H01L2924/40407 - CPC Classification Index

ClassID:

212888 ⎘

H01L2924/40407 - CPC Classification

Classification description:

Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of apparatuses used for either manufacturing connectors or connecting the semiconductor or solid-state body; LASER; Type being a solid state Yb:YAG LASER

Recent Application in this class:

20180366380

SEMICONDUCTOR PACKAGE INCLUDING A SEMICONDUCTOR DIE HAVING REDISTRIBUTED PADS

20170148692

Semiconductor package including a semiconductor die having redistributed pads

20150050781

Semiconductor package with embedded die and its methods of fabrication

20110215464

Semiconductor package with embedded die and its methods of fabrication

20070108585

Semiconductor package including a semiconductor die having redistributed pads