Light emitting device

Semiconductor package free of substrate and fabrication method thereof

Low fabrication cost, high performance, high reliability chip scale package

LSI package, LSI element testing method, and semiconductor device manufacturing method

Semiconductor package with crossing conductor assembly and method of manufacture

Semiconductor package

Semiconductor device

Packaging substrates for integrated circuits and soldering methods

Chip package structure

Method of manufacturing a semiconductor device

Multiple die package

Semiconductor dice having back side redistribution layer accessed using through-silicon vias, methods

RF package

Semiconductor package for lowering electromagnetic interference and method for fabricating the same

Packaged systems with MRAM

Daisy chaining of serial I/O interface on stacking devices

Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device

Electronic device configured as a multichip module, leadframe and panel with leadframe positions

Semiconductor package free of substrate and fabrication method thereof

Two die semiconductor assembly and system including same

Lead frame and method for manufacturing semiconductor package with the same

Lead frame for semiconductor package and method of fabricating semiconductor package

Methods of encapsulating selected locations of a semiconductor die assembly using a thick solder mask

SEMICONDUCTOR PACKAGE MODULE AND MANUFACTURING METHOD THEREOF

Method of producing a digital fingerprint sensor and the corresponding sensor

Semiconductor light emitting device provided with a light conversion element using a haloborate phosphor composition

Semiconductor device and manufacturing method thereof

Semiconductor device with capacitor

Thermally enhanced metal capped BGA package

Method of forming a leadframe for a semiconductor package

Chip-on-board module, and method of manufacturing the same

Microelectronic assembly having array including passive elements and interconnects

Semiconductor package with wire bonded stacked dice and multi-layer metal bumps

Semiconductor package and method for manufacturing the same

Semiconductor package with passive device integration

Module with a built-in component, and electronic device with the same

Semiconductor part for component mounting, mounting structure and mounting method

Semiconductor device having radiation structure

Method and apparatus for high electrical and thermal performance ball grid array package

Microelectronic adaptors, assemblies and methods

Circuit carrier and package structure thereof

Method of making microelectronic packages including electrically and/or thermally conductive element

Adaptable electronic storage apparatus

Semiconductor device and method of manufacturing same

Lead frame, semiconductor chip package using the lead frame, and method of manufacturing the semiconductor chip package

Integrated circuit package with transparent encapsulant and method for making thereof

METHOD FOR PRODUCING WEDGE-WEDGE WIRE CONNECTION

Semiconductor integrated circuit having connection pads over active elements

WAFER-LEVEL PACKAGE STRUCTURE

Area array packages with overmolded pin-fin heat sinks

Hermetic surface mounted power package

HYBRID INTEGRATED CIRCUIT DEVICE AND MANUFACTURING METHOD OF THE SAME

Wafer level hermetic sealing method

Light emitting diodes packaged for high temperature operation

Optical sensor module with semiconductor device for drive

Masking layer in substrate cavity

Light emitting device

Semiconductor apparatus

Electronic component package

Microelectronic component assemblies and microelectronic component lead frame structures

Routing element for use in semiconductor device assemblies

Microelectronic component assemblies and microelectronic component lead frame structures

Routing element for use in multi-chip modules, multi-chip modules including the routing element and methods

Concealable chip leadframe unit structure

Semiconductor chip leadframe module

Semiconductor device using LED chip

Methods and apparatus to reduce growth formations on plated conductive leads

Carrier, method of manufacturing a carrier and an electronic device

Semiconductor integrated circuit device

Semiconductor device and manufacturing method for the same

Fabrication process for a semiconductor integrated circuit device

Multilayer circuit carrier, panel, electronic device, and method for producing a multilayer circuit carrier

Semiconductor chip heat transfer

Semiconductor device

Semiconductor device and manufacturing method for the same

Use of direct gold surface finish on a copper wire-bond substrate, methods of making same, and methods of testing same

High frequency module

Insulating substrate for IC packages having integral ESD protection

High-frequency module, and method of producing same

Micro lead frame package having transparent encapsulant

Semiconductor chip with external connecting terminal

Semiconductor chip with external connecting terminal

Semiconductor chip with external connecting terminal

Multi-chip module and methods

Semiconductor device

Method of manufacturing a semiconductor device by using a matrix frame

Method of backside grinding a bumped wafer

Mounting structure of semiconductor chip, semiconductor device and method of making the semiconductor device

Thin film capacitors on ceramic

Multi-chip package structure

Semiconductor device including semiconductor element surrounded by an insulating member and wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof

Chip assembly package

Semiconductor package

Semiconductor chip package and multichip package

Multi-chip package structure

Leadless semiconductor package

Semiconductor package with increased number of input and output pins

Package structure for semiconductor

Die exhibiting an effective coefficient of thermal expansion equivalent to a substrate mounted thereon, and processes of making same

