233632 ⎘
Printed circuits; Details; Thermal arrangements, e.g. for cooling, heating or preventing overheating; Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
COMPOSITE CIRCUIT BOARD STRUCTURE
#2Thermal Interface Under Component
#3VEHICLE CIRCUIT BOARD
#4PRINTED CIRCUIT BOARD HEAT EXCHANGER AND ASSOCIATED METHOD
#5HYBRID PCB WITH PLANAR ANTENNA
#6OPTICAL MODULE
#7CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME
#8HEAT DISSIPATION APPARATUS AND ELECTRONIC DEVICE
#9DATA THROUGHPUT USING A FIN STACK
#10ELECTRONIC INPUT/OUTPUT APPARATUS WITH IMPROVED DISSIPATION
#11PRINTED CIRCUIT BOARD AND ELECTRONIC CONTROL DEVICE
#12CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME
#13DATA PROCESSING SYSTEMS INCLUDING OPTICAL COMMUNICATION MODULES
#14PCB STRUCTURE WITH HEAT DISSIPATION FUNCTION
#15POWER BOARD
#16CERAMIC SUBSTRATE AND METHOD FOR MANUFACTURING CERAMIC SUBSTRATE
#17Thermal Management in Circuit Board Assemblies
#18MULTILAYER SUBSTRATE, METHOD FOR MANUFACTURING MULTILAYER SUBSTRATE, AND ELECTRONIC DEVICE
#19CIRCUIT BOARD AND DISPLAY DEVICE HAVING SAME
#20CIRCUIT BOARD, AND ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME
#21METHODS AND SYSTEMS OF COMPRESSOR CONTROL WITH SURGE AVOIDANCE AND RESPONSE
#22Component Carrier With Embedded Electronic Switch Components and a Capacitor Device
#23PRINTED CIRCUIT BOARD AND AN INDUCTION COOKTOP INCLUDING THE PRINTED CIRCUIT BOARD
#24Embeddable Electrically Insulating Thermal Connector and Circuit Board Including the Same
#25CIRCUIT ASSEMBLY INCLUDING GALLIUM NITRIDE DEVICES
#26CIRCUIT BOARD AND IMAGE FORMING APPARATUS
#27LOW SWITCHING LOSS INVERTER CIRCUIT BOARD
#28MULTILAYER BOARD, MULTILAYER BOARD MODULE, AND ELECTRONIC DEVICE
#29CIRCUIT BOARD AND IMAGE FORMING APPARATUS
#30RF FRONT-END FUNCTIONALITY INTEGRATED IN A COMPONENT CARRIER STACK
#31MANUFACTURING METHOD OF PACKAGE CARRIER
#32CARRIER SUBSTRATE, A METHOD, AND AN ELECTRONIC ASSEMBLY
#33Cooling Methodology for Package-on-Package Structures
#34PRINTED CIRCUIT BOARD
#35Method of Producing a PCB, as well as a PCB, and a Circuit Board
#36INKJET PRINTING DEDICATED TEST PINS
#37Data processing systems including optical communication modules
#38CERAMIC METAL COMPOSITE SUBSTRATE
#39PRINTED CIRCUIT BOARD AND METHOD OF PRODUCING THEREOF
#40ELECTRONIC CIGARETTE
#41ELECTRONIC SYSTEM
#42ELECTRONIC DEVICE WITH BELOW PCB THERMAL MANAGEMENT
#43EFFICIENT THERMAL MANAGEMENT FOR VERTICAL POWER DELIVERY
#44Power electronics assemblies having power electronics devices embedded within a flip chip
#45ELECTRONIC SWITCH MODULE WITH OPPOSITELY-ARRANGED POWER SWITCHES AND DISCRETE HEAT SINKS
#46TERMINAL INTERPOSERS WITH MOLD FLOW CHANNELS, CIRCUIT MODULES INCLUDING SUCH TERMINAL INTERPOSERS, AND ASSOCIATED METHODS
#47SEMICONDUCTOR STORAGE DEVICE INCLUDING PCB EDGE HEAT DISSIPATION
#48CIRCUIT BOARD FOR A POWER SEMICONDUCTOR MODULE, POWER SEMICONDUCTOR MODULE, AND METHOD FOR PRODUCING A CIRCUIT BOARD AND A POWER SEMICONDUCTOR MODULE
#49Light-emitting module with compact converter circuit
#50SWITCHING POWER SUPPLY DEVICE
#51Thermal Management in Circuit Board Assemblies
#52COMMUNICATION CHIP PACKAGE WITH ANTENNA AND HEAT DISSIPATION GROUND
#53IMPROVED DATA THROUGHPUT USING A FIN STACK
#54WIRING MODULE AND IMAGING APPARATUS
#55Thermal Conduction - Electrical Conduction Isolated Circuit Board with Ceramic Substrate and Power Transistor Embedded
#56SWITCHING POWER CONVERTER MODULE WITH A HEAT DISSIPATION STRUCTURE
#57Power semiconductor component and method for producing a power semiconductor component
#58SURGE SUPPRESSION DEVICE
#59Circuit board assembly and manufacturing method thereof
#60HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE
#61THROUGH BOARD VIA HEAT SINK
#62Power electronic device assemblies having an electrically insulating layer
#63HEAT DISSIPATION APPARATUS AND ELECTRONIC DEVICE
#64SUBSTRATE FOR AN ELECTRONIC CHIP
#65HEAT DISSIPATION STRUCTURE OF PRINTED CIRCUIT BOARD, MANUFACTURING METHODS THEREOF, AND HEAT DISSIPATION SYSTEM FOR ELECTRONIC DEVICE
#66Motor vehicle lighting module comprising a ceramic substrate
#67METHOD AND APPARATUS FOR MOUNTING AND COOLING A CIRCUIT COMPONENT
#68PRINTED CIRCUIT BOARD AND CIRCUIT ARRANGEMENT
#69POWER CONTROLLER
#70Printed-circuit isolation barrier for co-site interference mitigation
#71POWER AMPLIFIER MODULES AND SYSTEMS CONTAINING ELECTROMAGNETIC BANDGAP ISOLATION ARRAYS
#72Printed circuit boards with plated blind slots for improved vertical electrical and/or thermal connections
