212750 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected; Disposition of discrete passive components in a mirrored arrangement on two different side of a common die mounting substrate
SEMICONDUCTOR PACKAGE
#2SEMICONDUCTOR STRUCTURE WITH INTEGRATED PASSIVE DEVICE HAVING OPPOSED SOLDER BUMPS
#3THREE-DIMENSIONAL (3D) PACKAGE
#4CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
#5MICROELECTRONIC ASSEMBLIES HAVING TOPSIDE POWER DELIVERY STRUCTURES
#6SEMICONDUCTOR PACKAGE
#7ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
#8SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
#9SEMICONDUCTOR PACKAGE WITH UNDER-BUMP METALLIZATION PROVIDING IMPROVED PACKAGE RELIABILITY
#10METHODS RELATED TO DUAL-SIDED RADIO-FREQUENCY PACKAGE WITH OVERMOLD STRUCTURE
#11SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
#12SEMICONDUCTOR PACKAGE
#13SEMICONDUCTOR PACKAGE STRUCTURE
#14DISCRETE DEVICE INTERCONNECTIONS BETWEEN STACKED SUBSTRATES
#15SEMICONDUCTOR PACKAGE
#16Cooling Device and Process for Cooling Double-Sided SiP Devices During Sputtering
#17INTEGRATED FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF
#18SEMICONDUCTOR PACKAGES AND METHOD OF MANUFACTURE
#19SEMICONDUCTOR PACKAGE
#20PACKAGE STRUCTURE
#21FAN-OUT PACKAGING DEVICE USING BRIDGE AND METHOD OF MANUFACTURING FAN-OUT PACKAGING DEVICE USING BRIDGE
#22PACKAGE DEVICE INCLUDING CAPACITOR DISPOSED ON OPPOSITE SIDE OF DIE RELATIVE TO SUBSTRATE
#23SEMICONDUCTOR PACKAGE
#24SEMICONDUCTOR STRUCTURE WITH INTEGRATED PASSIVE DEVICE HAVING OPPOSED SOLDER BUMPS
#25Redistribution structures for semiconductor packages and methods of forming the same
#26Semiconductor package and manufacturing method thereof
#27SEMICONDUCTOR PACKAGES
#28Semiconductor package with an antenna substrate
#29ELECTRONIC SYSTEM WITH POWER DISTRIBUTION NETWORK INCLUDING CAPACITOR COUPLED TO COMPONENT PADS
#30PACKAGE STRUCTURE
#31Microelectronic assemblies having topside power delivery structures
#32MICROELECTRONIC ASSEMBLIES HAVING TOPSIDE POWER DELIVERY STRUCTURES
#33Activation of dynamic filter generation for message management systems through gesture-based input
#34Cooling device and process for cooling double-sided SiP devices during sputtering
#35Semiconductor packages and method of manufacture
#36Semiconductor package with layer structures, antenna layer and electronic component
#37Module
#38Semiconductor devices with flexibility in capacitor design for power noise reduction
#39PACKAGE STRUCTURE WITH FAN-OUT FEATURE
#40Semiconductor package structure
#41Package structure and method of manufacturing the same
#42THROUGH-SUBSTRATE UNDERFILL FORMATION FOR AN INTEGRATED CIRCUIT ASSEMBLY
#43Integrated circuit package and method
#44ELECTRONIC PACKAGE WITH PASSIVE COMPONENT BETWEEN SUBSTRATES
#45Devices and methods related to dual-sided radio-frequency package with overmold structure
#46Semiconductor package
#47Semiconductor package including a substrate, a semiconductor device, and a mold
#48Semiconductor device and method of forming embedded die substrate, and system-in-package modules with the same
#49Semiconductor package and manufacturing method thereof
#50Semiconductor package with an antenna substrate
#51Semiconductor package including a trench in a passivation layer
#52Integrating system in package (SiP) with input/output (IO) board for platform miniaturization
#53OPOSSUM REDISTRIBUTION FRAME FOR CONFIGURABLE MEMORY DEVICES
#54Redistribution structures for semiconductor packages and methods of forming the same
#55Cooling device and process for cooling double-sided SiP devices during sputtering
#56PACKAGE STRUCTURE
#57Semiconductor package and manufacturing method thereof
#58Packaging structure and packaging method of digital circuit
#59Integrated circuit package and method
#60Module
#61Semiconductor packages and method of manufacture
#62Antenna module
#63System in package (SiP) semiconductor package
#64Structure and formation method of chip package with fan-out feature
#65High frequency module
#66Semiconductor package having discrete antenna device
#67System-in-package with double-sided molding
#68Semiconductor package and manufacturing method thereof
#69Semiconductor package with layer structures, antenna layer and electronic component
#70Semiconductor device and method of forming a 3D interposer system-in-package module
#71Semiconductor package and antenna module including the same
#72Package structure
#73Package structure and method of manufacturing the same
#74Semiconductor package and manufacturing method thereof
#75Dual-sided radio-frequency package with overmold structure
#76Semiconductor package structure
#77Method for manufacturing semiconductor package structure
#78Semiconductor device and method of forming a 3D integrated system-in-package module
