209066 ⎘
Solid state devices adapted for rectifying, amplifying, oscillating or switching without a potential-jump barrier or surface barrier, e.g. dielectric triodes; Ovshinsky-effect devices; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof; Bistable or multistable switching devices, e.g. for resistance switching non-volatile memory; Selection of switching materials; Compounds of sulfur, selenium or tellurium, e.g. chalcogenides Tellurides, e.g. GeSbTe
Methods for forming phase-change memory devices
#3002Semiconductor memory device with three dimensional solid electrolyte structure, and manufacturing method thereof
#3003Electric device with phase change material and parallel heater
#3004Method for making tapered opening for programmable resistance memory element
#3005Laminate structure, magnetic recording medium and method for producing the same, magnetic recording device, magnetic recording method, and element with the laminate structure
#3006Phase-change memory device and manufacturing process thereof
#3007Method for fabricating a resistive memory
#3008Phase change memory devices and fabrication methods thereof
#3009Phase-change RAM and method for fabricating the same
#3010Phase change memory device and method of manufacture thereof
#3011SnSe-based limited reprogrammable cell
#3012Resistive memory element with shortened erase time
#3013Precursor, thin layer prepared including the precursor, method of preparing the thin layer and phase-change memory device
#3014Phase change memory devices and fabrication methods thereof
#3015Phase change memory device
#3016Phase change memory cell with high read margin at low power operation
#3017Phase change memory cell with high read margin at low power operation
#3018Integrated circuit having a memory including a low-k dielectric material for thermal isolation
#3019Semiconductor device and a method of manufacturing the same
#3020Method of fabricating a thin film
#3021Deposition of multilayer structures including layers of germanium and/or germanium alloys
#3022Chemical vapor deposition of chalcogenide materials
#3023Pillar phase change memory cell
#3024Integrated circuit including a memory apparatus and production method
#3025Electric device comprising phase change material
#3026Phase change memory and fabricating method thereof
#3027Phase change memory cell with junction selector and manufacturing method thereof
#3028Forming nonvolatile phase change memory cell having a reduced thermal contact area
#3029Write-once nonvolatile phase change memory array
#3030Horizontal chalcogenide element defined by a pad for use in solid-state memories
#3031Semiconductor integrated circuit device
#3032Phase change memory that switches between crystalline phases
#3033Phase-change-type semiconductor memory device
#3034Phase change memory device and method of manufacturing
#3035Semiconductor memory cell and method of forming same
#3036Phase changable memory device structures
#3037Thin film layer, heating electrode, phase change memory including thin film layer and methods for forming the same
#3038Phase-change multi-level cell and operating method thereof
#3039Non-planarized, self-aligned, non-volatile phase-change memory array and method of formation
#3040Information recording medium and manufacturing method thereof
#3041Semiconductor device and manufacturing method thereof
#3042Ge precursor, GST thin layer formed using the same, phase-change memory device including the GST thin layer, and method of manufacturing the GST thin layer
#3043Phase-change memory device using chalcogenide compound as the material of memory cells
#3044Method of producing a microelectronic electrode structure, and microelectronic electrode structure
#3045Self-aligned small contact phase-change memory method and device
#3046Phase change memory device having phase change material layer containing phase change nano particles and method of fabricating the same
#3047Phase changeable memory cells and methods of forming the same
#3048Programmable resistance memory element with threshold switching material
#3049Multiple bit chalcogenide storage device
#3050Method for manufacturing a resistively switching memory cell, manufactured memory cell, and memory device based thereon
#3051Phase change memory cell with transparent conducting oxide for electrode contact material
#3052Chalcogenide memory having a small active region
#3053Semiconductor integrated circuit device and method of manufacturing the same
#3054Phase changeable memory device and method of formation thereof
#3055Side wall active pin memory and manufacturing method
#3056Memory device including resistance change layer as storage node and method(s) for making the same
#3057Electrically programmable memory element with improved contacts
#3058Method for manufacturing a small pin on integrated circuits or other devices
#3059Semiconductor and semiconductor manufacturing arrangements having a chalcogenide layer formed of columnar crystal grains perpendicular to a main substrate surface
#3060Switching element, line-switching device and logic circuit
