Different thermal zones in an opto-electronic module

Device and method for determining the temperature of a heat sink

Circuit board and manufacturing method thereof

Board assembly including cooling system and electronic apparatus

CPU package substrates with removable memory mechanical interfaces

Printed circuit board and motor drive apparatus including the printed circuit board

Opto-electric hybrid board

Heat sink for a square camera

Electronic module

Film capacitor having a package for heat transfer

Power conversion apparatus

Device including a printed circuit board and a metal workpiece

SERVER

Thermal energy storage with a phase-change material in a non-metal container

Electrical assembly within a connector housing

Circuit board

Printed circuit board clip

Assemblies and methods for directly connecting integrated circuits to electrically conductive sheets

Cooled printed circuit with multi-layer structure and low dielectric losses

System and method of providing a semiconductor carrier and redistribution structure

Antenna impedance matching and aperture tuning circuitry

Printed circuit module having a semiconductor device with a protective layer in place of a low-resistivity handle layer

Solid state contactor with improved interconnect structure

Methods of manufacturing a printed circuit module having a semiconductor device with a protective layer in place of a low-resistivity handle layer

Capacitor with improved heat dissipation

Light emitting device

Drive unit

Method of manufacturing printed-circuit board assembly

Printed circuit board and lighting unit including the same

Copper heat dissipation material, carrier-attached copper foil, connector, terminal, laminate, shield material, printed-wiring board, metal processed member, electronic device and method for manufacturing the printed wiring board

Surface mountable, toroid magnetic device

Electronic module and the fabrication method thereof

Optical module assembly with improved printed circuit board

Automatic height compensating and co-planar leveling heat removal assembly for multi-chip packages

Internal heat-dissipation terminal

PRINTED CIRCUIT BOARD AND ELECTRONIC COMPONENT PACKAGE HAVING THE SAME

Circuit board including heat dissipation structure

CIRCUIT BOARD MODULE AND CIRCUIT BOARD STRUCTURE

Power supply device and a synchronous rectifier PCB

STRUCTURE OF LED HEAT DISSIPATING SUBSTRATE AND METHOD OF MANUFACTURING SUCH SUBSTRATE

Thermal conduction to a cylindrical shaft

Electronic device and heat dissipation plate

Liquid cooled metal core printed circuit board

Circuit card assembly with thermal energy removal

Heat sink assembly and method of utilizing a heat sink assembly

Computer housing

Graphene-based thermal management cores and systems and methods for constructing printed wiring boards

Constructions comprising rutile-type titanium oxide; and methods of forming and utilizing rutile-type titanium oxide

Circuit board and electronic apparatus

Flexible LED device with wire bond free die

Device cover for thermal management

Shield to improve electromagnetic interference (EMI) suppression capability

Receptacle assembly and module assembly

Solder alloy free electronic (safe) rigid-flexible/stretchable circuit assemblies having integral, conductive and heat spreading sections and methods for their manufacture

Electronic assembly with frame for thermal dissipation

Semiconductor device

Display device with flexible circuit board having graphite substrate

Flexible circuit board with graphite substrate and circuit arrangements using same

Circuit boards with thermal control and methods for their design

Heat transfer management apparatuses having a composite lamina

LED light arrangement with flexible circuit board having graphite substrate

Fixation of heat sink on SFP/XFP cage

Electronic device console with natural draft cooling

Electronic, optoelectronic, or electric arrangement

Substrate for power modules, substrate with heat sink for power modules, and power module

Power semiconductor module with current sensor

NETWORK DEVICE, SYSTEM AND METHOD HAVING A ROTATED CHIP FLOORPLAN

Electronic substrate with heat dissipation structure

Lighting device comprising a roll

Thermal solutions for system-in-package assemblies in portable electronic devices

Semiconductor device

Backlight assembly and liquid crystal display using the same

Circuit-and-heat-dissipation assembly and method of making the same

Chip Heat Dissipation Structure and Terminal Device

Power module substrate, heat-sink-attached power module substrate, and heat-sink-attached power module

Compressible thermally conductive articles

Display device

Heat sinking pad and printed circuit board

Semiconductor package

Substrate and metal layer manufacturing method

Passive system of powering and cooling with liquid metal and method thereof

Transversely actuated piezoelectric bellows heatsink

Graphics card cooler

System and method for thermally coupling memory devices to a memory controller in a computer memory board

Mounting structure of electronic components provided with heat sink

Mobile terminal

Thermal clamp apparatus for electronic systems

Method of manufacturing a multichip package structure

Multi-component heatsink with self-adjusting pin fins

Printed circuit board and electric filter

Backside initiated uniform heat sink loading

Thermal management system and method

Device having heat sink

Metal-free monolithic epitaxial graphene-on-diamond PWB

Electronic device with combination heat sink/blower or fan assembly having air duct

Metal-Free Monolithic Epitaxial Graphene-On-Diamond PWB With Optical Waveguide

Chip and circuit structure

Heat radiation printed circuit board, method of manufacturing the same, backlight unit including the same, and liquid crystal display device

