Circuit board and method of manufacturing the same

METAL SUBSTRATE WITH INSULATED VIAS

Flexible LED substrate device

Method of manufacturing a printed circuit and the corresponding printed circuit

Flexible light emitting semiconductor device with large area conduit

Test board unit and apparatus for testing a semiconductor chip including the same

ELECTRONIC DEVICE AND ELECTRONIC PACKAGE THEREOF

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

Circuit substrate and method for manufacturing the same

Printed circuit board with thermal via

Light source unit

Compound carrier board structure of flip-chip chip-scale package and manufacturing method thereof

Device and method for determining the temperature of a heat sink

Circuit board and manufacturing method thereof

Printed circuit board

Circuit board

Substrate for mounting electronic component and method for manufacturing the same

COOLING DEVICE FOR A PRINTED CIRCUIT BOARD

Printed circuit board, electronic module and method of manufacturing the same

Circuit substrate for carrying at least one light-emitting diode and light-emitting structure for providing illumination

Box-type vehicle-mounted control device

PRINTED CIRCUIT BOARD AND DISPLAY DEVICE

Flex-rigid wiring board

CIRCUIT BOARD

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

Circuit board comprising heat transfer structure

Light emitting diode (LED) assembly and flexible circuit board with improved thermal conductivity

Circuit board including heat dissipation structure

TRANSISTOR THERMAL AND EMI MANAGEMENT SOLUTION FOR FAST EDGE RATE ENVIRONMENT

Detection of ions in an ion trap

SEMICONDUCTOR DEVICE

Heat dissipating substrate

Electronic device and semiconductor package with thermally conductive via

Circuit board and electronic apparatus

Architecture of drive unit employing gallium nitride switches

Low profile drive unit for elevator system

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

Circuit substrate and method for manufacturing the same

Electronic, optoelectronic, or electric arrangement

A PRINTED CIRCUIT BOARD (PCB) STRUCTURE

HEAT CHANNELING AND DISPERSING STRUCTURE AND MANUFACTURING METHOD THEREOF

HEAT DISSIPATION CIRCUIT BOARD AND METHOD FOR PRODUCING SAME

Substrate and metal layer manufacturing method

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

COMPONENT BUILT-IN BOARD AND METHOD OF MANUFACTURING THE SAME, AND MOUNTING BODY

Electrical vacuum-compatible feedthrough structure and detector assembly using such feedthrough structure

Package on package structure

Thermal management for solid-state drive

Device embedded substrate and manufacturing method of device embedded substrate

CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

Wiring board, method for manufacturing wiring board, and electronic device

Electronic device

Wiring substrate

Carrier package and carrier with plural heat conductors

Ceramic substrate and semiconductor package having the same

LED module

Printed circuit board and manufacturing method therefor

Heat Sink With Protrusions On Multiple Sides Thereof And Apparatus Using The Same

Ultra-thin embedded semiconductor device package and method of manufacturing thereof

Printed circuit board and method of fabricating the same

Electric component assembly

Substrate device and electric circuit arrangement having first substrate section perpendicular to second substrate section

Wiring substrate and semiconductor package

High frequency module

Wiring substrate, manufacturing method therefor, and semiconductor package

Construction element with at least one electronic component and associated method

Substrate, imaging unit and imaging device

Heat dissipation printed circuit board and manufacturing method thereof

Circuit board with thermal control

Method for producing a mechanically autonomous microelectronic device

Solder void reduction for component attachment to printed circuit boards

Semiconductor device

Solid-state image sensing apparatus and electronic apparatus to improve quality of an image

THERMAL MANAGEMENT CIRCUIT MATERIALS, METHOD OF MANUFACTURE THEREOF, AND ARTICLES FORMED THEREFROM

Millimeter-wave system including a waveguide transition connected to a transmission line and surrounded by a plurality of vias

Nano-copper solder for filling thermal vias

Light-emitting element mounting package having protruded wiring and recessed wiring, and light-emitting element package

Motor control device

Solder void reduction between electronic packages and printed circuit boards

Heat-conductive connection arrangement

Power supply and method

Overmolded substrate-chip arrangement with heat sink

WIRING BOARD STRUCTURE

PRINTED CIRCUIT BOARD SET HAVING HIGH-EFFICIENCY HEAT DISSIPATION

Wearable portable electronic device with heat conducting path

Transmit/receive daughter card with integral circulator

Compound carrier board structure of flip-chip chip-scale package and manufacturing method thereof