Process for producing optical semiconductor device

Warpage control of array packaging

Semiconductor module with vertically mounted semiconductor chip packages

Integrating passive components on spacer in stacked dies

Chip packaging compositions, packages and systems made therewith, and methods of making same

Adhesive film for manufacturing semiconductor device

Embedded redistribution interposer for footprint compatible chip package conversion

Semiconductor module with a semiconductor stack, and methods for its production

Packaging substrates for integrated circuits and soldering methods

Flexible package with rigid substrate segments for high density integrated circuit systems

Tapered dielectric and conductor structures and applications thereof

Multiple chip package module having inverted package stacked over die

System and method for increasing the number of IO-s on a ball grid pattern

Stress distribution package

Stack package with improved heat radiation and module having the stack package mounted thereon

Substrate structure capable of reducing package singular stress

Semiconductor packaging substrate

Semiconductor component arrangement with an insulating layer having nanoparticles

Method for making a package substrate without etching metal layer on side walls of die-cavity

Shielding arrangement to protect a circuit from stray magnetic fields

Semiconductor component and method for fabricating

Method for ball grid array chip packages having improved testing and stacking characteristics

Semiconductor device

Method of making semiconductor device

Copper-based chip attach for chip-scale semiconductor packages

Semiconductor package

Semiconductor package with improved solder joint reliability

Method for manufacturing thin GaAs die with copper-back metal structures

Microelectronic devices and methods for filling vias in microelectronic devices

Semiconductor device and fabrication method thereof

Method of forming land grid array packaged device

Inductive device including bond wires

Information storage apparatus and electronic device in which information storage apparatus is installed

Semiconductor device

Arrangement of a chip package constructed on a substrate and substrate for production of the same

Method for reducing or eliminating semiconductor device wire sweep in a multi-tier bonding device and a device produced by the method

Lead-free integrated circuit package structure

Stackable integrated circuit packaging

Semiconductor device

Method and structure to enhance temperature/humidity/bias performance of semiconductor devices by surface modification

Circuit layout structure

Semiconductor package with heat spreader

Stacked chip semiconductor device

Switching media for chip carrier device

Enhanced solder joint strength and ease of inspection of leadless leadframe package (LLP)

Chip assembling structure and socket

Parallel design processes for integrated circuits

Integrating passive components on spacer in stacked dies

Low coefficient of thermal expansion (CTE) semiconductor packaging materials

Semiconductor chip, semiconductor device, circuit board, and electronic instrument

Flip chip bonding method for enhancing adhesion force in flip chip packaging process and metal layer-built structure of substrate for the same

Semiconductor device and method of manufacturing the same, circuit board, and electronic apparatus

Heat spreader ball grid array (HSBGA) design for low-k integrated circuits (IC)

Module assembly and method for stacked BGA packages

Semiconductor device

Method of manufacturing a semiconductor device

Method of fabricating lead frame and method of fabricating semiconductor device using the same, and lead frame and semiconductor device using the same

Semiconductor/printed circuit board assembly, and computer system

Techniques for packaging multiple device components

Frame for semiconductor package

Fretting and whisker resistant coating system and method

Methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices

Substrate-based package for integrated circuits

Electric connection terminal and method of manufacturing the same, semiconductor device and method of mounting the same

Mounting structure for semiconductor parts and semiconductor device

Semiconductor chip package having decoupling capacitor and manufacturing method thereof

Encapsulated lead having step configuration

Heat spreader and semiconductor device package having the same

Chip package structure and manufacturing method thereof

Semiconductor device

Stacked BGA packages

Wafer level stack structure for system-in-package and method thereof

Microelectronic devices having conductive complementary structures and methods of manufacturing microelectronic devices having conductive complementary structures

Molded leadless package having a partially exposed lead frame pad

Semiconductor element, semiconductor device, and method for manufacturing semiconductor element

EMI shielded integrated circuit packaging apparatus method and system

Semiconductor component and sensor component for data transmission devices

Etching method and method of manufacturing circuit device using the same

Integrated circuit device and the manufacturing method thereof

Transfer mold semiconductor packaging processes

Lead frame, method of manufacturing the same, and method of manufacturing a semiconductor device using the same

Transparent small memory card

Method and semiconductor device having copper interconnect for bonding

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Semiconductor package having ultra-thin thickness and method of manufacturing the same

Chip package structure

Semiconductor device with semiconductor chip and rewiring layer and method for producing the same

Integrated circuit package having a resistant layer for stopping flowed glue

Lead frame and method for fabricating semiconductor package employing the same

Lead frame and semiconductor device having the same as well as method of resin-molding the same

Bumped chip carrier package using lead frame and method for manufacturing the same

Semiconductor device having a semiconductor chip mounted on external terminals and fabrication method thereof

High-frequency signal transmitting device

Radio frequency power amplifier module

Method of forming an electrical contact

Semiconductor package, method for manufacturing the same and lead frame for use in the same

