212827 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Technical effects; Electrical effects; Impedance matching
MULTI-DIE SEMICONDUCTOR PACKAGE
#2SEMICONDUCTOR PACKAGE
#3POWER AMPLIFIER SYSTEMS INCLUDING CONTROL INTERFACE AND WIRE BOND PAD
#4POWER AMPLIFIER MODULE WITH TRANSISTOR DIES FOR MULTIPLE AMPLIFIER STAGES ON A SAME HEAT DISSIPATION STRUCTURE
#5NAND DIE WITH RDL FOR ALTERED BOND WIRE BANDWIDTH IN MEMORY DEVICES
#6DOHERTY AMPLIFIERS
#7Semiconductor package
#8SEMICONDUCTOR DEVICE WITH MULTIPLE DIES
#9HIGH FREQUENCY CIRCUIT
#10WIRING BOARD AND SEMICONDUCTOR PACKAGE
#11SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
#12WAFER-LEVEL CHIP STRUCTURE, MULTIPLE-CHIP STACKED AND INTERCONNECTED STRUCTURE AND FABRICATING METHOD THEREOF
#13Impedance controlled electrical interconnection employing meta-materials
#14Power amplifier modules including semiconductor resistor and tantalum nitride terminated through wafer via
#15Device packages with uniform components and methods of forming the same
#16Semiconductor package
#17Package substrate and semiconductor package including the same
#18Radio frequency transistor amplifiers having leadframes with integrated shunt inductors and/or direct current voltage source inputs
#19Multi-zone radio frequency transistor amplifiers
#20Package interface with improved impedance continuity
#21Single layer radio frequency integrated circuit package and related low loss grounded coplanar transmission line
#22Field effect transistor and semiconductor device
#23Package substrates with magnetic build-up layers
#24Group III nitride-based radio frequency amplifiers having back side source, gate and/or drain terminals
#25RF amplifiers with series-coupled output bondwire arrays and shunt capacitor bondwire array
#26Transistor die with output bondpad at the input side of the die, and power amplifiers including such dies
#27Power amplification module
#28High-performance integrated circuit packaging platform compatible with surface mount assembly
#29Monolithic die with acoustic wave resonators and active circuitry
#30Power amplifier systems with control interface and bias circuit
#31THERMAL MANAGEMENT IN INTEGRATED CIRCUIT PACKAGES
#32Thermal management in integrated circuit packages
#33Semiconductor device
#34Packaged transistor devices with input-output isolation and methods of forming packaged transistor devices with input-output isolation
#35Wire bonding structure
#36Package substrates with magnetic build-up layers
#37Package design scheme for enabling high-speed low-loss signaling and mitigation of manufacturing risk and cost
#38Semiconductor chip
#39Circuit structure and chip package
#40Integrated Circuit Package Including Miniature Antenna
#41Field effect transistor and semiconductor device
#42Radio-frequency module and communication device
#43Package and semiconductor device
#44Optical module and solder ball bonding structure
#45Semiconductor device
#46Semiconductor device, high-frequency power amplifier, and method of manufacturing semiconductor device
#47Microelectronic devices designed with efficient partitioning of high frequency communication devices integrated on a package fabric
#48Radio-frequency module and communication device
#49Amplifiers and amplifier modules with ground plane height variation structures
#50Radio frequency module and communication device
#51Integrally-formed multiple-path power amplifier with on-die combining node structure
#52Power amplifier with integrated bias circuit having multi-point input
#53Packaged transistor devices with input-output isolation and methods of forming packaged transistor devices with input-output isolation
#54RF power amplifier pallet
#55Ribbon bond solution for reducing thermal stress on an intermittently operable chipset controlling RF application for cooking
#56Amplifier and amplification apparatus
#57Amplifier
#58Impedance controlled electrical interconnection employing meta-materials
#59Amplifier with integrated directional coupler
#60Integrated circuit package including miniature antenna
#61Reflection-canceling package trace design
#62Launch structures for radio frequency integrated device packages
#63Antenna apparatus and electronic apparatus
#64Impedance compensation of flip chip connection for RF communications
#65Amplifiers and amplifier modules with ground plane height variation structures
#66Semiconductor device
#67Electronic assembly and electronic system with impedance matched interconnect structures
#68Interconnect core
#69Package substrates with magnetic build-up layers
#70Packaged RF power amplifier having a high power density
#71Semiconductor device
#72Packaged RF power amplifier
#73Semiconductor package having an impedance-boosting channel
#74Power amplifier modules including transistor with grading and semiconductor resistor
#75Amplifier
#76Semiconductor device
#77Transistor outline housing with high return loss
#78Semiconductor device
#79Microwave module
#80Integrated circuit package including miniature antenna
#81Microelectronic devices designed with high frequency communication devices including compound semiconductor devices integrated on an inter die fabric on package