Interposer, method for manufacturing interposer, and semiconductor device

ELECTRONIC MODULE, LIGHTING DEVICE AND MANUFACTURING METHOD OF THE ELECTRONIC MODULE

Group III nitride based flip-chip integrated circuit and method for fabricating

Electronic devices comprising printed circuit boards

Apparatus and method for embedding components in small-form-factor, system-on-packages

PRINTED CIRCUIT BOARD

Thermoelectric cooler/heater integrated in printed circuit board

Optical module

Circuit board and electronic device including same

Method and apparatus for providing a ground and a heat transfer interface on a printed circuit board

Component built-in board and method of manufacturing the same, and component built-in board mounting body

Printed wiring board

Package on package structure

Printed circuit board structure with heat dissipation function

Isolation of thermal ground for multiple heat-generating devices on a substrate

Circuit board system comprising a cooling arrangement

Solid-state image sensing apparatus and electronic apparatus to improve image quality of an image

Component built-in board mounting body and method of manufacturing the same, and component built-in board

Component built-in board and method of manufacturing the same

Printed circuit board and control device for a vehicle transmission comprising the printed circuit board

Printed wiring board, printed circuit board, and method for manufacturing printed circuit board

PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

Passive cooling system integrated into a printed circuit board for cooling electronic components

Light emitting module and surface lighting device having the same

Package carrier

Light emitting module having heat conductive substrate

Light emitting module having heat conductive substrate

Light emitting module having heat conductive substrate

High frequency circuit module with a filter in a core layer of a circuit substrate

High frequency circuit module with a filter disposed in a core layer of a circuit substrate

Thermal performance of logic chip in a package-on-package structure

CIRCUIT MODULE

Interposer and package on package structure

Core substrate, manufacturing method thereof, and structure for metal via

Circuit board structure having measures against heat

Thermo/electrical conductor arrangement for multilayer printed circuit boards

Multilayered LED printed circuit board

LIGHT EMITTING SYSTEM

High-frequency circuit module

Flexible LED device for thermal management

Electric element-embedded multilayer substrate and method for manufacturing the same

Thermal management circuit board for stacked semiconductor chip device

Method for producing large lighting with power LED

Electrical assembly with compliant pins for heat dissipation

Light-emitting element mounting package having heat radiation route, manufacturing method of the same, and light-emitting element package

Wiring substrate and method for manufacturing wiring substrate

Package on package structure

Dual side package on package

Printed wiring board and method of manufacturing printed wiring board

Electronic assembly

ELECTRONIC DEVICE WITH HEAT SINK MECHANSIM

Multilayer printed circuit board

Cooling structure for light emitting elements for liquid crystal panel

Infrared light device

Multilayer printed circuit board and device comprising the same

Electrical connector and method of making it

CIRCUIT BOARD STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

Glass ceramic composition, substrate for light emitting element, and light emitting device

Wave soldering of surface-mounting electronic devices on printed circuit board

PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

ELECTRONIC DEVICE AND HEAT SINK EMPLOYING THE SAME

Flexible circuit board

Light-emitting device

HEATING ELEMENT MOUNTING SUBSTRATE, METHOD OF MANUFACTURING THE SAME AND SEMICONDUCTOR PACKAGE

HEATING ELEMENT MOUNTING SUBSTRATE, METHOD OF MANUFACTURING THE SAME AND SEMICONDUCTOR PACKAGE

Light emitting module having heat conductive substrate

Film system for LED applications

ELECTRONIC COMPONENT EMBEDDED PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

THERMAL SUBSTRATE

Solid-state image sensing apparatus and electronic apparatus

Electronic control unit and method of manufacturing the same

Footprint on PCB for leadframe-based packages

CIRCUIT BOARD AND RADIATING HEAT SYSTEM FOR CIRCUIT BOARD

Lighting apparatus with heat conductive substrate

Group III nitride based flip-chip integrated circuit and method for fabricating

PACKAGE CARRIER AND PACKAGE STRUCTURE

Systems for circuit board heat transfer and method of assembling same

Light emitting diode carrier

CIRCUIT BOARD AND RADIATING HEAT SYSTEM FOR CIRCUIT BOARD

METHOD OF PRODUCING CIRCUIT BOARD BY ADDITIVE METHOD, AND CIRCUIT BOARD AND MULTILAYER CIRCUIT BOARD OBTAINED BY THE METHOD

