215787 ⎘
Semiconductor lasers; Structural details or components not essential to laser action Separation of the wafer into individual elements, e.g. by dicing, cleaving, etching or directly during growth
Sub-classes:VERTICAL CAVITY SURFACE EMITTING LASER AND HEAD GIMBAL ASSEMBLY
#2Manufacturing Process for Lidar System with Individualized Semiconductor Optical Amplifier Dies
#3ADDRESSABLE VERTICAL CAVITY SURFACE EMITTING LASER APPARATUS
#4ETCHED TRENCHES IN BOND MATERIALS FOR DIE SINGULATION, AND ASSOCIATED SYSTEMS AND METHODS
#5OPTOELECTRONIC SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING A PLURALITY OF OPTOELECTRONIC SEMICONDUCTOR COMPONENTS
#6METHOD FOR PRODUCING A MULTIPLICITY OF SEMICONDUCTOR LASER CHIPS, AND SEMICONDUCTOR LASER CHIP
#7SUBCARRIER WAFER, SUBCARRIER, METHOD FOR MANUFACTURING SUBCARRIER WAFER
#8METHOD FOR MANUFACTURING OPTOELECTRONIC COMPONENTS, AND OPTOELECTRONIC COMPONENTS
#9METHOD OF MANUFACTURING SEMICONDUCTOR OPTICAL DEVICE
#10SEMICONDUCTOR DEVICE
#11SEMICONDUCTOR SUBSTRATE, SEMICONDUCTOR DEVICE, AND ELECTRONIC DEVICE
#12Quantum cascade laser devices with improved heat extraction
#13BONDING DEVICE AND BONDING METHOD
#14Unitized laser chip with double topological structures
#15Optical element array, optical system and method of manufacturing optical element array
#16TRANSFER PROCESS TO REALIZE SEMICONDUCTOR DEVICES
#17COMPONENTS WITH WAFER LEVEL OPTICS
#18Method for separating a solid body
#19Process for Manufacturing Optoelectronic Components and Optoelectronic Component
#20VERTICAL CAVITY SURFACE EMITTING LASER AND HEAD GIMBAL ASSEMBLY
#21OPTOELECTRONIC SEMICONDUCTOR CHIP COMPRISING A CONTACT ELEMENT AND METHOD OF MANUFACTURING AN OPTOELECTRONIC SEMICONDUCTOR CHIP
#22SEMICONDUCTOR LASER DRIVING APPARATUS, ELECTRONIC EQUIPMENT, AND MANUFACTURING METHOD OF SEMICONDUCTOR LASER DRIVING APPARATUS
#23QUANTUM CASCADE LASER DEVICES WITH IMPROVED HEAT EXTRACTION
#24Edge-emitting semiconductor laser diode and method for producing a plurality of edge-emitting semiconductor laser diodes
#25INTEGRATED CIRCUIT PACKAGE AND SYSTEM USING SAME
#26Array device manufacturing method, manufacturing apparatus, and storage medium
#27METHOD FOR OBTAINING ELECTRONIC DEVICES AND ELECTRONIC DEVICES
#28Die layout calculation method, apparatus, medium, and device
#29Laser element and method for producing same
#30Method for producing semiconductor lasers and semiconductor lasers
#31Integrated vertical emitter structure having controlled wavelength
#32Vertical-cavity surface-emitting laser fabrication on large wafer
#33Method for producing a detachment area in a solid body
#34Optoelectronic semiconductor body having a layer stack, arrangement of a plurality of optoelectronic semiconductor bodies having a layer stack, and method for producing said optoelectronic semiconductor body
#35Method for manufacturing optical device and optical device
#36Etched trenches in bond materials for die singulation, and associated systems and methods
#37Semiconductor devices and methods for producing the same
#38Method for producing a plurality of transferable components and composite component of components
#39Puncture forming method, sample separating method, semiconductor element manufacturing method, semiconductor laser element manufacturing method, and semiconductor laser element
#40Optoelectronic modules having transparent substrates and method for manufacturing the same
#41Method of manufacturing light-emitting module, light-emitting module, and device
#42Laser diodes separated from a plurality of laser bars
#43Optical element array, optical system and method of manufacturing optical element array
#44Photonics optoelectrical system
#45Wafer level optic and zoned wafer
#46Laser element
#47Semiconductor laser and method for producing a semiconductor laser
#48Integrated circuit package and system using same
#49Method for manufacturing a semiconductor element
#50Elastomeric layer fabrication for light emitting diodes
#51Separating a wafer of light emitting devices
#52Trenches for increasing a quantity of reliable chips produced from a wafer
#53Semiconductor laser device
#54Surface-emitting laser device and light emitting device including the same
#55Elastomeric layer fabrication for light emitting diodes
#56Elastomeric layer fabrication for light emitting diodes
#57Height detecting apparatus and laser processing apparatus
#58INTEGRATED PACKAGE FOR LASER DRIVER AND LASER DIODE
#59Method of producing a plurality of laser diodes and laser diode
#60Quantum cascade laser
#61Semiconductor laser and method for producing a semiconductor laser
#62Semiconductor laser and semiconductor laser arrangement
#63Etched trenches in bond materials for die singulation, and associated systems and methods
