212730 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected; Structure including thin film passive components
PROCESS FOR THIN FILM CAPACITOR INTEGRATION
#2THIN FILM CAPACITOR, ITS MANUFACTURING METHOD, AND ELECTRONIC CIRCUIT SUBSTRATE HAVING THE THIN FILM CAPACITOR
#3THIN FILM CAPACITOR AND ELECTRONIC CIRCUIT SUBSTRATE HAVING THE SAME
#4Thin film capacitor and electronic circuit substrate having the same
#5THIN FILM CAPACITOR, ITS MANUFACTURING METHOD, AND ELECTRONIC CIRCUIT SUBSTRATE HAVING THE THIN FILM CAPACITOR
#6Thin film capacitor and electronic circuit substrate having the same
#7Thin film capacitor and electronic circuit substrate having the same
#8Packaging architecture for disaggregated integrated voltage regulators
#9Semiconductor package structure and method for manufacturing the same
#10Process for thin film capacitor integration
#11Semiconductor device
#12Embedded resistor-capacitor film for fan out wafer level packaging
#13Semiconductor device
#14Semiconductor device
#15Data acquisition system-in-package
#16Data acquisition system-in-package
#17Electronic device
#18Integrated passive device for RF power amplifier package
#19Electronic device
#20Embedded resistor-capacitor film for fan out wafer level packaging
#21Semiconductor device
#22Power converter monolithically integrating transistors, carrier, and components
#23THIN FILM LC COMPONENT AND MOUNTING STRUCTURE OF SAME
#24Integrated passive device for RF power amplifier package
#25Electronic device
#26Power converter monolithically integrating transistors, carrier, and components
#27Semiconductor device and method of forming inductor over insulating material filled trench in substrate
#28Thin film capacitor and semiconductor device with improved heat dissipation
#29Semiconductor packages with thermal-enhanced conformal shielding and related methods
#30Semiconductor package and mounting structure thereof
#31Semiconductor device
#32Electronic device
#33Semiconductor substrate assembly with embedded resistance element
#34Multiple access over proximity communication
#35Semiconductor device and method of forming inductor over insulating material filled trench in substrate
#36Semiconductor packages with thermal-enhanced conformal shielding and related methods
#37Semiconductor device with resin mold
#38Electronic substrate, semiconductor device, and electronic device
#39Method of fabricating a package substrate
#40DIE PACKAGE, METHOD OF MANUFACTURING THE SAME, AND SYSTEMS INCLUDING THE SAME
#41Semiconductor device and method for forming passive circuit elements with through silicon vias to backside interconnect structures
#42Semiconductor device and method of forming IPD in fan-out wafer level chip scale package
#43Contact and contactless differential I/O pads for chip-to-chip communication and wireless probing
#44Semiconductor device with resin mold
#45Using backside passive elements for multilevel 3D wafers alignment applications
#46Substrate assembly provided with capacitive interconnections, and manufacturing method thereof
#47Method for manufacturing leadframe, packaging method for using the leadframe and semiconductor package product
#48Apparatus and method for frequency generation
#49Semiconductor device including a guard ring surrounding an inductor
#50Package substrate and fabricating method thereof
#51SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE
#52Integrated CMOS porous sensor
#53Semiconductor device and method of forming IPD in fan-out level chip scale package
#54Reconfigurable radio-frequency front-end
#55PASSIVE DEVICE, SEMICONDUCTOR MODULE, ELECTRONIC CIRCUIT BOARD, AND ELECTRONIC SYSTEM HAVING THE PASSIVE DEVICE, AND METHODS OF FABRICATING AND INSPECTING THE SEMICONDUCTOR MODULE
#56ELECTRONIC CIRCUIT WITH AN INDUCTOR
#57Transformer signal coupling for flip-chip integration
#58Method of making micromodules including integrated thin film inductors
#59Integrated power amplifier with load inductor located under IC die
#60Semiconductor Device and Method of Forming Inductor Over Insulating Material Filled Trench In Substrate
#61Electrical property altering, planar member with solder element in IC chip package
#62Apparatus and method for frequency generation
#63Electronic apparatus, power control device for controlling a heater, and method of controlling power control device
#64Method for manufacturing integrated circuit device having antenna conductors
#65RF-IC PACKAGING METHOD AND CIRCUITS OBTAINED THEREBY
#66Electronic substrate, semiconductor device, and electronic device
#67Semiconductor device and method of forming an IPD beneath a semiconductor die with direct connection to external devices
#68Semiconductor device and method for forming passive circuit elements with through silicon vias to backside interconnect structures
#69Antenna Integrated in a Semiconductor Chip
