212750 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected; Disposition of discrete passive components in a mirrored arrangement on two different side of a common die mounting substrate
Semiconductor chip package with undermount passive devices
#302Integrated circuit packaging system with stacked configuration and method of manufacture thereof
#303Package substrate
#304Super capacitor casing and supercapacitor embedded device
#305Method of attaching an electronic device to an MLCC having a curved surface
#306Component-containing module
#307Chip component mounted wiring board
#308ELECTRONIC COMPONENT MOUNTING STRUCTURE AND ELECTRONIC COMPONENT MOUNTING METHOD
#309Apparatus having thermal-enhanced and cost-effective 3D IC integration structure with through silicon via interposers
#310Semiconductor apparatus with decoupling capacitor
#311Method for packing electric components on a substrate
#312Semiconductor device and manufacturing method of a semiconductor device
#313Wiring board and method of manufacturing the same
#314Semiconductor device and method of forming vertical interconnect structure in substrate for IPD and baseband circuit separated by high-resistivity molding compound
#315Module and mounted structure using the same
#316Capacitor Die Design for Small Form Factors
#317Printed circuit board
#318Multilayer printed wiring board
#319Electronic control device
#320Printed wiring board and method for manufacturing the same
#321Stacked die semiconductor device having circuit tape
#322Coreless substrate, method of manufacturing same, and package for microelectronic device incorporating same
#323Bare die package with displacement constraint
#324Method of manufacturing stack-type semiconductor device and method of manufacturing stack-type electronic component
#325Method for producing an LTCC substrate
#326Planar interconnect structure for hybrid circuits
#327Manufacturing method of multilayer printed wiring board
#328Integrated circuit package system with locking terminal
#329CHIP CAPACITOR PRECURSORS, PACKAGED SEMICONDUCTORS, AND ASSEMBLY METHOD FOR CONVERTING THE PRECURSORS TO CAPACITORS
#330Multilayer printed wiring board
#331Semiconductor device and method of forming UBM fixed relative to interconnect structure for alignment of semiconductor die
#332Method and system for a balun embedded in an integrated circuit package
#333Semiconductor device and method of manufacturing the same
#334STACKED SEMICONDUCTOR APPARATUS, SYSTEM AND METHOD OF FABRICATION
#335PACKAGED INTEGRATED CIRCUITS HAVING SURFACE MOUNT DEVICES AND METHODS TO FORM PACKAGED INTEGRATED CIRCUITS
#336Semiconductor apparatus with decoupling capacitor
#337Wiring board and method of manufacturing the same
#338Multilayer printed wiring board
#339Semiconductor device having decoupling capacitor formed on substrate where semiconductor chip is mounted
#340Three dimensional packaging optimized for high frequency circuitry
#341Method of attaching an electronic device to an MLCC having a curved surface
#342Package substrate including surface mount component mounted on a peripheral surface thereof and microelectronic package including same
#343Integrated circuit package-in-package system with carrier interposer
#344STRUCTURE ON CHIP PACKAGE TO SUBSTANTIALLY MATCH STIFFNESS OF CHIP
#345Mounting method
#346Semiconductor die package with internal bypass capacitors
#347COMPRESSION BONDING DEVICE
#348Communication module having tuner units that are separated and isolated from each other, and method of manufacturing the same
#349ELECTRONIC APPARATUS
#350ELECTRONIC COMPONENT MODULE AND METHOD OF MANUFACTURING THE SAME
#351MULTILAYER PRINTED WIRING BOARD
#352Composite ceramic substrate
#353PLANAR INTERCONNECT STRUCTURE FOR HYBRID CIRCUITS
#354Land grid array semiconductor package
#355SEMICONDUCTOR DEVICE INCLUDING WIRING SUBSTRATE HAVING ELEMENT MOUNTING SURFACE COATED BY RESIN LAYER
#356Package-on-package secure module having anti-tamper mesh in the substrate of the upper package
#357Solid-state image sensing device
#358High-frequency module
#359Electronics Package And Manufacturing Method Thereof
#360ELECTRONIC PACKAGE STRUCTURE
#361ELECTRONIC PACKAGE STRUCTURE
#362Printed circuit board
#363Printed circuit board
#364Ceramic interposer with silicon voltage regulator and array capacitor combination for integrated circuit packages
#365Array capacitor for decoupling multiple voltages
#366Wiring board manufacturing method
#367Interconnecting board and three-dimensional wiring structure using it
#368Integrated circuit package with improved power signal connection
#369Method of Manufacturing a Ignition Device and a Semiconductor Device
#370SEMICONDUCTOR PACKAGE MANUFACTURING METHOD AND SEMICONDUCTOR APPARATUS
