212827 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Technical effects; Electrical effects; Impedance matching
Galvanic isolators and coil transducers
#302Lead-frame circuit package
#303Semiconductor device and printed circuit board
#304Assembly for a microstimulator
#305Filter having impedance matching circuits
#306Process for producing group III nitride compound semiconductor light emitting device, group III nitride compound semiconductor light emitting device and lamp
#307Compact impedance transformation circuit
#308HIGH PERFORMANCE IC PACKAGE AND METHOD
#309High frequency line-to-waveguide converter and high frequency package
#310Method for manufacturing a passive integrated matching network for power amplifiers
#311Method and structure for controlled impedance wire bonds using co-dispensing of dielectric spacers
#312SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE
#313POWER AMPLIFIER MODULE
#314RF power transistor having an encapsulated chip package
#315Electrode pad on conductive semiconductor substrate
#316Electronic device
#317Stub-tuned wirebond package
#318Electronic component package
#319Methods and apparatus for a reduced inductance wirebond array
#320RF power module
#321Impedance matching commonly and independently
#322Ground shields for semiconductors
#323Multilayer integrated circuit for RF communication and method for assembly thereof
#324Modular transistor outline can with internal components
#325Arrangement and method impedance matching
#326Connecting module having passive components
#327Telemetry system for use with microstimulator
#328Radio-frequency system in package including antenna
#329Interconnecting a port of a microwave circuit package and a microwave component mounted in the microwave circuit package
#330Current mode interface for off-chip high speed communication
#331Packaging for high speed integrated circuits
#332LEADFRAME FOR SEMICONDUCTOR PACKAGES
#333Package for high frequency waves containing high frequency electronic circuit
#334Electronic module design to maximize volume efficiency
#335Apparatus and methods for packaging antennas with integrated circuit chips for millimeter wave applications
#336Self-centering braze assembly methods
#337Test carrier for semiconductor components having conductors defined by grooves
#338Method for controlling telemetry in an implantable medical device based on power source capacity
#339Output match transistor
#340Semiconductor power device and RF signal amplifier
#341Printed circuit board and differential signaling structure
#342Packaging for high speed integrated circuits
#343Packaging for high speed integrated circuits
#344Packaging for high speed integrated circuits
#345Packaging for high speed integrated circuits
#346Packaging for high speed integrated circuits
#347Packaging for high speed integrated circuits
#348Method of manufacturing a passive integrated matching network for power amplifiers
#349Radio frequency receiver chip with improved electrostatic discharge level
#350Apparatus and methods for packaging antennas with integrated circuit chips for millimeter wave applications
#351Semiconductor device having capacitive insulation means and communication terminal using the device
#352SIP type package containing analog semiconductor chip and digital semiconductor chip stacked in order, and method for manufacturing the same
#353Semiconductor device
#354Integrated circuit package including miniature antenna
#355Three dimensional packaging optimized for high frequency circuitry
#356Methods for providing bias to a monolithic microwave integrated circuit
#357Semiconductor device with a rewiring level and method for producing the same
#358Semiconductor structure with RF element
#359High performance IC package and method
#360Methods for designing bond pad rerouting elements for use in stacked semiconductor device assemblies and for assembling semiconductor devices
#361System-in-package wireless communication device comprising prepackaged power amplifier
#362Semiconductor device
#363Mounting pad structure for wire-bonding type lead frame packages
#364Packaging for electronic modules
#365Intelligent high-power amplifier module
#366Integrated circuit packaging device and method for matching impedance
#367Semiconductor device and radio communication device
#368Semiconductor package with a controlled impedance bus
#369Transceiver using low temperature co-fired ceramic method
#370Bond pad rerouting element and stacked semiconductor device assemblies including the rerouting element
#371connection arrangement for micro lead frame plastic packages
#372Power amplifier module
#373Methods and systems for rise-time improvements in differential signal outputs
#374Semiconductor module having an internal semiconductor chip stack, and method for producing said semiconductor module
#375Semiconductor device
#376Interconnecting a port of a microwave circuit package and a microwave component mounted in the microwave circuit package
#377Method to build a wirebond probe card in a many at a time fashion
#378Integrated circuit package including miniature antenna
#379Programmable radio transceiver
#380Apparatus and methods for constructing antennas using wire bonds as radiating elements
#381Power amplifier arrangement and method for processing a radiofrequency signal
#382Method for fabricating semiconductor components using conductive layer and grooves
#383Semiconductor device
#384Optical modulator module
#385Integrated power amplifier module with power sensor
#386Multi-band tunable resonant circuit
#387Semiconductor device and manufacturing method therefor
#388High data rate chip mounting
#389High-frequency amplification device
#390Semiconductor device and a method of manufacturing the same
#391High power Doherty amplifier
#392Semiconductor device and printed circuit board
#393Programmable radio transceiver
#394Split-gate power module for suppressing oscillation therein
#395Programmable radio transceiver
#396Multilayer integrated circuit for RF communication and method for assembly thereof
#397Integrated circuit module package and assembly method thereof
#398Power amplifier module for wireless communication devices
#399Interconnect system without through-holes
#400RF package
#401Electronic circuit module
#402Radio frequency circuit module
#403High-frequency power amplifier module
#404High performance RF inductors and transformers using bonding technique
#405Light-receiving assembly
#406Connection apparatus for parallel optical interconnect module and parallel optical interconnect module using the same
#407Dual band power amplifier module for wireless communication devices
#408Wide band cross point switch using MEMS technology
#409Metal-oxide-semiconductor device having integrated bias circuit
#410Method of incorporating interconnect systems into an integrated circuit process flow
#411Power amplifier module for wireless communication devices
#412Chip package and electrical connection structure between chip and substrate
#413Method and structure for controlled impedance wire bonds using co-dispensing of dielectric spacers
#414Semiconductor device including primary and secondary side circuits on first and second substrates with capacitive insulation
#415Power amplifier device
#416Impedance matching commonly and independently
#417Semiconductor integrated circuit
#418Chip package and electrical connection structure between chip and substrate
#419Optical module
#420Method of making an electronic module
#421Bonding pad design for impedance matching improvement
#422Multiple cavity/compartment package
#423High frequency circuit using high output amplifier cell block and low output amplifier cell block
#424Telemetry system for use with microstimulator
#425Methods and devices for providing bias to a monolithic microwave integrated circuit
#426Structure of multi-tier wire bonding for high frequency integrated circuit
#427High frequency power amplifier module and semiconductor integrated circuit device
#428Ultra wideband BGA
#429On-die resistor measurement
#430Compact doherty power amplifier using non-uniform phase match devices