#82Millimeter wave integrated circuit with ball grid array package including transmit and receive channels
#83Adjustable losses on bond wire arrangement
#84Semiconductor packages having wire bond wall to reduce coupling
#85SGS or GSGSG pattern for signal transmitting channel, and PCB assembly, chip package using such SGS or GSGSG pattern
#86Electrical interface for package and die
#87Power transistor with harmonic control
#88Package comprising switches and filters
#89Semiconductor device
#90Radio frequency (RF) devices
#91Electrical interface for printed circuit board, package and die
#92Integrated circuit package including miniature antenna
#93Power amplifier modules with bonding pads and related systems, devices, and methods
#94Semiconductor package having multi-phase power inverter with internal temperature sensor
#95Millimeter wave integrated circuit with ball grid array package including transmit and receive channels
#96Power quad flat no-lead (PQFN) package in a single shunt inverter circuit
#97Coupling element, integrated circuit device and method of fabrication therefor
#98Semiconductor device
#99Integration of a replica circuit and a transformer above a dielectric substrate
#100Proximity sensing using EHF signals
#101Power amplifier modules including tantalum nitride terminated through wafer via and related systems, devices, and methods
#102Power amplifier modules with harmonic termination circuit and related systems, devices, and methods
#103Power amplifier modules with power amplifier and transmission line and related systems, devices, and methods
#104Mixed impedance leads for die packages and method of making the same
#105Impedance matching configuration
#106Adjustable losses of bond wire arrangement
#107High-frequency amplifier
#108Amplifier
#109Semiconductor packages having wire bond wall to reduce coupling
#110Electronic device having a lead with selectively modified electrical properties
#111Semiconductor devices with impedance matching-circuits
#112SGS or GSGSG pattern for signal transmitting channel, and PCB assembly, chip package using such SGS or GSGSG pattern
#113Flexible circuit leads in packaging for radio frequency devices
#114Integrated circuit with electromagnetic communication
#115Proximity sensing using EHF signals
#116Millimeter wave integrated circuit with ball grid array package including transmit and receive channels
#117Communication circuit with impedance matching
#118Power amplifier modules with bifet and harmonic termination and related systems, devices, and methods
#119Power amplifier modules including bipolar transistor with grading and related systems, devices, and methods
#120Power amplifier modules including wire bond pad and related systems, devices, and methods
#121Integrated circuit package including miniature antenna
#122Encapsulated molded package with embedded antenna for high data rate communication using a dielectric waveguide
#123Heat management in electronics packaging
#124Impedance controlled electrical interconnection employing meta-materials
#125Semiconductor device
#126Amplifier
#127Semiconductor device, method of manufacturing the same, in-millimeter-wave dielectric transmission device, method of manufacturing the same, and in-millimeter-wave dielectric transmission system
#128Transformer input matched transistor
#129Amplifier
#130Matching techniques for wide-bandgap power transistors
#131RF power device
#132Semiconductor device, transmission system, method for manufacturing semiconductor device, and method for manufacturing transmission system
#133Semiconductor packages having wire bond wall to reduce coupling
#134Semiconductor package having wire bond wall to reduce coupling
#135Semiconductor device and radio communication device
#136Delta modulated low-power EHF communication link
#137Wafer scale technique for interconnecting vertically stacked dies
#138Integration of a replica circuit and a transformer above a dielectric substrate
#139Telemetry system for use with microstimulator
#140Semiconductor package having an over-temperature protection circuit utilizing multiple temperature threshold values
#141Semiconductor package having multi-phase power inverter with internal temperature sensor
#142Control and driver circuits on a power quad flat no-lead (PQFN) leadframe
#143Power quad flat no-lead (PQFN) package having control and driver circuits
#144Semiconductor device and circuit board
#145Power quad flat no-lead (PQFN) package having bootstrap diodes on a common integrated circuit (IC)
#146Power quad flat no-lead (PQFN) package in a single shunt inverter circuit
#147Open source power quad flat no-lead (PQFN) package
#148Semiconductor devices with impedance matching-circuits
#149SGS or GSGSG pattern for signal transmitting channel, and PCB assembly, chip package using such SGS or GSGSG pattern
#150Method and design of an RF thru-via interconnect
#151Inductor
#152Package with integrated pre-match circuit and harmonic suppression
#153Electronic components assembly
#154Electronic devices with multiple amplifier stages and methods of their manufacture
#155Electronic package for millimeter wave semiconductor dies
