212809 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Parameters Diameter ranges
Electronic component and method for manufacturing the same
#5102Semiconductor package using flexible film and method of manufacturing the same
#5103Multiple stacked-chip packaging structure
#5104Heat releasing member, package for accommodating semiconductor element and semiconductor device
#5105Power semiconductor module with deflection-resistant base plate
#5106Stacked chip assembly with encapsulant layer
#5107Lead frame, semiconductor device using the same and method of producing the semiconductor device
#5108Methods for securing components of semiconductor device assemblies to each other with hybrid adhesive materials
#5109Cooler for cooling electric part
#5110High frequency circuit module
#5111Semiconductor device
#5112Solder masks including dams for at least partially surrounding terminals of a carrier substrate and recessed areas positioned adjacent to the dams, and carrier substrates including such solder masks
#5113Multi-chip module
#5114Semiconductor device and an electronic device
#5115Semiconductor device and method of manufacturing thereof
#5116Molded ball grid array
#5117Semiconductor die packages with recessed interconnecting structures
#5118Light emitting diodes packaged for high temperature operation
#5119Fabrication of stacked microelectronic devices
#5120Fabrication of stacked microelectronic devices
#5121Ultrathin leadframe BGA circuit package
#5122Packaged microelectronic components
#5123Substrate material for mounting a semiconductor device, substrate for mounting a semiconductor device, semiconductor device, and method of producing the same
#5124Electronic component protected against electrostatic discharges
#5125High reliability chip scale package
#5126Curable encapsulant compositions
#5127Semiconductor device and its manufacturing method
#5128Leadless type semiconductor package, and production process for manufacturing such leadless type semiconductor package
#5129Packaged microelectronic devices and methods of forming same
#5130Multi media card formed by transfer molding
#5131Standoffs for centralizing internals in packaging process
#5132Printed wiring board and manufacturing method therefor
#5133Apparatus used to package multimedia card by transfer molding
#5134Method and apparatus for attaching microelectronic substrates and support members
#5135Method for making electronic devices including silicon and LTCC and devices produced thereby
#5136Computer system including at least one stress balanced semiconductor package
#5137Memory package
#5138Semiconductor component having conductors with wire bondable metalization layers
#5139Semiconductor device, package structure thereof, and method for manufacturing the semiconductor device
#5140Ball grid array structures having tape-based circuitry
#5141Method of stacking semiconductor element in a semiconductor device
#5142Process for fabricating a semiconductor package and semiconductor package with leadframe
#5143Methods for enclosing a thermoplastic package
#5144Method for optimizing routing layers and board space requirements for a ball grid array land pattern
#5145Semiconductor assembly encapsulation mold and method for forming same
#5146Semiconductor device, semiconductor module, electronic device and electronic equipment, and method for manufacturing semiconductor module
#5147Semiconductor unit with cooling system
#5148Multiple die stack apparatus employing T-shaped interposer elements
#5149Electronic package having a folded package substrate
#5150Cutting method and method of manufacturing semiconductor device
#5151Hybrid integrated circuit
#5152Integrated circuit package with a balanced-part structure
#5153Lead for integrated circuit package
#5154Semiconductor packaging structure
#5155Semiconductor device including a potential drawing portion formed at a corner
#5156Flange for integrated circuit package
#5157Semiconductor device wiring structure
#5158Thermoplastic material
#5159Method for shielding integrated circuit devices
#5160Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages
#5161Substrate-less microelectronic package
#5162Semiconductor device having aluminum and metal electrodes and method for manufacturing the same
#5163Semiconductor device and method of manufacturing the same
#5164Substrate-based chip package
#5165Semiconductor package containing an integrated-circuit chip supported by electrical connection leads
#5166Surface mount multichip devices
#5167Semiconductor component comprising leadframe, semiconductor chip and integrated passive component in vertical relationship to each other
#5168Circuit board with built-in electronic component and method for manufacturing the same
#5169Methods of forming circuit traces and contact pads for interposers utilized in semiconductor packages
#5170Resin composition, cured resin, sheet-like cured resin, laminated body, prepreg, electronic parts and multilayer boards
#5171Dual chips stacked packaging structure
#5172Integrated circuit carrier
#5173Chip scale package and method of fabricating the same
#5174Semiconductor device, electronic device, electronic equipment, and method of manufacturing semiconductor device
#5175Adhesion enhanced semiconductor die for mold compound packaging
#5176Leadless leadframe package substitute and stack package
#5177Metal carrier (leadframe) for receiving and contact-connecting electrical and/or optoelectronic components