#371Semiconductor device, method of manufacturing the same
#372Reworkable passive element embedded printed circuit board
#373Circuit module with interposer and method for manufacturing the same
#374Stacked die semiconductor device having circuit tape
#375Printed circuit board
#376Module and mounted structure using the same
#377Semiconductor device including semiconductor element surrounded by an insulating member and wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof
#378Stack microelectronic assemblies
#379Capacitor sheet and electronic circuit board
#380Semiconductor device including semiconductor element surrounded by an insulating member wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof
#381High-frequency module
#382Semiconductor apparatus with decoupling capacitor
#383Interposer containing bypass capacitors for reducing voltage noise in an IC device
#384Semiconductor Device and Method for Manufacturing the Same
#385Circuit board arrangement
#386Semiconductor device having high cooling efficiency and method for manufacturing the same
#387Multilayer electronic component, electronic device, and method for manufacturing multilayer electronic component
#388Semiconductor device having multilayer printed wiring board and manufacturing method of the same
#389Method for manufacturing stacked package structure
#390Inductor element and method for production thereof, and semiconductor module with inductor element
#391Semiconductor Device and Method of Manufacturing the Same, Circuit Board and Electronic Device
#392SEMICONDUCTOR DEVICE HAVING STACKED STRUCTURE AND METHOD OF MANUFACTURING THE SAME
#393Semiconductor device and manufacturing method of a semiconductor device
#394PACKAGE WARPAGE CONTROL
#395Image sensor packaging structure and method of manufacturing the same
#396Ceramic multilayer substrate
#397Electronic circuit module and method for fabrication thereof
#398Semiconductor chip package with attached electronic devices, and integrated circuit module having the same
#399Semiconductor package structure and fabrication method thereof
#400Semiconductor package structure and fabrication method thereof
#401PACKAGE WARPAGE CONTROL
#402Electronic micromodule and method for manufacturing the same
#403Method and system for increasing circuitry interconnection and component capacity in a multi-component package
#404Semiconductor device and method of manufacturing the same
#405Semiconductor device and method of manufacturing the same
#406Semiconductor/printed circuit board assembly, and computer system
#407Integrated circuit package with improved power signal connection
#408Packaged electronic element and method of producing electronic element package
#409Electronic device cooling device and electronic device cooling method
#410Capacitor interconnection
#411Electronic component packaging structure and method for producing the same
#412Electronic apparatus
#413Microelectronic package having direct contact heat spreader and method of manufacturing same
#414Method for reducing loadline impedance in a system
#415Electronic plug unit
#416Method for forming component mounting hole in semiconductor substrate
#417Electronic circuit module and manufacturing method thereof
#418Multilayer printed wiring board
#419Laminated electronic component and method for producing the same
#420SACRIFICIAL COMPONENT
#421Module with built-in component
#422Multilayer electronic component and structure for mounting multilayer electronic component
#423Non-uniform decoupling capacitor distribution for uniform noise reduction across chip
#424Package and method for attaching an integrated heat spreader
#425Electronic component including a shielding metal film disposed on a resin layer
#426Electronic substrate manufacturing method, semiconductor device manufacturing method, and electronic equipment manufacturing method
#427INTEGRATED CAPACITOR FOR WAFER LEVEL PACKAGING APPLICATIONS
#428Semiconductor device
#429Three dimensional packaging optimized for high frequency circuitry
#430Multilayer printed wiring board
#431Multilayer printed wiring board
#432Systems and methods for reducing simultaneous switching noise in an integrated circuit
#433Capacitor with co-planar electrodes
#434Method of manufacturing stack-type semiconductor device and method of manufacturing stack-type electronic component
#435Semiconductor stacked package assembly having exposed substrate surfaces on upper and lower sides
#436Capacitive element, semiconductor device, and method of manufacturing the capacitive element
#437Circuit substrate and its manufacturing method
#438Semiconductor package with passive device integration
#439Capacitor parts