#73Heat dissipating structures
#74Image sensor package and camera device including same
#75Substrate for mounting electronic element, electronic device, and electronic module preliminary class
#76Stacked image sensor
#77Circuit board with heat dissipation function
#78Printed circuit board (PCB) including heatsinks
#79Circuit board and method for manufacturing the same
#80Circuit board with heat dissipation structure and method for manufacturing same
#81Multilayer circuit board and electronic-component mount multilayer board
#82Method and procedure for miniaturing a multi-layer PCB
#83Electronic control device
#84Printed circuit board
#85Component carrier having dielectric layer with conductively filled through holes tapering in opposite directions
#86Printed circuit board and electronic device including same
#87Thermal Transfer, Management and Integrated Control Structure
#88CIRCUIT BOARD MODULE
#89Circuit board with heat dissipation function and method for manufacturing the same
#90Circuit board comprising via
#91Through board via heat sink
#92Embeddable electrically insulating thermal connector and circuit board including the same
#93Method for manufacturing a circuit board
#94Heat sink with protrusions on multiple sides thereof and apparatus using the same
#95High-power die heat sink with vertical heat path
#96High-power die heat sink
#97Wiring module and imaging apparatus
#98Circuit board and method of manufacturing the same
#99Method and apparatus for mounting and cooling a circuit component
#100Semiconductor device having electric component built in circuit board
#101INKJET PRINTING DEDICATED TEST PINS
#102ELECTRONIC COMPONENT-EMBEDDED SUBSTRATE
#103Circuit board and method for producing circuit board
#104Heat removal architecture for stack-type component carrier with embedded component
#105Compact memory device having a backup power source
#106Formed waveguide antennas of a radar assembly
#107Data processing systems including optical communication modules
#108Passive thermal management for semiconductor laser based lidar transmitter
#109Driver board assemblies and methods of forming a driver board assembly
#110Methods for forming engineered thermal paths of printed circuit boards by use of removable layers
#111Package carrier with improved heat dissipation efficiency and manufacturing method thereof
#112High performance thermal solution concept for surface mount device packages
#113CHARGER
#114Heat removal from silicon photonics chip using a recessed side-by-side thermal dissipation layout
#115Dissipating heat from an electronic assembly using forced convection, and method for dissipating heat from an electronic assembly
#116Flexible circuit board and chip package having a chip mounting region
#117Electronic apparatus improved in heat dissipation efficiency of heat generating component
#118Substrate with electronic component embedded therein
#119Electric machine
#120Display device
#121High intensity narrow spectrum and far UVC protection device
#122HEAT SINK DEVICE PROVIDED WITH A SECONDARY COLD PLATE
#123Printed circuit board and camera device comprising same
#124Thermal relief for through-hole and surface mounting
#125Circuit board
#126Thermal management in circuit board assemblies
#127Carrier substrate, an electronic assembly and an apparatus for wireless communication
#128Power distribution from point-of-load with cooling
#129Semiconductor assembly
#130Electronic control unit
#131Electronic load device and heat-dissipating load module
#132Single step electrolytic method of filling through holes in printed circuit boards and other substrates
#133Component carrier with embedded component and horizontally elongated via
#134CONNECTING CIRCUIT BOARDS USING FUNCTIONAL COMPONENTS
#135Electronic device including antenna module having heat transfer member extending therefrom
#136Carrier substrate with a thick metal interlayer and a cooling structure
#137System and method for creating orthogonal solder interconnects
#138Heat sink with protrusions on multiple sides thereof and apparatus using the same
#139Circuit assembly and electrical junction box
#140Electronic packages including structured glass articles and methods for making the same
#141Printed wiring board having thermoelectric emlement accommodatred therein
#142Substrate for mounting electronic element, electronic device, and electronic module