#64Light emitting device
#65Method for producing a diamond electrode and diamond electrode
#66Edge-emitting etched-facet lasers
#67Edge-emitting etched-facet lasers
#68METHOD OF PRODUCING A SEMICONDUCTOR BODY
#69Separating a wafer of light emitting devices
#70Laser-based separation method
#71Hybrid optical source with optical proximity coupling provided by an external reflector
#72Method of producing optoelectronic semiconductor chips
#73METHOD OF MANUFACTURING SEMICONDUCTOR LASER ELEMENT
#74Protective film forming method for forming a protective film on a wafer
#75Method of processing a substrate
#76Back-side-emitting vertical cavity surface emitting laser (VCSEL) wafer bonded to a heat-dissipation wafer, devices and methods
#77Method for manufacturing an optical member and method for manufacturing a semiconductor laser device
#78Manufacturable RGB laser diode source
#79Semiconductor device manufacturing method and semiconductor device
#80Separating a wafer of light emitting devices
#81Processing method of single-crystal substrate
#82Densely-spaced laser diode configurations
#83Method of producing a semiconductor body
#84Laser component assembly and method of producing a laser component
#85Manufacturing method of light-emitting device
#86Methods of manufacturing semiconductor laser element and semiconductor laser device
#87Laser submounts formed using etching process
#88Semiconductor laser device and manufacturing method thereof
#89Method for producing semiconductor laser elements and semi-conductor laser element
#90SOLDERABLE PAD FABRICATION FOR MICROELECTRONIC COMPONENTS
#91Methods for performing extended wafer-level packaging (eWLP) and eWLP devices made by the methods
#92Method for producing a laser diode, mount and laser diode
#93Method of producing a semiconductor laser element, and semiconductor laser element
#94Etched trenches in bond materials for die singulation, and associated systems and methods
#95Edge-emitting etched-facet lasers
#96Semiconductor laser element and method of manufacturing the same
#97Structure and method for edge-emitting diode package having deflectors and diffusers
#98Laser processing method
#99Highly integrable semiconductor device
#100High reliability etched-facet photonic devices
#101High reliability etched-facet photonic devices
#102High reliability etched-facet photonic devices
#103High reliability etched-facet photonic devices
#104Semiconductor lasers and etched-facet integrated devices having non-uniform trenches
#105Method for singulating a component composite assembly
#106Method for producing a semiconductor body
#107Method of producing at least one optoelectronic semiconductor chip
#108Laser submounts formed using etching process
#109Etched trenches in bond materials for die singulation, and associated systems and methods
#110Edge-emitting etched-facet lasers
#111Edge-emitting semiconductor laser
#112Method for manufacturing light-emitting device
#113Method of making semiconductor optical integrated device by alternately arranging spacers with integrated device arrays
#114Semiconductor laser
#115Method and apparatus for improved laser scribing of opto-electric devices
#116AlGaInN-based lasers produced using etched facet technology
#117Algainn-based lasers produced using etched facet technology
#118Method of manufacturing semiconductor light emitting element
#119Wafer-level In-P Si bonding for silicon photonic apparatus
#120Integrating and aligning laser chips on sliders for HAMR applications
#121SEMICONDUCTOR LASER DEVICE AND MANUFACTURING METHOD THEREOF
#122Semiconductor laser device and method of manufacturing the same
#123Nitride semiconductor wafer, nitride semiconductor chip, method of manufacture thereof, and semiconductor device
#124Nitride semiconductor laser element
#125Method of removing a compound semiconductor layer from a compound semiconductor device
#126Highly integrable edge emitting active optical device and a process for manufacture of the same
#127Nitride semiconductor laser device and method of producing the same
#128Method for producing semiconductor optical device
#129Nitride semiconductor laser device and method of producing the same
#130Wafer based optical chassis and associated methods
#131Manufacturing method of semiconductor laser element
#132Photoelectrochemical etching for laser facets
#133Semiconductor light emitting element and method for manufacturing the same
#134Sealed semiconductor device
#135Gallium nitride-based epitaxial wafer and method of producing gallium nitride-based semiconductor light-emitting device
#136Low cost InGaAlN based lasers
#137Low Cost InGaAlN Based Lasers
#138NITRIDE SEMICONDUCTOR LASER DEVICE AND ITS MANUFACTURING METHOD
