H01L2924/20301 - CPC Classification Index

ClassID:

212780 ⎘

H01L2924/20301 - CPC Classification

Classification description:

Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Parameters; Ultrasonic frequency ranges, i.e. KHz Ultrasonic frequency [f] f<25 kHz

Recent Application in this class:

20180211933

2018-07-26

Connecting device and circuit chip connecting method using connecting device

20180182733

2018-06-28

Systems and methods for bonding semiconductor elements

20180026006

2018-01-25

Systems and methods for bonding semiconductor elements

20170179072

2017-06-22

Systems and methods for bonding semiconductor elements

20160254252

2016-09-01

Systems and methods for bonding semiconductor elements

20150348893

2015-12-03

METHOD OF MANUFACTURING THREE-DIMENSIONAL INTEGRATED CIRCUIT COMPRISING ALUMINUM NITRIDE INTERPOSER

20140167023

2014-06-19

OLED device in contact with a conductor

20110156091

2011-06-30

Contacting a device with a conductor

20080191367

2008-08-14

SEMICONDUCTOR PACKAGE WIRE BONDING