#143Printed circuit board and method for measuring the temperature in a power electrical connector
#144Functionally graded thermal vias for inductor winding heat flow control
#145POWER CONVERSION DEVICE
#146Laminated substrate
#147LED module
#148Electronic circuit device
#149HIGH SPEED HIGH POWER LASER ASSEMBLY WITH CAVITY
#150Printed wiring board
#151Creating a secure volume
#152THERMAL MANAGEMENT SOLUTIONS FOR INTEGRATED CIRCUIT PACKAGES
#153Component carrier comprising at least one heat pipe and method for producing said component carrier
#154Removing unwanted flux from an integrated circuit package
#155Method for producing a printed circuit board having thermal through-contacts
#156Thermal management in circuit board assemblies
#157Electronic circuit substrate
#158Component carrier having a component shielding and method of manufacturing the same
#159Ultra-thin embedded semiconductor device package and method of manufacturing thereof
#160Printed circuit board and manufacturing method for the same
#161Circuit board and electronic device including circuit board
#162Electronic equipment
#163High-current PCB traces
#164Optical to electrical conversion module
#165Heat sink with protrusions on multiple sides thereof and apparatus using the same
#166Heat dissipation substrate, heat dissipation circuit structure body, and method for manufacturing the same
#167Cooling package and power module
#168Assembly and sub-assembly for thermal control of electronic devices
#169Electronic control unit
#170Electronic switch module with an integrated flyback diode
#171Multi-layer circuit board and electronic assembly having same
#172Electronic switch module with oppositely-arranged power switches and discrete heat sinks
#173Circuit board, motor, controller, and electric pump
#174PRINTED WIRING BOARD
#175Component Carrier With Only Partially Filled Thermal Through-Hole
#176Substrate, imaging unit and imaging device
#177Packaged microelectronic component mounting using sinter attachment
#178Printed circuit board and method for manufacturing printed circuit board
#179Electronic device and rigid-flexible substrate module
#180Device and method for heat dissipation
#181Metal additive structures on printed circuit boards
#182Thermal management in circuit board assemblies
#183CIRCUIT BOARD, MANUFACTURING METHOD FOR CIRCUIT BOARD AND CAMERA MODULE
#184Heat dissipation structure for magnetic component and magnetic component having the same
#185Component carrier comprising a copper filled multiple-diameter laser drilled bore
#186SYSTEMS AND METHODS FOR THERMAL DISSIPATION
#187LASER DIODE CHIP ON PRINTED CIRCUIT BOARD
#188Microelectronic components having integrated heat dissipation posts and systems including the same
#189Cooling component carrier material by carbon structure within dielectric shell
#190Circuit boards and method to manufacture circuit boards
#191Apparatus, system, and method for dissipating heat from expansion components
#192High frequency circuit
#193Electronic module
#194Multi-LED system
#195Component cooling device
#196Component carrier with transistor components arranged side by side
#197Load drive device
#198Semiconductor thermal-conductive heat sink structure
#199Metal body formed on a component carrier by additive manufacturing
#200Heat capacitive component carrier and method to produce said component carrier
#201Power circuit device
#202Heat pipe thermal component for cooling system
#203Removing unwanted flux from an integrated circuit package
#204LED package structure and multilayer circuit board
#205Printed circuit board and mobile device
#206Socket with thermal conductor
#207Printed circuit board
#208Cooling assemblies for electronic devices
#209High frequency module
#210Circuit device and power conversion device
#211Heat Sink With Protrusions On Multiple Sides Thereof And Apparatus Using The Same
#212Power module based on multi-layer circuit board
#213CIRCUIT BOARD
#214Inverter
#215Combination parallel path heatsink and EMI shield
#216Semiconductor device
#217LIGHTING DEVICE MODULES
#218PRINTED CIRCUIT BOARD
#219Multi-layer printed circuit board having a printed coil and method for the production thereof
#220Packaged microelectronic component mounting using sinter attachment
#221Multilayer substrate, electronic device, and a method for manufacturing a multilayer substrate
#222Integrated die paddle structures for bottom terminated components
#223Electronic component carrier for carrying and cooling a heat generating electronic component
