCTOR PACKAGE
#201STACK PACKAGE AND METHOD OF FABRICATING THE SAME
#202Package and the method for making the same, and a stacked package
#203Circuit member, manufacturing method for circuit members, semiconductor device, and surface lamination structure for circuit member
#204Substrate and manufacturing method of the same, and semiconductor device and manufacturing method of the same
#205Semiconductor device and a method of manufacturing the same and a mounting structure of a semiconductor device
#206Semiconductor package
#207Leadframe with extended pad segments between leads and die pad, and leadframe package using the same
#208Using crack arrestor for inhibiting damage from dicing and chip packaging interaction failures in back end of line structures
#209Multi-chip module
#210Semiconductor device
#211Semiconductor device and method of manufacturing semiconductor device
#212Lead structure for a semiconductor component and method for producing the same
#213Method and apparatus for fabricating a plurality of semiconductor devices
#214Semiconductor device having stress alleviating portion positioned at outer circumference of chip, wiring substrate, and method for producing the same
#215Protection For Circuit Boards
#216Surface mount electronic component and process for manufacturing same
#217SEMICONDUCTOR DEVICE AND PACKAGING STRUCTURE THEREFOR
#218Method of fabricating chip package structure
#219Chip package structure
#220Semiconductor chip structure, method of manufacturing the semiconductor chip structure, semiconductor chip package, and method of manufacturing the semiconductor chip package
#221Method of fabricating a semiconductor multi package module having an inverted package stacked over ball grid array (BGA) package
#222MOSFET package
#223FLIP CHIP IN PACKAGE USING FLEXIBLE AND REMOVABLE LEADFRAME
#224Integrated circuit package system employing a support structure with a recess
#225LDO regulator with ground connection through package bottom
#226Semiconductor package with encapsulant delamination-reducing structure and method of making the package
#227Ball grid array package structure
#228Sawn power package and method of fabricating same
#229Semiconductor module, method for manufacturing the semiconductor module and portable device carrying the same
#230Semiconductor dies and methods and apparatus to mold lock a semiconductor die
#231SEMICONDUCTOR DEVICE WITH INTERNAL HEAT SINK
#232Composite photoresist for modifying die-side bumps
#233Method for making a semiconductor multi-package module having inverted wire bond carrier second package
#234Integrated circuit package, panel and methods of manufacturing the same
#235RF power transistor having an encapsulated chip package
#236Encapsulated electronic device
#237Stacked package electronic device
#238Semiconductor device having low dielectric insulating film and manufacturing method of the same
#239Copper straps
#240Circuit apparatus and method of fabricating the apparatus
#241Power semiconductor component, power semiconductor device as well as methods for their production
#242Semiconductor power module including epoxy resin coating
#243Integrated circuit package system having interconnect stack and external interconnect
#244Semiconductor device with semiconductor device components embedded in plastic package compound
#245Flip chip in package using flexible and removable leadframe
#246Substrate and method for mounting silicon device
#247Semiconductor package with integrated heatsink and electromagnetic shield
#248Semiconductor component and apparatus for production of a semiconductor component
#249Semiconductor device
#250Semiconductor device with semiconductor device components embedded in a plastic housing composition
#251Method of fabricating a semiconductor multi-package module having inverted land grid array (LGA) package stacked over ball grid array (BGA) package
#252Method of fabricating a semiconductor assembly including chip scale package and second substrate with exposed substrate surfaces on upper and lower sides
#253Light emitting element, production method thereof, backlight unit having the light emitting element, and production method thereof
#254Method of fabricating a semiconductor multi-package module having a second package substrate with an exposed metal layer wire bonded to a first package substrate
#255Integrated circuit package system with downset lead
#256Bumped chip carrier package using lead frame and method for manufacturing the same
#257Semiconductor structure and method of manufacture
#258Encapsulation of a chip module
#259Integrated circuit package system using etched leadframe
#260Integrated circuit package system
#261Electronic device and method of manufacturing thereof
#262Electronic device and method of manufacturing same
#263Die pad for semiconductor packages and methods of making and using same
#264Power semiconductor device having lines within a housing
#265Semiconductor device
#266MOSFET package
#267MOSFET package
#268METHODS OF FABRICATING A SEMICONDUCTOR DEVICE USING A PHOTOSENSITIVE POLYIMIDE LAYER AND SEMICONDUCTOR DEVICES FABRICATED THEREBY
#269Semiconductor component and method of manufacture
#270Solder composition for electronic devices
#271Semiconductor device
#272Device, system and electric element
#273Semiconductor package without chip carrier and fabrication method thereof
#274METHOD OF FABRICATING A HIGH-DENSITY LEAD ARRANGEMENT PACKAGE STRUCTURE
#275Semiconductor device with semiconductor device components embedded in a plastics composition
#276Leadless semiconductor package
#277Semiconductor device
#278Electronic component comprising a semiconductor chip and a plastic housing, and method for producing the same
#279Thermally enhanced semiconductor package and fabrication method thereof
#280Embedded-type power semiconductor package device
#281Semiconductor device and method of manufacturing the same, metal component and method of manufacturing the same
#282Process for manufacturing sawing type leadless semiconductor packages
#283Stack semiconductor package formed by multiple molding and method of manufacturing the same
#284MOSFET package
#285MOSFET package
#286Substrate for an FBGA semiconductor component
#287Method of fabricating a semiconductor multi-package module having inverted land grid array (LGA) package stacked over ball grid array (BGA) package
#288Method of fabricating a semiconductor stacked multi-package module having inverted second package
#289Method of fabricating a semiconductor multi-package module having inverted second package stacked over die-up flip-chip ball grid array (BGA)
#290Method for making a semiconductor multi-package module having inverted bump chip carrier second package
#291Method for making semiconductor multi-package module having inverted second package and including additional die or package stacked on second package
#292Chip support of a leadframe for an integrated circuit package
#293Semiconductor multi-package module having inverted second package stacked over die-up flip-chip ball grid array (BGA) package
#294Microelectronic packages with solder interconnections
#295Encapsulated electronic device structure
#296Semiconductor package including leadframe roughened with chemical etchant to prevent separation between leadframe and molding compound
#297Semiconductor chip mounting wiring board, manufacturing method for same, and semiconductor module
#298Surface-mounting semiconductor device and method of making the same
#299Semiconductor device and its manufacturing method
#300Electronic device with semiconductor chip including a radiofrequency power module