#79System-in-package with double-sided molding
#80Methods of forming a package substrate
#81METHOD OF FABRICATING ELECTRONIC PACKAGE STRUCTURE WITH MULTIPLE ELECTRONIC COMPONENTS
#82Manufacturing method of package structure
#83Semiconductor package and manufacturing method thereof
#84Circuit system having compact decoupling structure
#85Semiconductor package and manufacturing method thereof
#86Land side and die side cavities to reduce package z-height
#87Method for fabricating electronic package
#88MAGNETIC SOLDER MASK ON PACKAGE SUBSTRATE ABOVE MAGNETIC INDUCTOR ARRAY
#89Semiconductor device and method of forming embedded die substrate, and system-in-package modules with the same
#90Integrating system in package (SiP) with input/output (IO) board for platform miniaturization
#91Semiconductor package and manufacturing method thereof
#92Microelectronic assemblies having front end under embedded radio frequency die
#93HIGH DENSITY FAN-OUT WAFER LEVEL PACKAGE AND METHOD OF MAKING THE SAME
#94Redistribution structures for semiconductor packages and methods of forming the same
#95CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
#96Power device package
#97Module installation on printed circuit boards with embedded trace technology
#98Fan-out semiconductor package
#99Package structure and manufacturing method thereof
#100Package structures
#101Semiconductor structure and manufacturing method thereof
#102Semiconductor package substrate support structures for ball-grid array cavities, and methods of assembling same
#103Package structure and method of manufacturing the same
#104Method for fabricating electronic package
#105Package structures and methods of forming the same
#106Double-sided module with electromagnetic shielding
#107Electronic package with passive component between substrates
#108Shielding in electronic assemblies
#109Semiconductor device and method of forming embedded die substrate, and system-in-package modules with the same
#110Semiconductor device and method of forming a 3D integrated system-in-package module
#111INTEGRATED CIRCUIT PACKAGE COMPRISING SURFACE CAPACITOR AND GROUND PLANE
#112Semiconductor package
#113Substrate-free system in package design
#114Packaging device for integrated power supply system and packaging method thereof
#115Method for fabricating electronic package
#116Electronic module
#117Electronic module having a filler in a sealing resin
#118Capacitor and board having the same
#119PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
#120Semiconductor package with package components disposed on a package substrate within a footprint of a die
#121Semiconductor package having discrete antenna device
#122Capacitor
#123Semiconductor package and manufacturing method of the same
#124Semiconductor package and manufacturing method thereof
#125Power semiconductor chip module
#126Semiconductor device package with a conductive post
#127Integrating system in package (SIP) with input/output (IO) board for platform miniaturization
#128Semiconductor package and manufacturing method thereof
#129Electronic package and method for fabricating the same
#130Semiconductor package structure
#131Semiconductor structure and manufacturing method thereof
#132System-in-package with double-sided molding
#133Semiconductor device and method of forming a 3D interposer system-in-package module
#134Fan-out semiconductor package and method of manufacturing the same
#135Fan-out semiconductor package
#136Air-cavity package with enhanced package integration level and thermal performance
#137COWOS structures and method of forming the same
#138Semiconductor device and method of fabricating 3D package with short cycle time and high yield
#139Package structure and method of forming the same
#140Semiconductor package and manufacturing method thereof
#141Package structures and methods of forming the same
#142Packaged integrated circuit device with cantilever structure
#143IC package
#144Manufacturing method of an electronic component module
#145Land side and die side cavities to reduce package z-height
#146CIRCUITS AND METHODS RELATED TO RADIO-FREQUENCY DEVICES WITH OVERMOLD STRUCTURE
#147Dual-sided radio-frequency package with overmold structure
#148Fan-out package structure having stacked carrier substrates and method for forming the same
#149Electronic package structure with multiple electronic components
#150Vertical shielding and interconnect for SIP modules
#151Ceramic substrate and method for producing a ceramic substrate
#152Fan-out package structure
#153Packaged devices with multiple planes of embedded electronic devices
#154Manufacturing method of semiconductor package and manufacturing method of semiconductor device
