233644 ⎘
Printed circuits; Details; Electrical arrangements not otherwise provided for; Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane Patterned shielding planes, ground planes or power planes
Sub-classes:IN-MODULE SHIELDING
#2ELECTRONIC DEVICE COMPRISING CONDUCTIVE PIN
#3CAMERA MODULE
#4PCB LAYER STACK-UP AND FLOOR PLANNING
#5CIRCUIT BOARD AND ELECTRONIC ASSEMBLY
#6Nanostructured Copper for Electromagnetic Interference Shielding and Method for same
#7DISPLAY DEVICE
#8AIR GAPPED DYNAMIC-FLEX CIRCUITS WITH STRIPLINE IMPEDANCE CONTROLS
#9Card Edge Connector System
#10FLEXIBLE CIRCUIT BOARD AND PAD CONNECTING SYSTEM
#11SIGNAL TRACE TRANSITION FOR HIGH DATA RATE APPLICATIONS
#12CIRCUIT BOARD DEVICE AND ITS CIRCUIT MODULE
#13CIRCUIT BOARD AND CONNECTOR ASSEMBLY WITH IMPROVED SHIELDING PERFORMANCE
#14WIRING SUBSTRATES AND ELECTRONIC APPARATUSES
#15PRINTED CIRCUIT BOARD
#16COMMUNICATION CABLE INCLUDING A MOSAIC TAPE
#17ELECTRIC DEVICE
#18CONDUCTIVE STRUCTURES AND HOUSING STRUCTURES FOR TRANSMISSION ON DEFORMABLE SURFACES
#19PCB FABRICATION WITH EMI FILM ON MULTI-LAYER RIGID PCB
#20CIRCUIT BOARD AND LAYOUT METHOD THEREOF
#21CIRCUIT BOARD
#22Printed circuit board with plurality of condctor patterns and vias
#23Signal transmission structure, electronic device, and PCB
#24WIRING BOARD, MANUFACTURING METHOD, ELECTRONIC MODULE, ELECTRONIC UNIT, AND ELECTRONIC DEVICE
#25ELECTRONIC DEVICE INCLUDING ANTENNA AND HEAT DISSIPATION STRUCTURE
#26Printed circuit board configuration blocks and edge projections
#27NETWORK COMMUNICATION DEVICE HAVING ELECTROMAGNETIC SHIELDING FUNCTION
#28Trans-vacuum printed flexible wiring apparatus
#29Communication cable including a mosaic tape
#30CAMERA MODULE
#31Circuit board and electronic device including circuit board including a first and second plurality of ground patterns
#32ELECTRONIC DEVICE CAPABLE OF SUPPRESSING HIGH GROUND IMPEDANCE, AND METHOD FOR MANUFACTURING THE ELECTRONIC DEVICE
#33MULTILAYER SUBSTRATE AND METHOD FOR MANUFACTURING MULTILAYER SUBSTRATE
#34Shielding film and circuit board
#35FLEXIBLE PCB RF CABLE
#36Wiring board
#37Printed circuit board structure including a closed cavity
#38Wiring board and electronic device
#39THICK AND THIN TRACES IN A BRIDGE WITH A GLASS CORE
#40Printed circuit board
#41Electronic control device
#42Electronic device including antenna and heat dissipation structure
#43Communication cable including a mosaic tape
#44Flexible circuit board and manufacturing method therefor, and related apparatus
#45Wiring board, electronic module, and electronic apparatus
#46Circuit board and display device
#47Printed wiring board
#48Optical module and method of manufacturing optical module
#49Printed circuit board design for high speed application
#50Optical semiconductor device
#51System and method for shielding attenuation of electromagnetic interference emissions
#52Circuit board and electronic apparatus using the same
#53Electrical connector assembly with outer shielding shell and inner shielding plate between terminals
#54Card Edge Connector System
#55Circuit board and method for preparing same, and electronic device
#56High Density Skip Layer Transmission Line with Plated Slot
#57Flexible circuit board for multiple signal transmission
#58Shielding structure for system-in-package and electronic device
#59Spiral antenna and related fabrication techniques
#60Storage device unit
#61Module and method of manufacturing the same
#62Laminated circuit board device
#63Radiation shield and groove in support structure
#64Component carrier with embedded component covered by functional film having an inhomogeneous thickness distribution
#65Method for manufacturing flexible circuit board
#66Electronic device including antenna and heat dissipation structure
#67Electronic apparatus
#68Electrical connector assembly with shielding surrounding board-to-board connectors in connected state
#69Circuit board, semiconductor device, and electronic device
