Method of fabricating a base layer circuit structure

LED LIGHT SOURCE UNIT

Electronic component built-in wiring board and method for radiating heat generated at the same

Printed Circuit Board Assembly Having Multiple Land Grid Arrays for Providing Power Distribution

Electronic chip module

Method of manufacturing composite wiring board

Mobile terminal device and method for radiating heat therefrom

PRINTED CIRCUIT BOARD ARRANGEMENT

Metal core circuit element mounting board

Solder interface between integrated connector terminals and printed circuit board

Method of making a semiconductor chip assembly with a post/base heat spreader and vertical signal routing

Semiconductor chip assembly with post/base heat spreader and vertical signal routing

Electrical component

Method of manufacturing a printed circuit board

Method and apparatus of changing PCB pad structure to increase solder volume and strength

Electronic circuit board including surface mount device

System and method for dissipating heat from a semiconductor module

PROCESS OF PACKAGE SUBSTRATE

LIGHT EMITTING DIODE SYSTEM

Printed circuit board

Lighting apparatus and light-emitting element mounting substrate having stress absorbing means

Thermal management of electronic devices

COMPONENT-EMBEDDED PRINTED CIRCUIT BOARD, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC APPARATUS INCLUDING THE SAME

Light emitting device

Method of manufacturing a printed circuit board

COMPONENT-EMBEDDED PRINTED CIRCUIT BOARD, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC APPARATUS INCLUDING THE SAME

LED LIGHT SOURCE UNIT

Load driving semiconductor apparatus

Method of producing circuit board

Method of producing a circuit board

Circuit board with high thermal conductivity and method for manufacturing the same

MULTI-LAYER CIRCUIT SUBSTRATE AND MOTOR DRIVE CIRCUIT SUBSTRATE

Electronic device including circuit board with radiating member, hydraulic unit including the electronic device, and method of fixing the radiating member to the circuit board

Power Converter Having Multiple Layer Heat Sinks

ELECTRONIC DEVICES WITH ENHANCED HEAT SPREADING

Laminate and Process for Producing the Same

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

Integrated circuit nanotube-based subsrate

Cooling Plate Assembly with Fixed and Articulated Interfaces, and Method for Producing Same

Heat dissipation structure of a print circuit board

Planar illumination device

Planar Illumination Device and Manufacturing Method of Same

High frequency module provided with power amplifier

Coreless substrate

Electronic apparatus

Electronic apparatus and method of manufacturing the same, and wiring substrate and method of manufacturing the same

Multilayer board and light-emitting module having the same

PACKAGING STRUCTURE OF POWER MODULE

Light System and Method to Thermally Manage an LED Lighting System

Method for manufacturing circuit device

Circuitized substrate with internal cooling structure and electrical assembly utilizing same

Circuit board assembly and backlight module comprising the same

Illumination device with light emitting diodes

CO-FIRED CERAMIC MODULE

Method for providing an efficient thermal transfer through a printed circuit board

Three dimensional packaging optimized for high frequency circuitry

Flexible optoelectric interconnect and method for manufacturing same

Arrangement for heat dissipation

Light emitting unit and liquid crystal display device using the same

Planar heat pipe for cooling

Printed circuit board

Printed board

Ovenized oscillator

Cooling structure for street lamp using light emitting diode

Circuit board for light emitting device package and light emitting unit using the same

PRINTED CIRCUIT BOARD STRUCTURE FOR HEAT DISSIPATION

Optical communication module

Circuit board and radiating heat system for circuit board

LED Light Source with Increased Thermal Conductivity

Flexible printed circuit boards including carbon nanotube bundles

THERMOELECTRIC CONVERSION MODULE AND METHOD FOR MANUFACTURING THE SAME

Device and method for determining the temperature of a heat sink

Heat-releasing printed circuit board and manufacturing method thereof

Method for manufacturing a circuit board structure, and a circuit board structure

Heat-conductive package structure

Semiconductor device and method for fabricating the same

ELECTRONIC APPARATUS

Heat-dissipating device for an LED

Multi-layer electrically isolated thermal conduction structure for a circuit board assembly

Integrated structures and fabrication methods thereof implementing a cell phone or other electronic system

Integrated thermal structures and fabrication methods thereof facilitating implementing a cell phone or other electronic system

PACKAGING SUBSTRATE WITH EMBEDDED CHIP AND BURIED HEATSINK

Mold compound circuit structure for enhanced electrical and thermal performance

Integrated structures and methods of fabrication thereof with fan-out metallization on a chips-first chip layer

Packaged electronic modules and fabrication methods thereof implementing a cell phone or other electronic system

Integrated conductive structures and fabrication methods thereof facilitating implementing a cell phone or other electronic system