Power module

Electromagnetic shielding member and electromagnetic shielding structure

Combined electromagnetic shield and thermal management device

Power semiconductor device

Thermal management structures for optoelectronic modules

Solid state lighting apparatuses, systems, and related methods

Low-profile outdoor lighting module with light emitting diodes

Electronic control device

Noise suppression circuit board design for an inductive heater

COMPUTING DEVICE WITH PHASE CHANGE MATERIAL THERMAL MANAGEMENT

Thermal tube assembly structures

Electronic module and method of manufacturing the same

Thermal module accounting for increased board/die size in a portable computer

Printed wiring board

HEAT-DISSIPATING SHEET HAVING HIGH THERMAL CONDUCTIVITY AND ITS PRODUCTION METHOD

Heat radiation member, heat radiation circuit board, and heat emission device package

Computer thermal system

Circuit board with phase change material

Heat dissipation for substrate assemblies

Heat sink with configurable grounding

Hardware shield device and electronic devices including the same

Thermally conductive flexible adhesive for aerospace applications

Air cooled inline sensor light source with solid state UV emitter

Substrate for light-emitting diode

Substrate design for semiconductor packages and method of forming same

System and method for redirecting airflow across an electronic assembly

Vehicle-mounted antenna device

High pin count, small packages having heat-dissipating pad

MULTILAYER WIRING BOARD

Power module substrate and power module

Electric power semiconductor device

SEMICONDUCTOR MODULE

Electronic control apparatus

Packaging shell and a power module having the same

Solid state memory unit cooling apparatus

Wireless module and wireless device

SMT heat sink anchor

HEAT DISSIPATION ASSEMBLY AND PORTABLE ELECTRONIC DEVICE EMPLOYING SAME

RADIO MODULE AND RELEVANT MANUFACTURING METHOD

Stacked Heatsink Assembly

Wiring substrate, manufacturing method therefor, and semiconductor package

Double insulated heat spreader

Apparatus having management of electrical power capacity regions and management of thermal capacity regions

GRAPHITE COMPOSITE MATERIAL

Electronic control unit and electric power steering apparatus having the same

Electronic control unit and electric power steering apparatus having the same

Electronic control unit and electric power steering apparatus having the same

Electronic control unit and electric power steering apparatus having the same

Method of assembling a heat dissipating module of an electronic device

Electronic module and heat dissipation module

Heat sink and heat dissipation system

DC/DC POWER MODULE AND DC/DC POWER SYSTEM HAVING THE SAME

Reusable phase-change thermal interface structures

Printed circuit board with fluid flow channels

Film wiring substrate and light emitting device

Electronic apparatus and method for fabricating the same

Power conversion device and method for assembling the same

Power conversion device and power conversion assembly

Solder void reduction for component attachment to printed circuit boards

Circuit board and heat dissipation device thereof

Module IC package structure and method for manufacturing the same

ELECTRICAL ASSEMBLY WITH A SOLDER SPHERE ATTACHED HEAT SPREADER

Circuit card assembly and method of fabricating the same

Package-on-package device

Refrigeration apparatus

Heat dissipating high power systems

Surface modification of hoses to reduce depletion of corrosion inhibitor

Circuit board, electronic module and illuminating device having the circuit board, and method for manufacturing the circuit board

Integrated circuit chip comprising electronic device and electronic system

Chip heat dissipation structure and liquid crystal display having thereof

Motor control device

Semiconductor device and method for manufacturing the same

PUSH PIN AND GRAPHICS CARD WITH THE PUSH PIN

Substrate, chip arrangement, and method for manufacturing the same

Computer provided with cooling system

Cooler, electrical component unit, and refrigeration apparatus

Refrigerating apparatus

Mounting arrangement and method for light emitting diodes

LED module and method of bonding thereof

Portable electronic device and battery pack for the same

Solder and lead free electronic circuit and method of manufacturing same

Integrated circuit chip cooling device

Heat dissipation material and light emitting diode package including a junction part made of the heat dissipation material

ELECTRONIC DEVICE WITH HEAT DISSIPATION FUNCTION

Cooling Structure for Electronic Circuit Board, and Electronic Device Using the Same

Solid state relay

In-vehicle power conversion system

Light-emitting diodes

Electrical Device for Use in an Automotive Vehicle and Method for Cooling Same

Power module substrate, power module substrate with heat sink, and power module

HEADER FOR ELECTRONIC COOLER

Electronic element and electronic device

Sn-Cu-based lead-free solder alloy

Configurable heat conducting path for portable electronic device

Light emitting package having a guiding member guiding an optical member

Printed wiring board

Jumper Fin

Semiconductor light-emitting module and vehicle luminaire

PRINTED CIRCUIT BOARD AND METHOD OF FABRICATING THE SAME

ELECTRONIC COMPONENT-EMBEDDED PRINTED CIRCUIT BOARD HAVING COOLING MEMBER

Electronic device and method for manufacturing same

Circuit arrangement and method for manufacturing the same

Thermal interface material for integrated circuit package

Power supply device and components thereof

Package for housing electronic component and electronic device

Computer Architecture

Interposer and semiconductor device including the same

Computer thermal management

Computer internal architecture

Fixing assembly

Assembling structure of heat dissipation device

High pin count, small SON/QFN packages

Thermal management structures for optoelectronic systems

Semiconductor device including a plurality of semiconductor chips, and a cover member with first and second brims