#70Communication module
#71Circuit board and electronic device including circuit board
#72Wiring substrate and electronic device
#73Vertical interconnection structure of a multi-layer substrate
#74Electromagnetic interference shielding enclosure with thermal conductivity
#75Electronic shielding of antennas from fan controls in a compact electronic device
#76Method of manufacturing radio frequency interconnections
#77Electronic component module and electronic device including the same
#78FERROMAGNETIC MATERIAL TO SHIELD MAGNETIC FIELDS IN SUBSTRATE
#79Magnetic wiring circuit board
#80Printed circuit board structure including a closed cavity
#81PRINTED CIRCUIT BOARD DESIGN FOR HIGH SPEED APPLICATION
#82Electronic device including antenna and heat dissipation structure
#83Electronic device including antenna and heat dissipation structure
#84IMPEDANCE CUSHION TO SUPPRESS POWER PLANE RESONANCE
#85Wireless power transmitter and wireless power receiver including multiple grounds for reducing electro-magnetic interference
#86Circuit board, motor unit, and fan
#87Communication cable including a mosaic tape
#88Packaged device having imbedded array of components
#89Wiring substrate and semiconductor device
#90Current redistribution in a printed circuit board
#91Multilayer ceramic electronic package with modulated mesh topology and alternating rods
#92Multilayer ceramic electronic package with modulated mesh topology
#93Multi-conductor interconnect structure for a microelectronic device
#94ELECTRONIC DEVICE
#95Printed circuit board
#96Printed circuit board design for high speed application
#97Printed circuit substrate
#98Antenna and electronic device including same
#99Interposer substrate and circuit module
#100Electronic device
#101SNAP-RF interconnections
#1023D high-inductive ground plane for crosstalk reduction
#103High speed differential trace with reduced radiation in return path
#104Printed circuit board for integrated LED driver
#105Dual-purpose vias for use in ceramic pedestals
#106Spiral antenna and related fabrication techniques
#107Radio frequency circuit with a multi-layer transmission line assembly having a conductively filled trench surrounding the transmission line
#108TUNABLE SLOT RESONATOR ETCHED AT THE EDGE OF A PRINTED CIRCUIT BOARD
#109Electronic device having circuit board including third conductors insulated from first and second conductors
#110Electronic unit
#111Printed circuit board and mobile device
#112Non-uniform magnetic foil embedded in component carrier
#113Capacitive stylus providing signals for tilt and orientation detection
#114Wireless power transmitter and wireless power receiver
#115Printed circuit board structure including a closed cavity
#116Electronic device with delamination resistant wiring board
#117RADIO-FREQUENCY MODULE WITH INTEGRATED CONFORMAL SHIELD ANTENNA
#118Shield structure for a low crosstalk single ended clock distribution circuit
#119Electronic equipment
#120Circuit board
#121Crosstalk reduction between signal layers in a multilayered package by variable-width mesh plane structures
#122Electronic device with laterally extending thermally conductive body and related methods
#123High-frequency module
#124Electronic component
#125PRINTED WIRING BOARD
#126PCB transmission lines having reduced loss
#127Semiconductor device
#128Printed circuit board design for high speed application
#129Package to board interconnect structure with built-in reference plane structure
#130Integrated electronic components and methods of formation thereof
#131Printed circuit board and method of manufacturing the same
#132Flexible conductive film and process for producing the same
#133Printed circuit board for integrated LED driver
#134Electromagnetic blocking structure, dielectric substrate, and unit cell
#135Wiring board with filter circuit and electronic device
#136Filtered connector and filter board thereof