#155Electronic package and method for fabricating the same
#156Fan-out semiconductor package for packaging semiconductor chip and capacitors
#157Solder resist layers for coreless packages and methods of fabrication
#158Fan-out package structure and method for forming the same
#159Scanning acoustic microscope sensor array for chip-packaging interaction package reliability monitoring
#160Semiconductor device with lead frame
#161Electronic assembly group and method for producing the same
#162Fan-out semiconductor package and manufacturing method thereof
#163Packaged integrated circuit device with cantilever structure
#164Semiconductor package, semiconductor device using the same and manufacturing method thereof
#165Integrated circuit (IC) module comprising an integrated circuit (IC) package and an interposer with embedded passive components
#166Electronic package and fabrication method thereof
#167Electronic device module and method of manufacturing the same
#168Semiconductor package and manufacturing method thereof
#169Dual molded stack TSV package
#170Wireless IC device, resin molded body comprising same, communication terminal apparatus comprising same, and method of manufacturing same
#171Semiconductor package and mounting structure thereof
#172Noise reducing electronic component
#173Method for fabricating semiconductor package having a multi-layer molded conductive substrate and structure
#174Semiconductor package with improved signal stability and method of manufacturing the same
#175Semiconductor device and method of forming a package in-fan out package
#176Tunable composite interposer
#177Surface mountable microphone package, a microphone arrangement, a mobile phone and a method for recording microphone signals
#178Circuit device and method for the production thereof
#179Microfluidic delivery member with filter and method of forming same
#180IC package
#181Land side and die side cavities to reduce package z-height
#182Ultra fine pitch PoP coreless package
#183Package structure and manufacturing method thereof
#184Package including a semiconductor die and a capacitive component
#185Packaged assembly for high density power applications
#186Semiconductor device and method of fabricating 3D package with short cycle time and high yield
#187System of package (SoP) module and mobile computing device having the SoP
#188Electronic device module and method of manufacturing the same
#189Module
#190Dual side solder resist layers for coreless packages and packages with an embedded interconnect bridge and their methods of fabrication
#191Semiconductor modules and semiconductor packages
#192SMD, IPD, and/or wire mount in a package
#193Chip capacitors
#194Electronic device module and method of manufacturing the same
#195Power management integrated circuit (PMIC) integration into a processor package
#196Package apparatus with multiple pillar layers
#197Electronic device module and manufacturing method thereof
#198Electronic device module and manufacturing method thereof
#199Electronic component module and manufacturing method thereof
#200Stacked semiconductor apparatus, system and method of fabrication
#201Integrated circuit package
#202Electric component module
#203Low profile semiconductor module with metal film support
#204Tunable composite interposer
#205Electronic apparatus, method of optimizing de-coupling capacitor and computer-readable recording medium
#206Electronic component module and manufacturing method thereof
#207Semiconductor package and method of fabricating the same
#208Electronic component module
#209Semiconductor device including heat dissipating structure
#210Semiconductor device
#211Electronic device module and manufacturing method thereof
#212Ultra fine pitch PoP coreless package
#213Surface mountable microphone package, a microphone arrangement, a mobile phone and a method for recording microphone signals
#214Wiring substrate and semiconductor package
#215Semiconductor package
#216Electric component module and method of manufacturing the same
#217Power converters having capacitive energy transfer elements and arrangements of energy storage elements for power converters
#218Semiconductor device including a plurality of semiconductor chips, and a cover member with first and second brims
#219Apparatus related to an improved package including a semiconductor die
#220Semiconductor device having an inductor mounted on a back face of a lead frame
#221Semiconductor package and manufacturing method thereof
#222Module and method of manufacturing the same
#223Suspended inductor microelectronic structures
#224Printed circuit board
#225Component built-in board and method of manufacturing the same, and mounting body
#226Substrate-less discrete coupled inductor structure