#224Printed wiring board for mounting electronic component
#225Printed circuit board and electronic apparatus
#226Multi-functional high-current circuit board
#227Electronic device
#228RADIATIVE COOLING STRUCTURE FOR PRINTED CIRCUIT
#229Mobile display device
#230Light-emitting element mounting substrate and method for manufacturing light-emitting element mounting substrate
#231Printed circuit board and method for producing a printed circuit board
#232Computer circuit board cooling arrangement
#233Electronic device comprising a printed circuit board with improved cooling
#234Circuit board and method for manufacturing the same
#235Electronic-component mount substrate, electronic device, and electronic module
#236Circuit boards and circuit board assemblies
#237Flip-chip beamforming integrated circuit with integral thermal mass
#238Beamforming integrated circuit with RF grounded material ring
#239Packaging a printed circuit board having a plurality of semiconductors in an inverter
#240Heat sink assemblies for surface mounted devices
#241Component carrier comprising at least one heat pipe and method for producing said component carrier
#242Device for heating and cooling by a printed circuit for regenerating electronic components subjected to radiation
#243Ultra-compact image sensor assembly for thin profile devices
#244Electronic control device
#245Printed-circuit board, printed-wiring board, and electronic apparatus
#246Carrier with a passive cooling function for a semiconductor component
#247Air-cavity package with two heat dissipation interfaces
#248Light emitting device
#249Method of making integrated die paddle structures for bottom terminated components
#250Housing for an electronic control unit and method of manufacture
#251Printed circuit board assembly
#252Printed wiring board, electronic device, catheter, and metallic material
#253High thermal conductivity region for optoelectronic devices
#254Ultra-thin embedded semiconductor device package and method of manufacturing thereof
#255Circuit carrier and a method for producing a circuit carrier
#256Interconnection between printed circuit boards
#257FPC-attached optical modulator and optical transmission device using the same
#258Substrate, imaging unit and imaging device
#259Electronic device
#260PRINTED CIRCUIT BOARD FOR HIGH POWER COMPONENTS
#261Optical communication module
#262High-current PCB traces
#263Semiconductor device and electronic device
#264High-frequency module
#265Electronics package with improved thermal performance
#266Circuit board with a heat-conducting element
#267Circuit board and manufacturing method thereof
#268High frequency module
#269Laser diode chip on printed circuit board
#270COMMUNICATION SYSTEM AND COMMUNICATION DEVICE THEREFOR
#271Component carrier comprising a copper filled multiple-diameter laser drilled bore
#272Component carrier comprising a copper filled mechanical drilled multiple-diameter bore
#273In-vehicle controller
#274Printed circuit board
#275Multilayer substrate
#276Heat sink with protrusions on multiple sides thereof and apparatus using the same
#277Integrated die paddle structures for bottom terminated components
#278Electronic package that includes finned vias
#279Heat pipe and method to embed a heat pipe in a product
#280Circuit boards and circuit board assemblies
#281Circuit board
#282High-frequency modules
#283Cooling assembly for electronics assembly of imaging system
#284PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
#285Connection system for electronic components
#286Heat Spreader in Multilayer Build Ups
#287Combination parallel path heatsink and EMI shield
#288Heat radiating member and printed circuit board including same
#289Circuit board and method for manufacturing the same
#290Double insulated heat spreader
#291Via structures for thermal dissipation
#292Electronic control module and method for producing an electronic control module
#293Power module
#294Substrate device and electric circuit arrangement having first substrate section perpendicular to second substrate section
#295Solder void reduction between electronic packages and printed circuit boards
#296Construction element with at least one electronic component and associated method
#297Printed circuit board, circuit and method for producing a circuit
#298LED package structure and multilayer circuit board
#299Circuit board and method for manufacturing the same
#300Circuit board and circuit board assembly