H01L2924/20306 - CPC Classification Index

ClassID:

212785 ⎘

H01L2924/20306 - CPC Classification

Classification description:

Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Parameters; Ultrasonic frequency ranges, i.e. KHz Ultrasonic frequency [f] 125 Khz=

Recent Application in this class:

20180211933

2018-07-26

Connecting device and circuit chip connecting method using connecting device

20180182733

2018-06-28

Systems and methods for bonding semiconductor elements

20180026006

2018-01-25

Systems and methods for bonding semiconductor elements

20170179072

2017-06-22

Systems and methods for bonding semiconductor elements

20160254252

2016-09-01

Systems and methods for bonding semiconductor elements

20140061910

2014-03-06

SEMICONDUCTOR DEVICE STRUCTURES AND METHODS FOR COPPER BOND PADS

20100264546

2010-10-21

Semiconductor device and manufacturing method thereof