#440Semiconductor device, method of manufacturing the same, capacitor structure, and method of manufacturing the same
#441Economical high-frequency package
#442Interconnection structure through passive component
#443Capacitor design for controlling equivalent series resistance
#444Capacitor pad network to manage equivalent series resistance
#445Substrate for semiconductor devices and semiconductor device
#446IC substrate with over voltage protection function
#447IC substrate with over voltage protection function
#448Ball grid array IC substrate with over voltage protection function
#449IC substrate with over voltage protection function
#450IC substrate with over voltage protection function
#451Semiconductor device with a substrate having a spiral shaped coil
#452Semiconductor device
#453Capacitor having an anodic metal oxide substrate
#454Package unit, printed board having the same, and electronic apparatus having the printed board
#455Wiring board manufacturing method
#456Multilayer printed wiring board and manufacturing method of the multilayer printed wiring board
#457Multilayered chip capacitor array
#458System to control effective series resistance of decoupling capacitor
#459Land grid array module
#460Array capacitor with resistive structure
#461Method and system for a pad structure for use with a semiconductor package
#462System to control effective series resistance of power delivery circuit
#463Array capacitor apparatuses to filter input/output signal
#464Array capacitor with IC contacts and applications
#465Input/output routing on an electronic device
#466Packaging method, packaging structure and package substrate for electronic parts
#467Circuit board with a thin-film layer configured to accommodate a passive element
#468Method for manufacturing electronic component-mounted board
#469Wiring substrate and semiconductor device using the same
#470Semiconductor device having multilayer printed wiring board
#471Voltage droop suppressing circuit
#472Image sensor packaging structure
#473Reducing loadline impedance in a system
#474Stacked semiconductor device and semiconductor memory module
#475Silicon building block architecture with flex tape
#476Leadframe with a chip pad for two-sided stacking and method for manufacturing the same
#477Voltage droop suppressing active interposer
#478Interposer containing bypass capacitors for reducing voltage noise in an IC device
#479Semiconductor die package with internal bypass capacitors
#480Apparatus for providing capacitive decoupling between on-die power and ground conductors
#481Package warpage control
#482Capacitor-built-in type printed wiring substrate, printed wiring substrate, and capacitor
#483Substrate, semiconductor device, and substrate fabricating method
#484Integrated circuit package with improved power signal connection
#485Multilayer printed wiring board
#486Component mounting substrate and structure
#487Sacrificial component
#488Wiring board mounting a capacitor
#489Stacked electronic part
#490Electronic device
#491Capacitor device and semiconductor device having the same, and capacitor device manufacturing method
#492Capacitor-related systems for addressing package/motherboard resonance
#493Spring biased socket system
#494Electronic device configured as a multichip module, leadframe and panel with leadframe positions
#495Semiconductor device with capacitor
#496Semiconductor package with passive device integration
#497Printed circuit board and method for manufacturing printed circuit board
#498Method for producing ceramic substrate and electronic component module using ceramic substrate
#499High frequency module
#500Semiconductor device including semiconductor element surrounded by an insulating member and wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof
#501Electronic circuit unit and method of fabricating the same
#502Capacitor having an anodic metal oxide substrate
#503Capacitor having an anodic metal oxide substrate
#504Microelectronic device signal transmission by way of a lid
#505Semiconductor device and method of manufacturing the same, circuit board and electronic device
#506Semiconductor/printed circuit board assembly, and computer system
#507Environmentally tuned circuit card assembly and method for manufacturing the same
#508Semiconductor package
#509BGA package with component protection on bottom
#510Constructing of an electronic assembly having a decoupling capacitor
#511Laminated socket contacts
#512Semiconductor apparatus with decoupling capacitor
#513Circuit device and manufacturing method of circuit device
#514Stackable electronic assembly
#515Semiconductor device and an electronic device
#516Hybrid integrated circuit
#517Silicon strip fan out system in package