#227Compact device package
#228Method of manufacturing module
#229Voltage noise reduction through co-layouts of multilayer ceramic capacitors and solid electrolytic polymer capacitors
#230Method of manufacturing module
#231Semiconductor device
#232Semiconductor device including alternating source and drain regions, and respective source and drain metallic strips
#233Semiconductor device including gate drivers around a periphery thereof
#234Semiconductor device including a redistribution layer and metallic pillars coupled thereto
#235Wireless module
#236Integration of chips and silicon-based trench capacitors using low parasitic silicon-level connections
#237Reducing loadline impedance in a system
#2383D stacked package structure and method of manufacturing the same
#239Land side and die side cavities to reduce package Z-height
#240Method for producing multi-layer substrate and multi-layer substrate
#241Method for manufacturing package structure with electronic component
#242Tunable composite interposer
#243Electronic apparatus, method of optimizing de-coupling capacitor and computer-readable recording medium
#244Wiring board formed by a laminate on a stiffener
#245Microelectronic package having direct contact heat spreader and method of manufacturing same
#246Electro-thermal cooling devices and methods of fabrication thereof
#247Multilayer printed wiring board having multilayer core substrate
#248Module substrate and method for manufacturing module substrate
#249Multilayer printed wiring board
#250Three dimensional passive multi-component structures
#251Three dimensional passive multi-component structures
#252Electronic component module including a lead frame and an insulating resin having a thickness less than or equal to a thickness of the lead frame and method for producing same
#253SEMICONDUCTOR PACKAGE
#254Semiconductor package and manufacturing method thereof
#255Stub minimization for multi-die wirebond assemblies with parallel windows
#256Stub minimization for multi-die wirebond assemblies with parallel windows
#257Stacked semiconductor apparatus, system and method of fabrication
#258RF MODULE
#259Power supply control circuit module
#260ELECTRONIC COMPONENT INCORPORATING BOARD AND COMPOSITE MODULE
#261Package structure with electronic component and method for manufacturing same
#262Memory module in a package
#263De-skewed multi-die packages
#264Planar interconnect structure for hybrid circuits
#265Module substrate, module-substrate manufacturing method, and terminal connection substrate
#266Packages and methods for packaging microphone devices
#267Multilayer printed wiring board
#268Semiconductor device and method of forming vertical interconnect structure in substrate for IPD and baseband circuit separated by high-resistivity molding compound
#269Method of manufacturing semiconductor apparatus, the semiconductor apparatus, and ignitor using the semiconductor apparatus
#270Semiconductor devices and methods of controlling temperature thereof
#271Printed wiring board and method for manufacturing the same
#272DIE DOWN DEVICE WITH THERMAL CONNECTOR
#273HIGH-EFFICIENCY POWER CONVERTERS WITH INTEGRATED CAPACITORS
#274Electronic circuit
#275Chip Capacitor Precursors
#276Assembly method for converting the precursors to capacitors
#277Solid-state imaging apparatus and camera using the same
#278ELECTRONIC DEVICE MOUNTING STRUCTURE AND ELECTRONIC DEVICE MOUNTING METHOD
#279CORELESS SUBSTRATE, METHOD OF MANUFACTURING SAME, AND PACKAGE FOR MICROELECTRONIC DEVICE INCORPORATING SAME
#280Switching power supply device, switching power supply circuit, and electrical equipment
#281SEMICONDUCTOR PACKAGE HAVING DE-COUPLING CAPACITOR
#282MULTILAYER PRINTED WIRING BOARD
#283INTEGRATED CIRCUIT PACKAGE STRUCTURE AND METHOD
#284Stacked structure with a voltage boosting supply circuit
#285Substrate arrangement
#286Composite module
#287SEMICONDUCTOR MEMORY DEVICE
#288High-density inter-package connections for ultra-thin package-on-package structures, and processes of forming same
#289Module package with embedded substrate and leadframe
#290ELECTRICAL CIRCUIT SYSTEM AND METHOD FOR PRODUCING AN ELECTRICAL CIRCUIT SYSTEM
#291Semiconductor packages having passive elements mounted thereonto
#292Interconnect board, printed circuit board unit, and method
#293Electronic device and manufacturing method therefor
#294High-bandwidth ramp-stack chip package
#295Electronic component module and method of manufacturing the electronic component module
#296Method for manufacturing electronic component module
#297Multilayer printed wiring board
#298Wiring substrate and method of manufacturing the same
#299Semiconductor package, lead frame, and wiring board with the same
#300MULTILAYER PRINTED WIRING BOARD