#137HYBRID EMBEDDED SURFACE MOUNT MODULE FORM FACTOR WITH SAME SIGNAL SOURCE SUBSET MAPPING
#138Circuit board structure with selectively corresponding ground layers
#139Patterned ground structure filter designs with improved performance
#140System and method for reducing partial discharge in high voltage planar transformers
#141Multichannel RF feedthroughs
#142Capacitive compensation structures using partially meshed ground planes
#143High-frequency modules
#144Electronic module having electromagnetic shielding structure and manufacturing method thereof
#145Method of reducing the thickness of an electronic circuit
#146Current redistribution in a printed circuit board
#147Laminated interposers and packages with embedded trace interconnects
#148Multilayer printed wiring board, and connection structure of multilayer printed wiring board and connector
#149Low-profile space-efficient shielding for SIP module
#150Circuit element package, manufacturing method thereof, and manufacturing apparatus thereof
#151Cable structure
#152Nanowire security films
#153Electrical conductor pathway system and method of making the same
#154Printed wiring board and connector connecting the wiring board
#155Method and apparatus for intrinsically safe circuit board arrangement for portable electronic devices
#156Vertical trench routing in a substrate
#157Electronic component housing package and electronic apparatus
#158Avoiding reflections in PCB signal trace
#159PRINTED CIRCUIT BOARD AND DISPLAY DEVICE HAVING THE SAME
#160Communication cable including a mosaic tape
#161Printed circuit board
#162SIGNAL PATHS FOR RADIO-FREQUENCY MODULES
#163Voltage detection unit
#164GROUNDING PATTERN STRUCTURE FOR HIGH-FREQUENCY CONNECTION PAD OF CIRCUIT BOARD
#165Stack structure of high frequency printed circuit board
#166Wiring board with cavity for built-in electronic component and method for manufacturing the same
#167Printed wiring board, electronic device, and wiring connection method
#168Frequency selective structures for EMI mitigation
#169Multi-layer printed circuit board structure, connector module and memory storage device
#170Printed wiring board
#171Electronic device with dual clutch barrel cavity antennas
#172Integrated electronic components and methods of formation thereof
#173Multilayer wiring board
#174Electronic control unit and electric power steering apparatus having the same
#175Interconnect substrate and electronic device
#176Attenuation reduction structure for high frequency signal contact pads of circuit board
#177Flat cable with consistent impedance
#178Windowed reference planes for embedded conductors
#179Method of manufacturing electronic package module
#180Crosstalk reduction between signal layers in a multilayered package by variable-width mesh plane structures
#181Attenuation reduction grounding pattern structure for connection pads of flexible circuit board
#182Stacked electromagnetic bandgap structure
#183Mesh planes with alternating spaces for multi-layered ceramic packages
#184Semiconductor package and printed circuit board
#185Cavity resonance reduction and/or shielding structures including frequency selective surfaces
#186Electronic equipment and flexible printed circuit
#187Electrical characteristics of package substrates and semiconductor packages including the same
#188Current redistribution in a printed circuit board
#189Composite component with electrical lines
#190Electrical component resin, semiconductor device, and substrate
#191EMI FILTERING DETECTOR AND METHOD FOR SAME
#192Methods of manufacturing a communication cable
#193Integrated electronic components and methods of formation thereof
#194Printed circuit board and electro application
#195Multilayer printed wiring board
#196Electronic card, an electronic device including such a card, and a method of protecting an electronics card
#197Interconnect substrate and electronic device