#156SEMICONDUCTOR PACKAGE, AND INFORMATION PROCESSING APPARATUS AND STORAGE DEVICE INCLUDING THE SEMICONDUCTOR PACKAGES
#157Data-driven charge-pump transmitter for differential signaling
#158Packaged integrated circuit using wire bonds
#159Structure for high-speed signal integrity in semiconductor package with single-metal-layer substrate
#160High frequency circuit device
#161Circuit coupling
#162Semiconductor chip comprising a directional coupler having a specific main line and sub-line arrangement
#163SYSTEM AND METHOD FOR PROVIDING IMPROVED IMPEDANCE MATCHING TO RF POWER TRANSISTOR USING SHUNT INDUCTANCE
#164Integrated circuit with electromagnetic intrachip communication and methods for use therewith
#165Apparatus and methods for packaging antennas with integrated circuit chips for millimeter wave applications
#166RF transistor packages with high frequency stabilization features and methods of forming RF transistor packages with high frequency stabilization features
#167System and method for wafer level packaging
#168Semiconductor device having first and second resistance for suppressing loop oscillation
#169Antenna device and wireless apparatus
#170Distance measurement using EHF signals
#171Proximity sensing using EHF signals
#172Delta modulated low power EHF communication link
#173Amplifier component comprising a compensation element
#174Scalable high-bandwidth connectivity
#175Integrated circuit with electromagnetic communication
#176Semiconductor device and radio communication device
#177Integrated circuit package including miniature antenna
#178Package and high frequency terminal structure for the same
#179Low cost high frequency device package and methods
#180Mixed wire bonding profile and pad-layout configurations in IC packaging processes for high-speed electronic devices
#181Class-AB power amplifier
#182RFID integrated circuit with integrated antenna structure
#183Filter having impedance matching circuits
#184Charging and communication system for a battery-powered microstimulator
#185Transmission line, impedance transformer, integrated circuit mounted device, and communication device module
#186Semiconductor device and wiring board
#187Power transistor output match network with high Q RF path and low Q low frequency path
#188High-frequency power amplifier device
#189ELEMENT CARRIER AND LIGHT RECEIVING MODULE
#190Radiofrequency amplifier
#191Integrated front-end passive equalizer and method thereof
#192Radiofrequency amplifier
#193Compensation network for RF transistor
#194Package and high frequency terminal structure for the same
#195DIFFERENTIAL SIGNAL TRANSMISSION LINE, IC PACKAGE, AND METHOD FOR TESTING SAID DIFFERENTIAL SIGNAL TRANSMISSION LINE AND IC PACKAGE
#196Integrated circuit with intra-chip clock interface and methods for use therewith
#197TSOP with impedance control
#198Method of making a high frequency device package
#199Power amplifier circuit
#200Impedance controlled electrical interconnection employing meta-materials
#201Method for controlling telemetry in an implantable medical device based on power source capacity
#202Semiconductor device, method of manufacturing the same, in-millimeter-wave dielectric transmission device, method of manufacturing the same, and in-millimeter-wave dielectric transmission system
#203Millimeter wave multi-layer packaging including an RFIC cavity and a radiating cavity therein
#204High-frequency module including a conductor with a slot therein and a conductive wire crossing over the slot and physically contacting the conductor
#205Integrated circuit with supply line intra-chip clock interface and methods for use therewith
#206High power semiconductor device for wireless applications and method of forming a high power semiconductor device
#207Microwave circuit package
#208Transmission line, impedance transformer, integrated circuit mounted device, and communication device module
#209RFID integrated circuit with integrated antenna structure
#210High frequency semiconductor device
#211Interconnection structure
#212Integrated front-end passive equalizer and method thereof
#213Radio frequency amplifier with effective decoupling
#214Telemetry system for use with microstimulator
#215Filter having impedance matching circuits
#216Galvanic isolators and coil transducers
#217Semiconductor device, method of manufacturing the same, and wireless transmission system utilizing the same
#218Electronic device
#219RF transistor packages with internal stability network including intra-capacitor resistors and methods of forming RF transistor packages with internal stability networks including intra-capacitor resistors
#220RADIO FREQUENCY POWER AMPLIFIER
#221Impedance optimized chip system
#222Integrated circuit
#223INTERPOSER, MODULE, AND ELECTRONICS DEVICE INCLUDING THE SAME
#224High frequency field-effect transistor
#225Multilayer dielectric substrate and semiconductor package
#226Radio-frequency system in package including antenna
#227Integrated circuit device and data transmission system
#228UNIFIED SCALABLE HIGH SPEED INTERCONNECTS TECHNOLOGIES
#229OPTICAL WIRING CABLE
