212733 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected; Structure including wave guides being a strip line type
CHIP PACKAGES INCLUDING SUBSTRATE INTEGRATED WAVEGUIDES
#2Electronic device and semiconductor device
#3Reconstituted wafer including mold material with recessed conductive feature
#4High frequency module, board equipped with antenna, and high frequency circuit board
#5Signal routing carrier
#6Semiconductor devices comprising planar waveguide transmission lines
#7Methods for forming microwave tunable composited thin-film dielectric layer
#8Amplifiers and amplifier modules with ground plane height variation structures
#9INTEGRATED CIRCUIT CHIP PACKAGING
#10INTEGRATED CIRCUIT CHIP PACKAGING
#11Circularly-polarized dielectric waveguide launch for millimeter-wave data communication
#12Amplifiers and amplifier modules with ground plane height variation structures
#13High-density triple diamond stripline interconnects
#14Antenna apparatus having bond wires
#15High frequency module, board equipped with antenna, and high frequency circuit board
#16Integrated circuit chip packaging
#17Integrated circuit chip packaging including a heat sink topped cavity
#18Package structure including a package substrate having an integrated waveguide coupled to first and second integrated circuits, where the package substrate is mounted to an application board
#19Waveguide including first and second metal plates and having a slotted feed to waveguide transition disposed in the first metallic plate
#20Semiconductor wafer including an integrated waveguide for communicating signals between first and second integrated circuit dies
#21Packages with passive devices and methods of forming the same
#22Packages with passive devices and methods of forming the same
#23Integrated circuit chip packaging