212779 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Parameters Ultrasonic frequency ranges, i.e. KHz
Sub-classes:Methods for attachment and devices produced using the methods
#2Bonding method using bonding material
#3Bonding material and bonding method using the same
#4Silver paste composition and semiconductor device using same
#5Power module
#6Methods for attachment and devices produced using the methods
#7Bonding material and bonding body, and bonding method
#8Bonding material and bonding method using the same
#9Copper conductor film and manufacturing method thereof, conductive substrate and manufacturing method thereof, copper conductor wiring and manufacturing method thereof, and treatment solution
#10Bonding material using metal nanoparticles coated with C6-C8 fatty acids, and bonding method
#11Power semiconductor module and method for operating a power semiconductor module
#12Packaged semiconductor chips
#13Connect and capacitor substrates in a multilayered substrate structure coupled by surface coulomb forces
#14Nanoscale metal paste for interconnect and method of use
#15Levitating substrate being charged by a non-volatile device and powered by a charged capacitor or bonding wire
#16Power semiconductor module with sealing device for sealing to a substrate carrier and method for manufacturing it
#17Methods of attaching a die to a substrate
#18Coated nickel-containing powders
#19Packaged semiconductor chips
#20Nanoscale metal paste for interconnect and method of use
#21Coated silver-containing particles, method and apparatus of manufacture, and silver-containing devices made therefrom
#22Coated silver-containing particles, method and apparatus of manufacture, and silver-containing devices made therefrom
#23Nickel powders, methods for producing powders and devices fabricated from same
#24Coated nickel-containing powders, methods and apparatus for producing such powders and devices fabricated from same
#25Coated silver-containing particles, method and apparatus of manufacture, and silver-containing devices made therefrom