#139Diode laser bars and method for the production thereof
#140Nitride Semiconductor Laser and Method for Fabricating Same
#141Method for laterally cutting through a semiconductor wafer and optoelectronic component
#142Method for manufacturing nitride semiconductor laser element
#143Nitride-based semiconductor device and method of manufacturing the same
#144Optical device manufacturing method
#145Method for producing a semiconductor laser, and semiconductor laser
#146Semiconductor laser device and method of manufacturing the same
#147Method of manufacturing substrate for forming device, and method of manufacturing nitride-based semiconductor laser diode
#148Method of isolating semiconductor laser diodes
#149Method of manufacturing nitride semiconductor device
#150Method for fabricating optical semiconductor device
#151Method of manufacturing light emitting device with a pair of ridge protection electrodes
#152Method for manufacturing semiconductor laser device and method for inspecting semiconductor laser bar
#153Nitride semiconductor device and method of manufacturing the same
#154Method for manufacturing a nitride semiconductor laser element and a nitride semiconductor laser element
#155Low cost InGaAIN based lasers
#156Nitride semiconductor laser chip and fabrication method thereof
#157Semiconductor wafer and method for cutting the same
#158Semiconductor laser device and method of manufacturing the same
#159Method of fabricating semiconductor laser diode apparatus and semiconductor laser diode apparatus
#160Fabrication of Conductive Metal Layer on Semiconductor Devices
#161Method for manufacturing a semiconductor laser
#162Die separation
#163Optical semiconductor device
#164SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
#165Semiconductor element, semiconductor device, and method for fabrication thereof
#166Method for fabrication of a semiconductor device
#167Fabrication of semiconductor devices
#168Compound semiconductor device and method for manufacturing same
#169Semiconductor laser device
#170AlGaInN-based lasers with dovetailed ridge
#171Semiconductor laser having protruding portion
#172Method for manufacturing nitride semiconductor laser element, and nitride semiconductor laser element
#173SCRIBING SAPPHIRE SUBSTRATES WITH A SOLID STATE UV LASER
#174Semiconductor laser manufacturing method
#175Nitride semiconductor laser device and method of producing the same
#176Single-photon generating device, single-photon detecting device, and optical quantum gate
#177Method for Production of Semiconductor Chip, and Semiconductor Chip
#178Electrical connection for optoelectronic devices
#179Method of manufacturing high power array type semiconductor laser device
#180Optical apparatus
#181Semiconductor laser and method for manufacturing the same
#182Substrate for vertical cavity surface emitting laser ( VCSEL) and method for manufacturing VCSEL device
#183Semiconductor laser device and method of manufacturing the same
#184Manufacturing method for nitride semiconductor device and nitride semiconductor light emitting device obtained with the same
#185Low cost InGaAIN based lasers
#186Apparatuses and methods for forming assemblies
#187AlGaInN-based lasers produced using etched facet technology
#188Method for manufacturing laser devices
#189Semiconductor substrate, substrate for semiconductor crystal growth, semiconductor device, optical semiconductor device, and manufacturing method thereof
#190Semiconductor laser and method for manufacturing the same
#191High reliability etched-facet photonic devices
#192Single crystal wafer for semiconductor laser
#193Manufacturing method of semiconductor laser devices and manufacturing apparatus of the same
#194Integrated diode in a silicon chip scale package
#195Scribing sapphire substrates with a solid state UV laser with edge detection
#196Semiconductor element, semiconductor device, and method for fabrication thereof
#197Method for dividing substrate
#198Web fabrication of devices
#199Scribing sapphire substrates with a solid state UV laser
#200Apparatuses and methods for forming assemblies
#201Semiconductor laser having protruding portion
#202Semiconductor element and method for producing the same
#203Method to obtain contamination free laser mirrors and passivation of these
#204Surface emitting semiconductor laser chip and method for producing the chip
#205Optoelectronic device packaging with hermetically sealed cavity and integrated optical element
#206Separating of optical integrated modules and structures formed thereby
#207Nitride semiconductor laser device and method of manufacturing the nitride semiconductor laser device
#208Manufacturing process for LIDAR system with individualized semiconductor optical amplifier dies