CIRCUIT BOARD ASSEMBLY AND METHOD OF MANUFACTURING THE SAME

Light emitting device module

Illumination unit

CHIP EMBEDDED PRINTED CIRCUIT BOARD AND FABRICATING METHOD THEREOF

Print board and manufacturing method thereof

Semiconductor package substrate

Heat management system for a power switching device

TRANSMITTING DEVICE AND ELECTRONIC APPARATUS USING THE SAME

Thermal management of LEDs on a printed circuit board and associated methods

Electrical circuit assembly for high-power electronics

LED lamp assembly with temperature control and method of making the same

Printed circuit (PC) board module with improved heat radiation efficiency

Electrical component

Diode substrate of LCD

Thermal bonding structure and manufacture process of flexible printed circuit board

SURFACE MOUNT CIRCUIT BOARD, METHOD FOR MANUFACTURING SURFACE MOUNT CIRCUIT BOARD, AND METHOD FOR MOUNTING SURFACE MOUNT ELECTRONIC DEVICES

Electronics module and method for manufacturing the same

SEMICONDUCTOR DEVICE AND PACKAGING STRUCTURE THEREFOR

LED package, method of fabricating the same, and backlight unit having the same

Method for producing a printed circuit board with a heat radiating structure and a printed circuit board with a heat radiating structure

Ground vias for enhanced preamp heat release in hard disk drives

Light emitting diode module and display device having the same

CERAMIC LED PACKAGE

Circuit board unit and method for production thereof

Thermal management of dies on a secondary side of a package

PRINTED CIRCUIT BOARD CONNECTION

Light-emitting diode assembly

Thermal Management system and method for semiconductor lighting systems

Electronic Apparatus

Printed circuit board and method for manufacturing thereof

Illuminating device, electro-optic device, and electronic apparatus

Power module having a cooling device and semiconductor devices mounted on a resin substrate, method of producing same, and air conditioner

Multi-configuration processor-memory substrate device

Combined heat sink multi-configuration processor memory substrate device

LED module

Solid high aspect ratio via hole used for burn-in boards, wafer sort probe cards, and package test load boards with electronic circuitry

Integrated heat spreaders for light emitting devices (LEDs) and related assemblies

Printed circuit board and electronic component device

Electrical circuit assembly for high-power electronics

ELECTRONIC DEVICES WITH ENHANCED HEAT SPREADING

Semiconductor-embedded substrate and manufacturing method thereof

Apparatus for supplying power to a semiconductor device using a capacitor DC shunt

Printed board and manufacturing method thereof

Recording apparatus having radiator joined to common voltage wire

Carrier board and method for manufacturing the same

Mobile terminal device and method for radiating heat therefrom

Flexible circuits having improved reliability and thermal dissipation

Method of manufacturing a circuit board

Process of forming a laminate ceramic circuit board

Wiring Board for Light-Emitting Element

Optical display module with heat sink structure

Power-ground plane partitioning and via connection to utilize channel/trenches for power delivery

Method of power-ground plane partitioning to utilize channel/trenches

Via heat sink material

Substrate module with high thermal conductivity and its fabrication method of same

Printed circuit board and manufacturing method thereof

Thermally conductive composite and uses for microelectronic packaging

Printed wiring board and method of manufacturing the same

Printed circuit board and method of manufacturing the same

Light source device and method of making the device

Multilayer printed circuit board and a liquid crystal display unit

Thermally enhanced memory module

Methods and apparatus for thermal management in a multi-layer embedded chip structure

Method and apparatus for a low thermal impedance printed circuit board assembly

Wiffle tree components, cooling systems, and methods of attaching a printed circuit board to a heat sink

SYSTEM AND METHOD FOR PROCESSOR POWER DELIVERY AND THERMAL MANAGEMENT

Heat dissipating type printed circuit board and structure thereof for conducting heat with heap pipe

Circuit Apparatus

Heat dissipation system for a miniaturized form factor communications card

Embedded integrated circuit package system

Backlight for liquid crystal display using light emitting diode

Heat dissipation structure of backlight module

Heat conduction from an embedded component

Backlight unit equipped with light emitting diodes

Electric power steering apparatus

Spread illuminating apparatus

Wiring configuration for semiconductor component

Power converter having multiple layer heat sinks

Support structure of electronic device and hard disk drive comprising the same

Circuit device

CIRCUIT BOARD, CIRCUIT APPARATUS, AND METHOD OF MANUFACTURING THE CIRCUIT BOARD

Millimeter-wave radar apparatus and millimeter radar system using the same

Method of attaching a high power surface mount transistor to a printed circuit board

Attachment of a QFN to a PCB

Slim type backlight unit

Systems for displaying images

Thermal conductive electronics substrate and assembly

ELECTRICAL CIRCUIT APPARATUS

Composite wiring board and manufacturing method thereof

Method for evaluating and modifying solder attach design for integrated circuit packaging assembly