#230Method for manufacturing group III nitride semiconductor, method for manufacturing group III nitride semiconductor light-emitting device, group III nitride semiconductor light-emitting device, and lamp
#231Chair pad charging and communication system for a battery-powered microstimulator
#232Method for assembling components of a microstimulator
#233Antennas using chip-package interconnections for millimeter-wave wireless communication
#234RF POWER AMPLIFIER CIRCUIT UTILIZING BONDWIRES IN IMPEDANCE MATCHING
#235SEMICONDUCTOR DEVICE
#236SEMICONDUCTOR DEVICE, TRANSMISSION SYSTEM, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING TRANSMISSION SYSTEM
#237Printed wiring board, printed IC board having the printed wiring board, and method of manufacturing the same
#238Semiconductor device
#239Integrated circuit mounted board, printed wiring board, and method of manufacturing integrated circuit mounted board
#240Wireless radio frequency signal transceiving system
#241LEADFRAME FOR SEMICONDUCTOR PACKAGES
#242Semiconductor device and manufacturing method therefor
#243Power device and a method for controlling a power device
#244Semiconductor device
#245RF power module
#246METHOD AND DEVICE TO IMPROVE SIGNAL-TO-NOISE RATIO IN HIGH-SPEED OPTICAL DATA COMMUNICATIONS
#247Interconnect System without Through-Holes
#248Semiconductor device in which a semiconductor chip is sealed
#249Semiconductor device and manufacturing method thereof
#250Bidirectional optical transceiver
#251Bond pad rerouting element, rerouted semiconductor devices including the rerouting element, and assemblies including the rerouted semiconductor devices
#252Semiconductor package with a controlled impedance bus and method of forming same
#253Semiconductor structure with communication element
#254Semiconductor device and radio communication device
#255Optical semiconductor apparatus
#256Return loss techniques in wirebond packages for high-speed data communications
#257Method for controlling telemetry in an implantable medical device based on power source capacity
#258Microwave Chip Supporting Structure
#259COMPACT PACKAGING FOR POWER AMPLIFIER MODULE
#260Semiconductor device having wiring formed on wiring board and electric conductor formed in wiring board and conductor chip formed over wiring
#261RF transistor output impedance technique for improved efficiency, output power, and bandwidth
#262Printed circuit board and differential signaling structure
#263Integrated front-end passive equalizer and method thereof
#264Differential internally matched wire-bond interface
#265Integrated circuit with supply line intra-chip clock interface and methods for use therewith
#266SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
#267High power integrated RF amplifier
#268Packaged integrated circuits having inductors and methods to form inductors in packaged integrated circuits
#269Integrated circuit and manufacturing process facilitating selective configuration for electromagnetic compatibility
#270Low cost high frequency device package and methods
#271Microwave chip supporting structure
#272Impedance compensated electrostatic discharge circuit for protection of high-speed interfaces and method of using the same
#273FORMING EDGE METALLIC CONTACTS AND USING COULOMB FORCES TO IMPROVE OHMIC CONTACT
#274MULTI-LAYERED WIRING SUBSTRATE, METHOD FOR PRODUCING THE SAME, AND SEMICONDUCTOR DEVICE
#275Reconfigurable system that exchanges substrates using coulomb forces to optimize a parameter
#276Method to build a wirebond probe card in a many at a time fashion
#277Semiconductor device
#278Integrated circuit with intra-chip clock interface and methods for use therewith
#279Packaged gallium nitride material transistors and methods associated with the same
#280Power recovery circuit based on partial standing waves
#281Semiconductor circuit with amplifier, bond wires and inductance compensating bond wire
#282Integrated circuit package including miniature antenna
#283MULTI-BAND TUNABLE RESONANT CIRCUIT
#284Three dimensional packaging optimized for high frequency circuitry
#285Elastic wave duplexer
#286Semiconductor component
#287Semiconductor device and printed circuit board
#288Integrated circuit with electromagnetic intrachip communication and methods for use therewith
#289INTEGRATED CIRCUIT WITH BONDING WIRE ANTENNA STRUCTURE AND METHODS FOR USE THEREWITH
#290Integrated circuit with power supply line antenna structure and methods for use therewith
#291RFID integrated circuit with integrated antenna structure
#292Bond pad rerouting element, rerouted semiconductor devices including the rerouting element, and assemblies including the rerouted semiconductor devices
#293RF transistor packages with internal stability network and methods of forming RF transistor packages with internal stability networks
#294Circuit arrangement and integrated circuit
#295Semiconductor chip mounting board with multiple ports
#296Semiconductor chip comprising a directional coupler having a specific main line and sub-line arrangement
#297Antenna device and radio communication device
#298Output Circuit
#299Class D amplifier arrangement
#300High frequency circuit board converting a transmission mode of high frequency signals