Ground vias for enhanced preamp heat release in hard disk drives

LED LIGHT SOURCE ASSEMBLY, BACK LIGHT MODULE AND LIQUID CRYSTAL DISPLAY DEVICE

Circuit board having a plurality of circuit board layers arranged one over the other having bare die mounting for use as a gearbox controller

Method of producing multilayer circuit board

Thermal interface members for removable electronic devices

MICROELECTRONIC INTERCONNECT SUBSTRATE AND PACKAGING TECHNIQUES

Solid State Bidirectional Light Sheet for General Illumination

Solid State Bidirectional Light Sheet for General Illumination

Electronic power module, and method for manufacturing said module

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

Wiring Substrate and Electronic Device

Control module for a transmission control installed in an automatic transmission

Method for manufacturing printed wiring board

CHIP MODULE AND METHOD FOR PROVIDING A CHIP MODULE

Electronic control device including interrupt wire

CIRCUIT BOARD

STRUCTURE IMPROVEMENT OF LED LAMP

METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARD

Hole in pad thermal management

Molded Interconnect Device (MID) with Thermal Conductive Property and Method for Production Thereof

SEMICONDUCTOR PACKAGE WITH THERMAL VIA AND METHOD OF FABRICATION

Method for forming a flexible electrical substrate

Assessing connection joint coverage between a device and a printed circuit board

Wiring substrate, electronic device, and method of manufacturing wiring substrate

LIGHTWEIGHT CIRCUIT BOARD WITH CONDUCTIVE CONSTRAINING CORES

OPTICAL MODULE

RADIO FREQUENCY POWER AMPLIFIER

Thermal interface material application for integrated circuit cooling

Cooling device, electronic substrate and electronic device

Light-emitting diode integration scheme

Thermal pad and method of forming the same

Thermoelectric conversion module and method for manufacturing the same

Control device

ELECTRONIC CONTROL DEVICE

LED module and LED lighting device

METHOD FOR MANUFACTURING SUBSTRATE FOR LIGHT EMITTING ELEMENT PACKAGE, AND LIGHT EMITTING ELEMENT PACKAGE

Flexirigid support plate

Cooling module assembly method

Television apparatus, electronic device, and circuit board structure

MULTILAYER CIRCUIT SUBSTRATE

METHOD FOR MANUFACTURING SUBSTRATE FOR LIGHT EMITTING ELEMENT PACKAGE, AND LIGHT EMITTING ELEMENT PACKAGE

Heat sink

Heat Dissipating Assembly

Temperature sensing system and method

Circuit board with built-in semiconductor chip and method of manufacturing the same

METHOD OF FABRICATING NON-METAL LED SUBSTRATE AND NON-METAL LED SUBSTRATE AND METHOD OF FABRICATING LED DEVICE USING THE NON-METAL LED SUBSTRATE AND LED DEVICE WITH THE NON-METAL LED SUBSTRATE

Printed circuit board with fins

Light emitting device module

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

MANUFACTURING METHOD OF SEMICONDUCTOR CHIP-EMBEDDED WIRING SUBSTRATE

System for maintaining an even temperature distribution across a laser detector

Wiring substrate and method for manufacturing the same

Thermal management system for electrical components and method of producing same

Thermal management of electronic devices

CIRCUIT MODULE

Integrated Circuit Module and Multichip Circuit Module Comprising an Integrated Circuit Module of This Type

Wiring board for light-emitting element

Light emission module with high-efficiency light emission and high-efficiency heat dissipation and applications thereof

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Light emission module with high-efficiency light emission and high-efficiency heat dissipation and applications thereof

Apparatus and method for embedding components in small-form-factor, system-on-packages