Electronic apparatus and circuit board unit

Coreless substrate and manufacturing method thereof

System and method for mounting a light emitting diode to a printed circuit board

LED light source module with high efficiency heat dissipation

Electronic apparatus

Complete power management system implemented in a single surface mount package

Complete power management system implemented in a single surface mount package

Printed circuit board for thermal dissipation and electronic device using the same

Wiring substrate and semiconductor package implementing the same

CIRCUIT BOARD STRUCTURE AND METHOD FOR FABRICATING THE SAME

Electrical circuit apparatus and method for assembling same

System and method for processor power delivery and thermal management

Light emitting diode package in backlight unit for liquid crystal display device

Driver IC package with improved heat dissipation

SIP type package containing analog semiconductor chip and digital semiconductor chip stacked in order, and method for manufacturing the same

THERMALLY DISSIPATING AND POWER DISPERSING ADHESIVELY BONDED METAL-PRINTED CIRCUIT BOARD STRUCTURE

Three dimensional packaging optimized for high frequency circuitry

Multilayer printed wiring board

Electronic device

Printed circuit board structure

Discharge lamp lighting apparatus

High density integrated circuit having multiple chips and employing a ball grid array (BGA) and method for making same

Circuit device

Circuit device

Method and apparatus for configurable printed circuit board circuit layout pattern

LED light module assembly

Light-emitting diode thermal management system

Semiconductor module

Conductive heat transfer for electrical devices from the solder side and component side of a circuit card assembly

Thermal bonding structure and manufacture process of flexible printed circuit board

Conductive polymer device and method of manufacturing same

Discrete electronic component arrangement including anchoring, thermally conductive pad

Wired circuit board

Mobile terminal device and method for radiating heat therefrom

Cooling arrangement for an optical pick-up

Optical deflector and optical scanner having the optical deflector

Substrate core

connection arrangement for micro lead frame plastic packages

Thermal management of surface-mount circuit devices on laminate ceramic substrate

Edge plated printed wiring boards

Electronic assembly with a heat sink in particular for a discharge lamp control module for motor vehicle headlights

Thermal management system and method for electronic equipment mounted on coldplates

High frequency module

Light emitting module, optical head, and optical disc recording and reproducing apparatus

LED lamp

Surface mount heat sink

Heat dissipation device

Combined circuit unit and an inkjet printer

Image-generation device, in particular for installation in the roof area or exterior rearview mirror of a motor vehicle

Integrated cooling system for electronic devices

Microwave-monolithic-integrated-circuit-mounted substrate, transmitter device for transmission only and transceiver device for transmission/reception in microwave-band communication

Electronic circuit device

Illumination apparatus and method

Multi-layer integrated RF/IF circuit board including a central non-conductive layer

Method for evaluating and modifying solder attach design for integrated circuit packaging assembly

High frequency semiconductor apparatus, transmitting apparatus and receiving apparatus

Multi-layered circuit board assembly with improved thermal dissipation

System and method for dissipating heat from a semiconductor module

Cooling-assisted, heat-generating electrical component and method of manufacturing same

System and method for processor power delivery and thermal management

Flexi-rigid printed circuit board with integral flexible heat sink area

Circuit device

Method for manufacturing circuit device

Circuit device and manufacturing method thereof

Circuit device and manufacturing method thereof

Circuit device with dummy elements

Circuit device and manufacturing method thereof

Structure for fixing an electronic device to a substrate

Thermal management system and method for electronic equipment mounted on coldplates

Laminate ceramic circuit board and process therefor

Embedded heat spreader for folded stacked chip-scale package

Electronic circuit module

Electronic part mounting substrate, electronic part, and semiconductor device

Control unit with thermal protection and an electrical heating device comprising the control unit

Cooling arrangement for a printed circuit board with a heat-dissipating electronic element

Radio frequency module

High frequency module

Metal core multilayer printed wiring board

Electrical circuit apparatus and methods for assembling same

Electronics circuit manufacture

Circuit board with localized stiffener for enhanced circuit component reliability

Via heat sink material

Method for diffusion bond welding for use in a multilayer electronic assembly

Metal foam heat sink

Joining material stencil and method of use

Stacked small memory card

Group III nitride based flip-chip integrated circuit and method for fabricating

Electrical assemblage and method for removing heat locally generated therefrom

Device for sending or receiving optical signals

Cooling structure for electronic element

Fabrication of thick film electrical components

Lightweight circuit board with conductive constraining cores

Lightweight circuit board with conductive constraining cores

Group III nitride based flip-chip integrated circuit and method for fabricating

Thermal riser system

Multilayer PCB structure with inner thermally conductive material, optical communication module having the same and method of fabricating the same

Circuit board and method for manufacturing the same

Heat dissipation approach in chip on board assembly by using stacked copper Microvias

Electronic module with cooling system for package-on-package devices

Heat dissipation approach in chip on board assembly by using stacked copper microvias

Embedded coins for HDI or SEQ laminations

Apparatus for mounting microelectronic chips

Thermal solution for drive systems such as hard disk drives and digital versatile discs