#3061I-shaped and L-shaped contact structures and their fabrication methods
#3062Forming planarized semiconductor structures
#3063Circuit and method of controlling integrated circuit power consumption using phase change switches
#3064Programmable matrix array with phase-change material
#3065Programmable matrix array with phase-change material
#3066Forming phase change memory cell with microtrenches
#3067Multilevel phase-change memory, manufacture method and operating method thereof
#3068Phase change memory device employing thermally insulating voids and sloped trench, and a method of making same
#3069Integrated circuit including sub-lithographic structures
#3070Multibit phase change memory device and method of driving the same
#3071Phase change memory featuring ferromagnetic layers in contact with phase change layer
#3072Increasing adherence of dielectrics to phase change materials
#3073Multilevel phase-change memory, manufacturing and status transferring method thereof
#3074Multilevel phase-change memory element and operating method
#3075Methods of fabricating phase changeable semiconductor memory devices including multi-plug conductive structures and related devices
#3076PRAMs having a plurality of active regions located vertically in sequence and methods of forming the same
#3077Phase change memory with a select device having a breakdown layer
#3078Phase change memory with ovonic threshold switch
#3079Phase-changeable memory devices and methods of forming the same
#3080Switching or amplifier device, in particular transistor
#3081Resistive memory element
#3082Reducing leakage currents in memories with phase-change material
#3083One time programmable phase change memory
#3084Controlled breakdown phase change memory device
#3085Forming phase change memory arrays
#3086Vertical elevated pore phase change memory
#3087Memory circuit having memory cells which have a resistance memory element
#3088Antimony precursor, phase-change memory device using the antimony precursor, and method of manufacturing the phase-change memory device
#3089Sublithographic contact structure, phase change memory cell with optimized heater shape, and manufacturing method thereof
#3090Method of forming a phase change memory device having a small area of contact
#3091Fabricating memory components (PCRAMS) including memory cells based on a layer that changes phase state
#3092PRAMS having phase-change layer pattern with electrode contact area and methods of forming the same
#3093Method of forming via structures and method of fabricating phase change memory devices incorporating such via structures
#3094Phase-changeable memory devices including an adiabatic layer
#3095Methods of forming phase-change random access memories including a confined contact hole and integrated circuit devices including the same
#3096Semiconductor device and method of fabricating the same
#3097Methods for sputtering a target material by intermittently applying a voltage thereto and related apparatus, and methods of fabricating a phase-changeable memory device employing the same
#3098Methods of forming metal contact structures and methods of fabricating phase-change memory devices using the same
#3099Laser reflowing of phase changeable memory element to close a void therein
#3100Phase change memory device with thermal insulating layers
#3101Electric device with phase change material and method of manufacturing the same
#3102Semiconductor devices having a planarized insulating layer and methods of forming the same
#3103Memory device with switching glass layer
#3104Phase change memory with extra-small resistors
#3105Electrically programmable memory element with reduced area of contact
#3106Memory device, programmable resistance memory cell and memory array
#3107Phase-change memory device and method for manufacturing the same
#3108Phase-change random access memory device and method for manufacturing the same
#3109Phase-change memory device and method of manufacturing the same
#3110Phase-change random access memory device and method for manufacturing the same
#3111Phase-change random access memory device and method for manufacturing the same
#3112Initializing phase change memories
#3113Use of chalcogen plasma to form chalcogenide switching materials for nanoscale electronic devices
#3114Programmable structure, an array including the structure, and methods of forming the same
#3115Phase-changeable memory devices
#3116Low-current and high-speed phase-change memory devices and methods of driving the same
#3117Nanoscale programmable structures and methods of forming and using same
#3118High-density phase change cell array and phase change memory device having the same
#3119Semiconductor memory device and method for producing a semiconductor memory device
#3120Process for manufacturing integrated resistor and phase-change memory element including this resistor
#3121Programmable structure, an array including the structure, and methods of forming the same
#3122Indirect switching and sensing of phase change memory cells
#3123Semiconductor devices having phase change memory cells, electronic systems employing the same and methods of fabricating the same
