212735 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected; Structure including wave guides being a coplanar line type
SEMICONDUCTOR PACKAGE
#2Manufacturing method of semiconductor package
#3High density interconnection and wiring layers, package structures, and integration methods
#4Semiconductor package and manufacturing method thereof
#5Systems and processes for increasing semiconductor device reliability
#6In-package RF waveguides as high bandwidth chip-to-chip interconnects and methods for using the same
#7Single layer radio frequency integrated circuit package and related low loss grounded coplanar transmission line
#8Systems and processes for increasing semiconductor device reliability
#9Antenna in package device having substrate stack
#10Semiconductor devices comprising planar waveguide transmission lines
#11In-package RF waveguides as high bandwidth chip-to-chip interconnects and methods for using the same
#12Semiconductor chip
#13Integrated chip scale packages
#14Integrated chip scale packages
#15Package structure including a package substrate having an integrated waveguide coupled to first and second integrated circuits, where the package substrate is mounted to an application board
#16Waveguide including first and second metal plates and having a slotted feed to waveguide transition disposed in the first metallic plate
#17Semiconductor wafer including an integrated waveguide for communicating signals between first and second integrated circuit dies
#18Adjustable integrated circuit antenna structure
#19Packages with passive devices and methods of forming the same
#20Packages with passive devices and methods of forming the same
#21Electronic circuit, method of manufacturing electronic circuit, and mounting member
#22Adjustable integrated circuit antenna structure
#23Low cost high frequency device package and methods
#24Integrated circuit with intra-chip clock interface and methods for use therewith
#25Method of making a high frequency device package
#26Monolithic microwave integrated circuit
#27High-frequency circuit package and high-frequency circuit device
#28Circuit board, high frequency module, and radar apparatus
#29Integrated circuit with supply line intra-chip clock interface and methods for use therewith
#30Adjustable integrated circuit antenna structure
#31High frequency flip chip package structure of polymer substrate
#32High frequency wiring board comprised of interconnected first and second coplanar lines on different layers and having a ground pattern physically separated therefrom
#33Vertical transmission line structure that includes bump elements for flip-chip mounting
#34Integrated RF ESD protection for high frequency circuits
#35Integrated circuit
#36Method of fabricating passive device applied to the three-dimensional package module
#37Receive circuit for connectors with variable complex impedance
#38High frequency flip chip package process of polymer substrate and structure thereof
#39SEMICONDUCTOR DEVICE
#40Ultra wideband hermetically sealed surface mount technology for microwave monolithic integrated circuit package
#41Packaging millimeter wave modules
#42Semiconductor device in which a semiconductor chip is sealed
#43Ultra wideband system-on-package
#44Coplanar waveguide having trenches covered by a passivation film and fabrication method thereof
#45Coplaner waveguide and fabrication method thereof
#46Method and system for communicating via flip-chip die and package waveguides
#47Vertical transmission line structure that includes bump elements for flip-chip mounting
#48Chip arrangement and a method of determining an inductivity compensation structure for compensating a bond wire inductivity in a chip arrangement
#49Integrated circuit with supply line intra-chip clock interface and methods for use therewith
#50Integrated RF ESD protection for high frequency circuits
#51Low cost high frequency device package and methods
#52Integrated circuit with intra-chip clock interface and methods for use therewith
#53Power recovery circuit based on partial standing waves
#54FREQUENCY DIVISION COUPLING CIRCUIT AND APPLICATIONS THEREOF
#55High speed electrical interconnects and method of manufacturing thereof
#56High speed electronics interconnect having a dielectric system with air holes of varying diameters and spans
#57IC HAVING IN-TRACE ANTENNA ELEMENTS
#58High speed interconnect and method of manufacture
#59High speed interconnection system having a dielectric system with polygonal arrays of holes therein
#60Interconnection system with a dielectric system having holes therein that run uninterrupted through the dielectric system
#61Interconnection system with a dielectric system having holes therein that run uninterrupted through the dielectric system
#62Through-chip via interconnects for stacked integrated circuit structures
#63Three-dimensional package module
#64Semiconductor chip mounting board with multiple ports
#65Semiconductor device and method of manufacturing the same
#66Integrated circuit antenna structure
#67Adjustable integrated circuit antenna structure
#68High power shunt switch with high isolation and ease of assembly
#69Semiconductor device with signal line having decreased characteristic impedance
#70Glass material for radio-frequency applications
#71Monolithic integrated circuit with integrated interference suppression device
#72High frequency integrated circuit (HFIC) microsystems assembly and method for fabricating the same
#73MULTI-CHIP BALL GRID ARRAY PACKAGE
#74High density package interconnect wire bond strip line and method therefor
#75Semiconductor device with signal line having decreased characteristic impedance
#76Method for producing a component comprising a conductor structure that is suitable for use at high frequencies
#77High-frequency circuit
#78Semiconductor device and a method of manufacturing the same
#79High-speed signaling interface and method for communicating across across an interface