212743 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected; Shape Impedance matching structure [e.g. balun]
SEMICONDUCTOR DEVICE
#2Package for a semiconductor device
#3High-density flip chip package for wireless transceivers
#4BIOLOGICAL INFORMATION MONITORING APPARATUS AND MRI APPARATUS
#5High-density flip chip package for wireless transceivers
#6Semiconductor device
#7Reduced-length bond pads for broadband power amplifiers
#8AMPLIFIERS WITH BROADBAND IMPEDANCE MATCHING AND METHODS OF MANUFACTURE THEREOF
#9Microelectronic assemblies having front end under embedded radio frequency die
#10Memory packages and related semiconductor packages
#11Integrated passive device for RF power amplifier package
#12Semiconductor package having stacked substrates with cavities
#13Integrated passive device for RF power amplifier package
#14Semiconductor structure
#15Chip on chip attach (passive IPD and PMIC) flip chip BGA using new cavity BGA substrate
#16Gateless switch with capacitively-coupled contacts
#17Power amplifier device for a magnetic resonance device and magnetic resonance device
#18Ground shield structure and semiconductor device
#19Patterned ground shield structures and semiconductor devices
#20Integrated circuit package
#21Leadframe for semiconductor packages
#22Gateless switch with capacitively-coupled contacts
#23Package with integrated pre-match circuit and harmonic suppression
#24Electronic device
#25Antenna device and wireless apparatus
#26Integrated circuit die stacks with translationally compatible vias
#27IC package with embedded filters
#28Device housing package and mounting structure
#29Compensation network for RF transistor
#30DIE DOWN DEVICE WITH THERMAL CONNECTOR
#31MILLIMETER DEVICES ON AN INTEGRATED CIRCUIT
#32High-frequency module including a conductor with a slot therein and a conductive wire crossing over the slot and physically contacting the conductor
#33Wiring board
#34High power semiconductor device for wireless applications and method of forming a high power semiconductor device
#35Interconnect pattern for transceiver package
#36SEMICONDUCTOR DEVICE
#37Passive coupler between package substrate and system board
#38High-speed ceramic modules with hybrid referencing scheme for improved performance and reduced cost
#39Wireless apparatus having shielding function
#40Integrated circuit die stacks with translationally compatible vias
#41Semiconductor die-based packaging interconnect
#42Electronic device
#43Highly integrated miniature radio frequency module
#44High frequency field-effect transistor
#45High Frequency Wiring Board, Package for Housing Electronic Component, Electronic Device, and Communication Apparatus
#46Method and system for a configurable tuned MOS capacitor
#47Receive circuit for connectors with variable complex impedance
#48Semiconductor package to remove power noise using ground impedance
#49Electronic system having field effect transistors and interconnect bumps on a semiconductor substrate
#50SEMICONDUCTOR DEVICE
#51Semiconductor device having finger electrodes
#52Capacitance Compensation System
#53Method and system for on-chip impedance control to impedance match a configurable front end
#54Coupled microstrip lines with ground planes having ground strip shields and ground conductor extensions
#55Semiconductor device having wiring layers with power-supply plane and ground plane
#56MICROWAVE CIRCUIT ASSEMBLY
#57LEADFRAME FOR SEMICONDUCTOR PACKAGES
#58WIDE BAND FILTER STRUCTURE
#59Gateless switch with capacitively-coupled contacts
#60High frequency semiconductor device
#61Multi-port memory device having serial input/output interface
#62Method for transmission lines using meta-materials
#63Semiconductor device in which a semiconductor chip is sealed
#64Integrated circuit and method for manufacturing an integrated circuit
#65High frequency amplifying device
#66Semiconductor device and semiconductor integrated circuit
#67Transmission circuit
#68Return loss techniques in wirebond packages for high-speed data communications
#69Bonded wafer package module
#70Design method of semiconductor package substrate to cancel a reflected wave
#71Reduced inductance interconnect for enhanced microwave and millimeter-wave systems
#72Semiconductor device having wiring formed on wiring board and electric conductor formed in wiring board and conductor chip formed over wiring
#73High frequency power amplifier
#74RF transistor output impedance technique for improved efficiency, output power, and bandwidth
#75Chip arrangement and a method of determining an inductivity compensation structure for compensating a bond wire inductivity in a chip arrangement
#76Broadband Power Amplifier with A High Power Feedback Structure
#77Differential internally matched wire-bond interface
#78Semiconductor power device with bias circuit
#79Noise reduction circuit for canceling leakage signal
#80Method and system for filters embedded in an integrated circuit package
#81Integrated circuit package for high-speed signals
#82Packaged gallium nitride material transistors and methods associated with the same
#83Semiconductor device and method for adjusting characteristics thereof
#84Method and System for Providing a Continuous Impedance Along a Signal Trace in an IC Package
#85Reduced inductance interconnect for enhanced microwave and millimeter-wave systems
#86Semiconductor circuit, and computing device and communications device using the same
#87Multilayer wiring substrate, method of manufacturing the same, and semiconductor device
#88Semiconductor integrated circuit package, printed circuit board, semiconductor apparatus, and power supply wiring structure
#89Structure for on chip shielding structure for integrated circuits or devices on a substrate
#90Multi-Stage RF Amplifier Including MMICs and Discrete Transistor Amplifiers in a Single Package
#91Apparatus for crack prevention in integrated circuit packages
#92Enhanced substrate using metamaterials
#93Method And System for Output Matching of Rf Transistors
#94Circuit and method for adjusting impedance
#95CHIP PACKAGE
#96Semiconductor device and signal terminating method thereof
#97Semiconductor device
#98Strip patterned transmission line
#99System, device and method for reducing cross-talk in differential signal conductor pairs
#100Multi-port memory device having serial input/output interface
#101Electronic component package
#102SEMICONDUCTOR DEVICE
#103Metal-base circuit board and its manufacturing method
#104Integrated circuit stacking system with integrated passive components
#105Packaging for high speed integrated circuits
#106LEADFRAME FOR SEMICONDUCTOR PACKAGES
#107Semiconductor device, power amplifier device and PC card
#108Packaging for high speed integrated circuits
#109Packaging for high speed integrated circuits
#110Packaging for high speed integrated circuits
#111Packaging for high speed integrated circuits
#112Packaging for high speed integrated circuits
#113Packaging for high speed integrated circuits
#114Integrated circuit device including interface circuit and electronic apparatus
#115High frequency semiconductor device
#116On-chip circuit pad structure
#117Chip package and electrical connection structure between chip and substrate
#118Close proximity tunable inductive elements