BGA package with component protection on bottom

Interconnection element for BGA housings and method for producing the same

ASIC-embedded switchable antenna arrays

Multi-chip module

Chip package and substrate

Semiconductor device and method of fabricating the same

IC package with stacked sheet metal substrate

Circuit arrangement having a load transistor and a voltage limiting circuit and method for driving a load transistor

Electronic component and panel and method for producing the same

Ball grid array package and method thereof

Cavity-down semiconductor package with heat spreader

Microelectronic component and assembly having leads with offset portions

Chip package structure and process for fabricating the same

Method for fabricating a semiconductor package with multi layered leadframe

System and method for reducing or eliminating semiconductor device wire sweep

Thermally enhanced packaging structure and fabrication method thereof

High-speed signaling interface and method for communicating across across an interface

Prevention of contamination on bonding pads of wafer during SMT

Semiconductor device and method of enveloping an integrated circuit

Integrated circuit package with integral leadframe convector and method therefor

Semiconductor device

Simplified stacked chip assemblies

Compact semiconductor device capable of mounting a plurality of semiconductor chips with high density and method of manufacturing the same

Semiconductor laser device

Printed circuit board assembly and method

Module integration integrated circuits

Optimization of routing layers and board space requirements for a ball grid array package

Method for producing a multichip module and multichip module

Optimization of routing layers and board space requirements for a ball grid array land pattern

Vertically stacked pre-packaged integrated circuit chips

High power light emitting diode device

Small memory card

Integrated circuit package with laminated power cell having coplanar electrode

Package type semiconductor device

Semiconductor component with electromagnetic shielding device

Semiconductor package

Inter-chip and intra-chip wireless communications systems

Method of making circuitized substrate

Metallic dam and method of forming therefor

Process for producing resin-sealed type electronic device

Integrated circuit incorporating flip chip and wire bonding

Sealing and protecting integrated circuit bonding pads

Wafer level package for micro device

Overmolded optical package

Leadless semiconductor package

Lead frame, semiconductor device, and method for manufacturing semiconductor device

Input/output structure and integrated circuit using the same

Transistor having multiple gate pads

Light-emitting device and process for producing thereof

Thin film circuit board device and method for manufacturing the same

Method and apparatus for a dual substrate package

Semiconductor apparatus and method of fabricating the same

Circuit carrier and production thereof

Semiconductor package

Bridge connection type of chip package and fabricating method thereof

Window ball grid array semiconductor package and method for fabricating the same

Window ball grid array semiconductor package with substrate having opening and mehtod for fabricating the same

Semiconductor package

Reinforced die pad support structure

Super-thin high speed flip chip package

Lead frame with flag support structure

Method of encapsulating interconnecting units in packaged microelectronic devices

Circuit device and manufacturing method of circuit device

Lead frame

Method for forming ball pads of BGA substrate

Semiconductor device and manufacturing method of semiconductor device

Thin semiconductor package having stackable lead frame and method of manufacturing the same

Memory card

Multiple cavity/compartment package

Stacked chip package having upper chip provided with trenches and method of manufacturing the same

Tape substrates with mold gate support structures that are coplanar with conductive traces thereof and associated methods

Integrated circuit package with leadframe enhancement and method of manufacturing the same

Semiconductor device having transferred integrated circuit

Semiconductor package and method of manufacturing the same

Copper paste and wiring board using the same

Radiation shielded semiconductor package

Method for chemical etch control of noble metals in the presence of less noble metals

Method for fabricating thermally enhanced semiconductor device

Semiconductor device, method for manufacturing the same, circuit board, and electronic apparatus

Substrate frame

Semiconductor device with staggered electrodes and increased wiring width

Flip-chip package

Multi-dice chip scale semiconductor components

Semiconductor device with pipe for passing refrigerant liquid

Leadframe-based mold array package heat spreader and fabrication method therefor

Leadless semiconductor package

Unit semiconductor chip and multi chip package with center bonding pads and methods for manufacturing the same

Method of fabricating a two die semiconductor assembly

Stacked-chip semiconductor package and fabrication method thereof

Chip stack package and manufacturing method thereof

High-frequency chip packages

Invertible microfeature device packages

Optimization of routing layers and board space requirements for ball grid array package implementations including array corner considerations

Semiconductor device and method for production thereof

Information media using information of defect in an article

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Ball grid array package, stacked semiconductor package and method for manufacturing the same

High-frequency semiconductor device

Coolant cooled type semiconductor device

Area array type package stack and manufacturing method thereof

Substantially hermetic packages for semiconductor devices and substantially hermetically packaged, semiconductor devices

Silicones having improved chemical resistance and curable silicone compositions having improved migration resistance

Singulation method used in leadless packaging process

Method for manufacturing high-frequency module device

Electrochemical cell and fabrication method of the same