212734 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected; Structure including wave guides being a microstrip line type
SEMICONDUCTOR STRUCTURE HAVING MULTIPLE DIELECTRIC WAVEGUIDE CHANNELS AND METHOD FOR FORMING SEMICONDUCTOR STRUCTURE
#2ANTENNA IN PACKAGE HAVING ANTENNA ON PACKAGE SUBSTRATE
#3SEMICONDUCTOR MODULE
#4SEMICONDUCTOR STRUCTURE HAVING MULTIPLE DIELECTRIC WAVEGUIDE CHANNELS AND METHOD FOR FORMING SEMICONDUCTOR STRUCTURE
#5Package for a semiconductor device
#6Impedance controlled electrical interconnection employing meta-materials
#7Semiconductor packages
#8Antenna in package having antenna on package substrate
#9Distributed inductance integrated field effect transistor structure
#10Semiconductor packages
#11Semiconductor device
#12Semiconductor devices comprising planar waveguide transmission lines
#13Semiconductor structure having multiple dielectric waveguide channels and method for forming semiconductor structure
#14Package with side-radiating wave launcher and waveguide
#15Methods for forming microwave tunable composited thin-film dielectric layer
#16RF power amplifier pallet
#17Impedance controlled electrical interconnection employing meta-materials
#18Amplifier with integrated directional coupler
#19Semiconductor structure along with multiple chips bonded through microbump and manufacturing method thereof
#20Semiconductor structure having multiple dielectric waveguide channels and method for forming semiconductor structure
#21Semiconductor chip
#22Stiffener and package substrate for a semiconductor package
#23Antenna structure with integrated coupling element and semiconductor package using the same
#24Microwave antenna apparatus and package
#25Semiconductor structure including plurality of chips along with air gap and manufacturing method thereof
#26Semiconductor device
#27Semiconductor package with integrated harmonic termination feature
#28Semiconductor device
#29Electronic device including coupling structure along with waveguide, and electronic equipment
#30Gateless switch with capacitively-coupled contacts
#31Package structure including a package substrate having an integrated waveguide coupled to first and second integrated circuits, where the package substrate is mounted to an application board
#32Waveguide including first and second metal plates and having a slotted feed to waveguide transition disposed in the first metallic plate
#33Semiconductor wafer including an integrated waveguide for communicating signals between first and second integrated circuit dies
#34High-frequency circuit package and sensor module
#35Impedance controlled electrical interconnection employing meta-materials
#36Semiconductor device, transmission system, method for manufacturing semiconductor device, and method for manufacturing transmission system
#37Semiconductor device and radio communication device
#38Integrated circuit package
#39Gateless switch with capacitively-coupled contacts
#40Semiconductor device and radio communication device
#41Low cost high frequency device package and methods
#42MICROWAVE UNIT AND METHOD THEREFORE
#43Method of making a high frequency device package
#44Impedance controlled electrical interconnection employing meta-materials
#45Circuit board, high frequency module, and radar apparatus
#46Impedance transformer, integrated circuit device, amplifier, and communicator module
#47Method of manufacturing high frequency receiving and/or transmitting devices from low temperature co-fired ceramic materials and devices made therefrom
#48High-frequency circuit package and sensor module
#49High-frequency circuit package and sensor module
#50Vertical transmission line structure that includes bump elements for flip-chip mounting
#51Multilayer wiring board
#52DEVICE AND INTERCONNECT IN FLIP CHIP ARCHITECTURE
#53Integrated RF ESD protection for high frequency circuits
#54Highly integrated miniature radio frequency module
#55Multiple substrate electrical circuit device
#56Interconnection device for electronic circuits, notably microwave electronic circuits
#57FLEXIBLE JOINT
#58Circuit device including a nano-composite dielectric film
#59SEMICONDUCTOR DEVICE, TRANSMISSION SYSTEM, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING TRANSMISSION SYSTEM
#60Coupled microstrip lines with ground planes having ground strip shields and ground conductor extensions
#61MICROWAVE CIRCUIT ASSEMBLY
#62Gateless switch with capacitively-coupled contacts
#63Integrated circuit with improved transmission line structure and electromagnetic shielding between radio frequency circuit paths
#64Ultra wideband system-on-package
#65Input/output package architectures
#66Input/output package architectures, and methods of using same
#67Radio-frequency package
#68Semiconductor device and radio communication device
#69Method and system for communicating via flip-chip die and package waveguides
#70Vertical transmission line structure that includes bump elements for flip-chip mounting
#71Semiconductor device having wiring formed on wiring board and electric conductor formed in wiring board and conductor chip formed over wiring
#72HIGH FREQUENCY SEMICONDUCTOR CIRCUIT DEVICE
#73Semiconductor integrated circuit
#74Differential internally matched wire-bond interface
#75Integrated RF ESD protection for high frequency circuits
#76Noise reduction circuit for canceling leakage signal
#77Low cost high frequency device package and methods
#78Electronic device
#79High speed electrical interconnects and method of manufacturing thereof
#80Microwave communication package
#81Through-chip via interconnects for stacked integrated circuit structures
#82PACKAGE STRUCTURE FOR A HIGH-FREQUENCY ELECTRONIC COMPONENT
#83Strip patterned transmission line
#84Mounting device for high frequency microwave devices
#85Millimeter waveband transceiver, radar and vehicle using the same
#86Semiconductor device including microstrip line and coplanar line
#87System, device and method for reducing cross-talk in differential signal conductor pairs
#88Low loss electrical delay line
#89High frequency module
#90Reducing layer count in semiconductor packages
#91Semiconductor integrated circuit device and method for fabricating the same
#92Semiconductor device
#93Semiconductor device and radio communication device
#94Circuit structure of package substrate
#95Multi-layered high-speed printed circuit boards comprised of stacked dielectric systems
#96Semiconductor device
#97High speed electrical interconnects and method of manufacturing
#98Split-gate power module for suppressing oscillation therein
#99System in package
#100Mounting device for high frequency microwave devices
#101Integrated circuit package substrate with microstrip architecture and electrically grounded surface conductive layer