#3124Phase-change memory device having a barrier layer and manufacturing method
#3125Phase-change memory device having a barrier layer and manufacturing method
#3126Manufacturing method of a contact structure and phase change memory cell with elimination of double contacts
#3127Methods for fabricating memory devices using sacrificial layers and memory devices fabricated by same
#3128Phase random access memory with high density
#3129Phase changeable memory cells and methods of fabricating the same
#3130Non-planarized, self-aligned, non-volatile phase-change memory array and method of formation
#3131Methods of fabricating phase change memory elements having a confined portion of phase change material on a recessed contact
#3132Phase-change memory cell and method of fabricating the phase-change memory cell
#3133Memory device comprising a non-phase-changing amorphous chalcogenide memory layer and a metal chalcogenide ion-source layer
#3134Memory device and storage apparatus
#3135Methods of forming phase-change memory devices
#3136Semiconductor memory cell, method for fabricating it and semiconductor memory device
#3137Memory device with an active material embedded in an insulating material
#3138Method of forming a chalcogenide memory cell having a horizontal electrode and a memory cell produced by the method
#3139Information recording medium and method for manufacturing the same
#3140Semiconductor device
#3141Electrically programmable memory element with reduced area of contact and method for making same
#3142Method to selectively increase the top resistance of the lower programming electrode in a phase-change memory cell and structures obtained thereby
#3143Reduced active area in a phase change memory structure
#3144Phase-changeable memory device and method of manufacturing the same
#3145Phase change memory cell and method of its manufacture
#3146Phase change access device for memories
#3147Forming tapered lower electrode phase-change memories
#3148Memory device electrode with a surface structure
#3149Phase-change memory device and method of manufacturing the same
#3150Small electrode for a chalcogenide switching device and method for fabricating same
#3151Phase-change memory cell and method of fabricating the phase-change memory cell
#3152Phase change memory devices including memory elements having variable cross-sectional areas
#3153Non-volatile memory cell comprising a dielectric layer and a phase change material in series
#3154Method of forming resistance variable devices
#3155Multiple data state memory cell
#3156Phase change memory and phase change recording medium
#3157Phase change memory cell and manufacturing method thereof using minitrenches
#3158Horizontal chalcogenide element defined by a pad for use in solid-state memories
#3159Process for forming tapered trenches in a dielectric material
#3160Lateral phase change memory and method therefor
#3161Memory devices having sharp-tipped phase change layer patterns
#3162Reducing shunts in memories with phase-change material
#3163Phase change resistor cell and nonvolatile memory device using the same
#3164Phase change resistor cell, nonvolatile memory device and control method using the same
#3165Solid electrolyte switching device, FPGA using same, memory device, and method for manufacturing solid electrolyte switching device
#3166Field emission phase change diode memory
#3167Phase change tip storage cell
#3168Integrated circuit with upstanding stylus
#3169Memory device and method of operating same
#3170Storage device
#3171Method of fabrication of non-volatile memory
#3172Information recording medium and method for manufacturing the same
#3173Method of driving a non-volatile memory
#3174Sputtering target for phase-change memory, film for phase change memory formed by using the target, and method for producing the target
#3175Multi-bit phase change memory cell and multi-bit phase change memory including the same, method of forming a multi-bit phase change memory, and method of programming a multi-bit phase change memory
#3176Semiconductor integrated circuit device
#3177Phase change memory devices with contact surface area to a phase changeable material defined by a sidewall of an electrode hole and methods of forming the same
#3178Forming phase change memories
#3179Methods of fabricating phase changeable memory devices having reduced cell areas
#3180Phase-change memory device using chalcogenide compound as the material of memory cells
#3181Spacer chalcogenide memory device
#3182Programmable resistance memory element with threshold switching material
#3183Phase change material memory device
#3184Information recording medium and method for manufacturing the same
#3185Process for manufacturing a phase change memory array in Cu-damascene technology and phase change memory array manufactured thereby
#3186Electrically programmable memory element
#3187Chalcogenide phase-change non-volatile memory, memory device and method for fabricating the same
#3188Spacer chalcogenide memory method
#3189Information recording medium and method for manufacturing the same