#70MAGNETIC INSULATOR NANOLAMINATE DEVICE FOR INTEGRATED SILICON VOLTAGE REGULATORS
#71Semiconductor device and method of forming embedded passive circuit elements interconnected to through hole vias
#72Apparatus and method for wafer level fabrication of high value inductors on semiconductor integrated circuits
#73Under bump metallization for on-die capacitor
#74Semiconductor device and method of forming embedded passive circuit elements interconnected to through hole vias
#75Micromodules including integrated thin film inductors
#76High performance system-on-chip inductor using post passivation process
#77Multiple access over proximity communication
#78Method of manufacturing electronic device
#79SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE
#80Hybrid capacitor
#81Semiconductor device and method of forming integrated passive device module
#82Semiconductor device with resin mold
#83Semiconductor device including a guard ring surrounding an inductor
#84Semiconductor device and method for forming passive circuit elements with through silicon vias to backside interconnect structures
#85Electronic Circuit Package
#86Semiconductor chip package and printed circuit board
#87Semiconductor memory package
#88Semiconductor package with passive elements
#89Post passivation interconnection process and structures
#90Semiconductor device and method for manufacturing the same
#91Composite semiconductor device
#92Power core devices and methods of making thereof
#93Method for manufacturing leadframe, packaging method for using the leadframe and semiconductor package product
#94THREE-DIMENSIONAL INTERCONNECT INTERPOSER ADAPTED FOR USE IN SYSTEM IN PACKAGE AND METHOD OF MAKING THE SAME
#95Semiconductor device equipped with thin-film circuit elements
#96Semiconductor device with magnetic powder mixed therein and manufacturing method thereof
#97Method for manufacturing integrated circuit device having antenna conductors
#98Voltage regulator integrated with semiconductor chip
#993D ELECTRONIC PACKAGING STRUCTURE WITH ENHANCED GROUNDING PERFORMANCE AND EMBEDDED ANTENNA
#100Post passivation interconnection process and structures
#101Multi-chip electronic circuit module and a method of manufacturing
#102Film and chip packaging process using the same
#103High performance system-on-chip using post passivation process
#104High performance system-on-chip using post passivation process
#105Electronic device and method of manufacturing the same
#106Electronic part module and method of making the same
#107Structure of wafer level package with area bump
#108High performance system-on-chip using post passivation process
#109High performance system-on-chip using post passivation process
#110High performance system-on-chip using post passivation process
#111High performance system-on-chip using post passivation process
#112High performance system-on-chip using post passivation process
#113High performance system-on-chip using post passivation process
#114High performance system-on-chip using post passivation process
#115High performance system-on-chip using post passivation process
#116High performance system-on-chip using post passivation process
#117Electronic substrate, semiconductor device, and electronic device
#118Signal transmission device
#119Thin integrated circuit device packages for improved radio frequency performance
#120Semiconductor component having plate, stacked dice and conductive vias
#121THREE-DIMENSIONAL INTERCONNECT INTERPOSER ADAPTED FOR USE IN SYSTEM IN PACKAGE AND METHOD OF MAKING THE SAME
#122Metal-Insulator-Metal (MIM) Capacitors Formed Beneath First Level Metallization and Methods of Forming Same
#123Fabrication of inductors in transformer based tank circuitry
#124Communication board
#125Non-uniform decoupling capacitor distribution for uniform noise reduction across chip
#126Method for fabricating semiconductor components with thinned substrate, circuit side contacts, conductive vias and backside contacts
#127Micro electric power converter
#128Multilayer substrate and method for producing same
#129Semiconductor apparatus
#130Semiconductor component having plate and stacked dice
#131Modular construction component with encapsulation
#132RF passive circuit and RF amplifier with via-holes
#133Post passivation interconnection structures
#134Post passivation interconnection process and structures
#135Post passivation interconnection process and structures
#136Integrated passive devices
#137High performance system-on-chip discrete components using post passivation process
#138Trench capacitor power supply system and method
#139High performance system-on-chip using post passivation process
#140High performance system-on-chip discrete components using post passivation process
#141Multi-dice chip scale semiconductor components