Secondary battery and circuit board assembly suitable for secondary battery

Slim type backlight unit with through-hole adhesive heat dissipating means

Thermal interface members for removable electronic devices

PRINTED CIRCUIT BOARD WITH INSULATING AREAS

METHOD FOR MANUFACTURING AN ELECTRONIC ASSEMBLY

Embedded integrated circuit package system and method of manufacture thereof

Method for integrating an electronic component into a printed circuit board

Distributed LED-based light source

Liquid crystal display device

PCB and camera module having the same

Group III nitride based flip-chip integrated circuit and method for fabricating

Circuit board and method of manufacturing the same

Solid state bidirectional light sheet for general illumination

QFN SEMICONDUCTOR PACKAGE AND CIRCUIT BOARD STRUCTURE ADAPTED FOR THE SAME

HEAT DISSIPATING MODULE OF LIGHT EMITTING DIODE

Image reading apparatus and multilayer substrate

Light emitting diode package

METHOD FOR THE PRODUCING AN ELECTRONIC SUBASSEMBLY, AS WELL AS ELECTRONIC SUBASSEMBLY

LED light source, its manufacturing method, and LED-based photolithography apparatus and method

Flexible circuit for fluid-jet precision-dispensing device cartridge assembly

System And Method For Processor Power Delivery And Thermal Management

Lightweight circuit board with conductive constraining cores

System and method for dissipating heat from semiconductor devices

PRINTED CIRCUIT BOARD

Method for manufacturing printed circuit board

Flexible electrical substrate

Heat sinking and flexible circuit board, for solid state light fixture utilizing an optical cavity

Heat sinking and flexible circuit board, for solid state light fixture utilizing an optical cavity

Methods for fabricating circuit boards

Circuit board structure having measures against heat

ELECTRONIC CONTROL UNIT AND METHOD OF MANUFACTURING THE SAME

Use of an electronic module for an integrated mechatronic transmission control of simplified design

Component-containing module

Complete power management system implemented in a single surface mount package

Electronics module comprising an embedded microcircuit

Integrated circuit micro-module

PACKAGE SUBSTRATE STRUCUTRE WITH CAVITY AND METHOD FOR MAKING THE SAME

Electric control unit having a housing part and a cooling part

Multi-layer circuit board, method of manufacturing the same, and communication device

Systems and methods for printed board assembly isolated heat exchange

Light emitting device

PACKAGE FOR ELECTRON ELEMENT AND ELECTRONIC COMPONENT

Method and apparatus for printed circuit board with stiffener

Method for producing an electronic subassembly

Method for the production of alpha-calcium sulfate hemihydrate from calcium sulfate dihydrate

LIGHT EMITTING DIODE LAMP

LAMP UNIT, CIRCUIT BOARD, AND METHOD OF MANUFATURING CIRCUIT BOARD

BURIED CAPACITOR, METHOD OF MANUFACTURING THE SAME, AND METHOD OF CHANGING CAPACITANCE THEREOF

High-frequency circuit board, high-frequency circuit module, and radar apparatus

CHIP HAVING THERMAL VIAS AND SPREADERS OF CVD DIAMOND

INTEGRATED CIRCUIT PACKAGE

Backlight unit equipped with light emitting diodes

LIGHT EMITTING DIODE AND LIGHT SOURCE MODULE HAVING SAME

Semiconductor device and manufacturing method thereof

ELECTRONIC CONTROL DEVICE

MULTI-CONFIGURATION PROCESSOR-MEMORY SUBSTRATE DEVICE

MULTI-CONFIGURATION PROCESSOR-MEMORY SUBSTRATE DEVICE

LIGHT EMITTING DEVICE, DISPLAY DEVICE AND SOLID-STATE LIGHT EMITTING ELEMENT SUBSTRATE

LATERAL GRAPHENE HEAT SPREADERS FOR ELECTRONIC AND OPTOELECTRONIC DEVICES AND CIRCUITS

LIGHT EMITTING DEVICE AND DISPLAY DEVICE

LIGHT EMITTING SYSTEM

Power semiconductor module including a multilayer substrate

Constant-temperature type crystal oscillator

Light-emitting diode integration scheme

Integrated conductive structures and fabrication methods thereof facilitating implementing a cell phone or other electronic system

Integrated thermal structures and fabrication methods thereof facilitating implementing a cell phone or other electronic system

Thermal management of electronic devices

Power-ground plane partitioning and via connection to utilize channel/trenches for power delivery

Method of fabricating a circuit structure

HEAT DISSIPATION MODULE FOR LIGHT EMITTING DIODE

LED module

Method of bonding two structures together with an adhesive line of controlled thickness