212843 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Technical effects; Material effects; Metallurgical effects Formation of Kirkendall voids
BONDING SCHEME FOR SEMICONDUCTOR PACKAGING
#2SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS
#3SEMICONDUCTOR DEVICE WITH MULTIPLE PASSIVATION MATERIALS AT A BONDING SURFACE
#4SEMICONDUCTOR CHIP AND METHOD FOR MANUFACTURING THEREOF
#5CORE BALL AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
#6SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
#7SEMICONDUCTOR PACKAGE AND WIRING SUBSTRATE INCLUDED IN THE SAME, AND MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
#8SEMICONDUCTOR DEVICE
#9BONDING SCHEME FOR SEMICONDUCTOR PACKAGING
#10SOLDER MATERIAL, LAYER STRUCTURE, CHIP PACKAGE, METHOD OF FORMING A LAYER STRUCTURE, AND METHOD OF FORMING A CHIP PACKAGE
#11BONDING METHOD, BONDED ARTICLE, AND BONDING DEVICE
#12SHAPED INTERCONNECT BUMPS IN SEMICONDUCTOR DEVICES
#13HEAT INSULATING INTERCONNECT FEATURES IN A COMPONENT OF A COMPOSITE IC DEVICE STRUCTURE
#14CU PADS FOR REDUCED DISHING IN LOW TEMPERATURE ANNEALING AND BONDING
#15Leadframes in semiconductor devices
#16SOLDER MATERIAL FOR SEMICONDUCTOR DEVICE
#17Copper deposition in wafer level packaging of integrated circuits
#18Semiconductor device having a contact clip with a contact region having a convex shape and method for fabricating thereof
#19Pre-molded leadframes in semiconductor devices
#20Semiconductor device bonding area including fused solder film and manufacturing method
#21Packaging devices and methods of manufacture thereof
#22Solder material for semiconductor device
#23COPPER PILLARS HAVING IMPROVED INTEGRITY AND METHODS OF MAKING THE SAME
#24EXPANDED HEAD PILLAR FOR BUMP BONDS
#25Semiconductor device and method for fabricating a semiconductor device
#26Packaging devices and methods of manufacture thereof
#27Copper deposition in wafer level packaging of integrated circuits
#28Electronic devices with bond pads formed on a molybdenum layer
#29Semiconductor device bonding area including fused solder film and manufacturing method
#30Joining material and joining method using same
#31Shaped interconnect bumps in semiconductor devices
#32Expanded head pillar for bump bonds
#33Pre-molded leadframes in semiconductor devices
#34Leadframes in semiconductor devices
#35Semiconductor die bond pad with insulating separator
#36Packaging devices and methods of manufacture thereof
#37Semiconductor device
#38Composite bump, method for forming composite bump, and substrate
#39Semiconductor device and method for manufacturing the same
#403D printed hermetic package assembly and method
#41Remapped packaged extracted die with 3D printed bond connections
#42Solder material for semiconductor device
#43Method for manufacturing electronic component and manufacturing apparatus of electronic component
#44SEMICONDUCTOR DEVICE
#45Semiconductor device assemblies including intermetallic compound interconnect structures
#46Packaging devices and methods of manufacture thereof
#47Interfacial alloy layer for improving electromigration (EM) resistance in solder joints
#48Electrode connection structure and electrode connection method
#49Integrated circuit structure having dies with connectors
#50Integrated circuit with printed bond connections
#51Method of forming an interconnection and arrangement for a direct interconnect chip assembly
#52Methods of forming semiconductor device assemblies and interconnect structures, and related semiconductor device assemblies and interconnect structures
#53Junction and electrical connection
#54Method for manufacturing semiconductor device, heat insulating load jig, and method for setting up heat insulating load jig
#55Integrated circuit structure having dies with connectors
#56Under ball metallurgy (UBM) for improved electromigration
#57Method and apparatus for printing integrated circuit bond connections
#58Treatment method of electrodeposited copper for wafer-level-packaging process flow
#59Metal core solder ball and heat dissipation structure for semiconductor device using the same
#60Interfacial alloy layer for improving electromigration (EM) resistance in solder joints
#61Method for manufacturing a metal pad structure of a die, a method for manufacturing a bond pad of a chip, a die arrangement and a chip arrangement
#62Semiconductor component support and semiconductor device
#63Submicron connection layer and method for using the same to connect wafers
#64METHOD AND APPARATUS FOR PROVIDING IMPROVED BACKSIDE METAL CONTACTS TO SILICON CARBIDE
#65Semiconductor device and method of manufacturing semiconductor device
#66MANUFACTURING METHOD FOR COMPOSITE ALLOY BONDING WIRE
#67Method for manufacturing wafer-bonded semiconductor device
#68Semiconductor device
#69Flip-chip Mounting Structure and Flip-chip Mounting Method
#70Thermally enhanced semiconductor package system
#71Semiconductor module
#72Method and system for improving reliability of a semiconductor device
#73Method of mounting LED chip
#74MODIFICATION OF PB-FREE SOLDER ALLOY COMPOSITIONS TO IMPROVE INTERLAYER DIELECTRIC DELAMINATION IN SILICON DEVICES AND ELECTROMIGRATION RESISTANCE IN SOLDER JOINTS
#75Hyper thermally enhanced semiconductor package system comprising heat slugs on opposite surfaces of a semiconductor chip
#76Electronic device, method of manufacturing the same, metal particle, and electroconductive paste
#77Methods for bonding substrates with transient liquid phase bonds by spark plasma sintering