DC-DC converter

Power electronics assemblies, insulated metal substrate assemblies, and vehicles incorporating the same

Printed wiring boards having thermal management features and thermal management apparatuses comprising the same

System for fast and accurate filling of a two-phase cooling device, notably a heat pipe, adapted for use in an automated process

ELECTRONIC COMPONENT PACKAGE

EPOXY RESIN COMPOUND AND RADIANT HEAT CIRCUIT BOARD USING THE SAME

Method and device for cooling soldered printed circuit boards

Substrate spacing member and inverter device

Lighting fixture with reflector and template PCB

Wiring substrate and manufacturing method thereof

Apparatus and method for a back plate for heat sink mounting

Drive circuit device

Heterogeneous thermal interface

Electronic module

Methods of manufacturing lighting assembly with thermal overmolding

Circuit board element having at least one LED

Circuit board assembly using metal plates as conducting medium embedded therein

Circuit Board Assembly

Backlight module, printed circuit board used for backlight module, and manufacturing method for the same

Method and apparatus for implementing optical modules in high temperatures

SWITCHING CIRCUIT LAYOUT WITH HEATSINK

INSULATING FILM FOR PRINTED CIRCUIT BOARD HAVING IMPROVED THERMAL CONDUCTIVITY, MANUFACTURING METHOD THEREOF, AND PRINTED CIRCUIT BOARD USING THE SAME

Cooling for electronic components

hBN INSULATOR LAYERS AND ASSOCIATED METHODS

Modular lighting system and method employing loosely constrained magnetic structures

Circuit assemblies including thermoelectric modules

Automation device having a heatsink

Electronic device with air guiding plates

LED module and method of bonding thereof

Arrangement for cooling subassemblies of an automation or control system

Circuit board

Passive component as thermal capacitance and heat sink

MOUNTING APPARATUS FOR BRACKET OF HEAT SINK

Electronic device, structure, and heat sink

Heat dissipating module with enhanced heat dissipation efficiency and electronic device therewith

System to improve an in-line memory module

Method of manufacturing a hybrid heat-radiating substrate

Circuit device and method of manufacturing the same

Device mounting board and semiconductor power module

Circuit board structure having measures against heat

Circuit board for electric components and circuit board system

Control device and motor unit including the control device

Thermal dissipating module

Coupling assembly of power semiconductor device and PCB and method for manufacturing the same

CURVED PRINTED CIRCUIT BOARDS, LIGHT MODULES, AND METHODS FOR CURVING A PRINTED CIRCUIT BOARD

Method for producing a circuit board system

Thermally-conductive particles in printed wiring boards

Chip resistor with outrigger heat sink

CLIP ASSEMBLY AND HEAT DISSIPATION DEVICE INCORPORATING THE SAME

CLIP ASSEMBLY AND HEAT DISSIPATION DEVICE INCORPORATING THE SAME

Display

Carrier for an optoelectronic structure comprising a structured electronically conductive layer at the top side of main body, and optoelectronic semiconductor chip comprising such a carrier

Light emitting package having a guiding member guiding an optical member

Electrical component resin, semiconductor device, and substrate

LED lighting assemblies with thermal overmolding

Epoxy resin compound and radiant heat circuit board using the same

Printed circuit board

Light-emitting device

Electronic device console with natural draft cooling

Storage device

Ceramic printed circuit board comprising an al cooling body

Circuit board and heat dissipation device thereof

Interposer and semiconductor module using the same

Thermally actuated printed circuit board retainers

Self aligning soldering

Photovoltaic module assembly

Constructions comprising thermally conductive stacks containing rutile-type titanium oxide

Control module and method for producing same

SEMICONDUCTOR PACKAGE AND WIRING BOARD UNIT

Thermal energy storage with a phase-change material in a non-metal container

Control device, and motor unit including control device

Expansion Circuit Board Cooling

Electrical apparatus and method for producing electrical apparatus

Electronic device with heat sink structure

Power supply device and a synchronous rectifier PCB

LED array module and manufacturing method thereof

PLASTICIZED CERAMIC THERMAL DISSIPATION MODULE

Power electronic system and method of assembly

Semiconductor package, cooling mechanism and method for manufacturing semiconductor package

Printed circuit board

Control unit for electric motor and vehicle steering system including the same

Flexible LED device with wire bond free die

GROUNDING MECHANISM FOR HEAT SINK ASSEMBLY

Light-emitting diode

Reinforced metal core board and electric connection box having the same

Electrical junction box with electrical components mounted to conductive metal plates across a gap

Mounting system for transmitter receiver modules of an active electronically scanned array

Printed circuit boards including strip-line circuitry and methods of manufacturing same