212737 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected; Structure including wave guides being a hybrid line type impedance transition between different types of wave guides
SEMICONDUCTOR STRUCTURE HAVING MULTIPLE DIELECTRIC WAVEGUIDE CHANNELS AND METHOD FOR FORMING SEMICONDUCTOR STRUCTURE
#2SEMICONDUCTOR STRUCTURE HAVING MULTIPLE DIELECTRIC WAVEGUIDE CHANNELS AND METHOD FOR FORMING SEMICONDUCTOR STRUCTURE
#3Semiconductor structure having multiple dielectric waveguide channels and method for forming semiconductor structure
#4Semiconductor structure having multiple dielectric waveguide channels and method for forming semiconductor structure
#5Circularly-polarized dielectric waveguide launch for millimeter-wave data communication
#6Package structure including a package substrate having an integrated waveguide coupled to first and second integrated circuits, where the package substrate is mounted to an application board
#7Waveguide including first and second metal plates and having a slotted feed to waveguide transition disposed in the first metallic plate
#8Semiconductor wafer including an integrated waveguide for communicating signals between first and second integrated circuit dies
#9Semiconductor device, transmission system, method for manufacturing semiconductor device, and method for manufacturing transmission system
#10Electronic circuit, method of manufacturing electronic circuit, and mounting member
#11Microelectronic assembly with an embedded waveguide adapter and method for forming the same
#12System and method for integrated waveguide packaging
#13High frequency amplifier
#14Transition from a chip to a waveguide port
#15High-frequency circuit package and high-frequency circuit device
#16Package for housing semiconductor element and semiconductor device using the same
#17Microelectronic assembly with an embedded waveguide adapter and method for forming the same
#18High frequency amplifier
#19Microwave module
#20SEMICONDUCTOR DEVICE, TRANSMISSION SYSTEM, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING TRANSMISSION SYSTEM
#21Simple radio frequency integrated circuit (RFIC) packages with integrated antennas
#22High-frequency circuit board, high-frequency circuit module, and radar apparatus
#23System and method for integrated waveguide packaging
#24Multilayer dielectric substrate and semiconductor package
#25Memory Packages Having Stair Step Interconnection Layers
#26Microwave communication package
#27Low-loss interface
#28Tapered dielectric and conductor structures and applications thereof
#29Semiconductor chip mounting board with multiple ports
#30Millimeter waveband transceiver, radar and vehicle using the same
#31High frequency line-to-waveguide converter and high frequency package
#32Multilayer dielectric substrate and semiconductor package
#33Thickness tapered substrate launch
#34Memory packages having stair step interconnection layers
#35High-frequency circuit
#36Integrated circuit and method for manufacturing same
#37Tapered dielectric and conductor structures and applications thereof
#38Method of fabricating the routing of electrical signals