H01L2924/1901 - CPC Classification Index

ClassID:

212728 ⎘

H01L2924/1901 - CPC Classification

Classification description:

Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected Structure

Sub-classes:

H01L2924/19011 » including integrated passive components 363
H01L2924/19015 » including thin film passive components 138
H01L2924/1902 » including thick film passive components 15
H01L2924/1903 » including wave guides 201
H01L2924/1904 » Component type 14

Recent Application in this class:

20250118688

2025-04-10

CHIP PACKAGING STRUCTURE

20130037928

2013-02-14

Semiconductor package and system

20120194301

2012-08-02

Capacitive coupler packaging structure

20110108975

2011-05-12

Semiconductor package and system