#3190Memory device with discrete layers of phase change memory material
#3191Phase changeable layers including protruding portions in electrodes thereof and methods of forming same
#3192Non-volatile memory
#3193Method of fabricating a conductive path in a semiconductor device
#3194Pore structure for programmable device
#3195Method for making memory elements
#3196Phase change memory device employing thermal-electrical contacts with narrowing electrical current paths
#3197Process for defining a chalcogenide material layer, in particular in a process for manufacturing phase change memory cells
#3198Controlling the location of conduction breakdown in phase change memories
#3199Damascene phase change memory
#3200Forming planarized semiconductor structures
#3201Phase change recording film having high electric resistance and sputtering target for forming phase change recording film
#3202Methods for fabrication for phase-changeable memory devices having phase-changeable material regions with lateral contacts
#3203Multilayered phase change memory
#3204Damascene conductive line for contacting an underlying memory element
#3205Method and apparatus for forming an integrated circuit electrode having a reduced contact area
#3206Phase change access device for memories
#3207Reducing parasitic conductive paths in phase change memories
#3208Lateral phase change memory
#3209Processing phase change material to improve programming speed
#3210Phase change memory devices having phase change area in porous dielectric layer
#3211Resistance variable device
#3212Information recording medium and method for producing the same
#3213Information recording medium and method for producing the same
#3214Phase-change memory device and manufacturing method thereof
#3215Resistance variable memory elements and methods of formation
#3216Programmable resistance memory element
#3217Semiconductor memory device and method for fabricating the same
#3218Programmable resistance memory element with multi-regioned contact
#3219Phase changeable memory devices including nitrogen and/or silicon and methods for fabricating the same
#3220Self-aligned process for manufacturing a phase change memory cell and phase change memory cell thereby manufactured
#3221Semiconductor logic circuits including a non-volatile memory cell
#3222Memory Arrays
#3223PCRAM analog programming by a gradual reset cooling step
#3224Three-dimensional nonvolatile memory
#3225Integrated resistive processing unit to avoid abrupt set of RRAM and abrupt reset of PCM
#3226Single-sided liner PCM cell for 3D crossbar PCM memory
#3227Phase-change material (PCM) radio frequency (RF) switches with stressor layers and contact adhesion layers
#3228Low temperature film for PCRAM sidewall protection
#3229Three-dimensional memory array
#3230Transition metal doped germanium-antimony-tellurium (GST) memory device components and composition
#3231PCM RF switch fabrication with subtractively formed heater
#3232High reliability RF switch based on phase-change material
#3233Manufacturing RF switch based on phase-change material
#3234Confined phase change memory with double air gap
#3235Phase change memory with gradual resistance change
#3236Three-dimensional phase change memory array including discrete middle electrodes and methods of making the same
#3237Phase change memory and method of fabricating same
#3238Electrostatic discharge protection devices including a field-induced switching element
#3239Semiconductor memory capable of reducing an initial turn-on voltage of a memory cell using a stress pulse in a test mode, and method for driving the same
#3240Memory device
#3241P-Type chalcogenide and n-type silicon heterojunction infared photodiodes and method of manufacturing thereof
#3242Three-dimensional cross rail phase change memory device and method of manufacturing the same
#3243Drift mitigation with embedded refresh
#3244Three-dimensional phase change memory arrays and methods of manufacturing the same
#3245Selective phase change material growth in high aspect ratio dielectric pores for semiconductor device fabrication
#3246Tone inversion integration for phase change memory
#3247Phase change memory electrode with multiple thermal interfaces
#3248Static random access memory device and forming method thereof
#3249Dielectric doped, Sb-rich GST phase change memory
#3250Resistive memory device including a lateral air gap around a memory element and method of making thereof
#3251Semiconductor device and method for fabricating the same
#3252P-type chalcogenide and N-type silicon heterojunction infrared photodiodes and method of manufacturing thereof
#3253Semiconductor structure
#3254Phase change memory with high endurance
#3255Self-selecting local bit line for a three-dimensional memory array
#3256Memory having an interlayer insulating structure with different thermal resistance
#3257Multi-level phase change device
#3258Memory device
#3259Memory device
#3260Memory device and method of manufacturing the same
#3261Hetero-switching layer in a RRAM device and method
#3262Method to make phase-change material RF switches with thermal dielectrics