#198Mesh planes with alternating spaces for multi-layered ceramic packages
#199Band-pass filter module and module substrate
#200Wireless terminal with reduced specific absorption rate peak and implementation method thereof
#201PACKAGE SUBSTRATE WITH MESH PATTERN AND METHOD FOR MANUFACTURING THE SAME
#202Interconnect board and electronic apparatus
#203Electromagnetic interference noise reduction package board
#204Multichannel RF feedthroughs
#205Semiconductor device
#206Electronic component
#207CIRCUIT BOARD
#208Wiring board comprising wirings arranged with crest and trough
#209Mutual capacitance and magnetic field distribution control for transmission lines
#210Printed circuit board design for high speed application
#211Noise coupling reduction and impedance discontinuity control in high-speed ceramic modules
#212Flexible circuit board and display device
#213Printed circuit board
#214Printed circuit board
#215Multilayer printed wiring board
#216Method and apparatus for low inductive design pattern
#217Systems, methods, and apparatus for electrical filters and input/output systems
#218POWER AND GROUND PLANES HAVING MODIFIED RESONANCE FREQUENCIES
#219Crosstalk reduction between signal layers in a multilayered package by variable-width mesh plane structures
#220Multilayer flexible printed circuit board and electronic device
#221Integrated circuit packaging system with a shield and method of manufacture thereof
#222Methods for avoiding parasitic capacitance in an integrated circuit package
#223Flexible cable and transmission system
#224MULTILAYER PRINTED WIRING BOARD
#225Printed circuit board
#226Connector and cable assembly
#227Printed wiring board and device including printed wiring board
#228FLEXIBLE SUBSTRATE AND DISPLAY DEVICE PROVIDED WITH SAME
#229Semiconductor device
#230Method for manufacturing an integrated lead suspension
#231Circuit board laminated module and electronic equipment
#232Circuit board with a reference plane having multi-part non-conductive regions for decreased crosstalk
#233Three-dimensional matrix structure for defining a coaxial transmission line channel
#234Noise coupling reduction and impedance discontinuity control in high-speed ceramic modules
#235PACKAGE SUBSTRATE
#236REDUCING CROSS-TALK IN HIGH SPEED CERAMIC PACKAGES USING SELECTIVELY-WIDENED MESH
#237Printed circuit board and electro application
#238Multi-layer ground plane structures for integrated lead suspensions
#239MICROSTRUCTURED MATERIAL AND PROCESS FOR ITS MANUFACTURE
#240Electronic circuit unit
#241CIRCUIT BOARD
#242Printed circuit board
#243INTEGRATED ELECTRONIC COMPONENTS AND METHODS OF FORMATION THEREOF
#244SUBSTRATE AND SEMICONDUCTOR DEVICE
#245Printed wiring board having wire grounding conductors with distances that are 1/n the width of the signal lines
#246Mirror image shielding structure
#247Mounting structure for semiconductor element with underfill resin
#248Communication cable including a mosaic tape
#249Circuit board and display panel assembly having the same
#250High-Speed Two-Layer and Multilayer Circuit Boards
#251Printed wiring board and electronic apparatus
#252Wireless communication device
#253Circuit board layout method
#254Multilayer circuit board and motor driving circuit board
#255Electronic device with electrostatic protection structure
#256EBG structure, antenna device, RFID tag, noise filter, noise absorptive sheet and wiring board with noise absorption function
#257Circuit substrate having power/ground plane with grid holes
#258FLAT TRANSMISSION WIRE AND FABRICATING METHODS THEREOF
#259ELECTRONIC APPARATUS, FLEXIBLE PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING FLEXIBLE PRINTED WIRING BOARD
#260Printed circuit board with reduced signal distortion
#261Printed circuit board
#262Multilayer printed wiring board
#263Optical communication module and flexible printed circuit board
#264FLEXIBLE PRINTED CIRCUIT BOARD
#265FLEXIBLE PRINTED CIRCUIT BOARD
#266PRINTED CIRCUIT BOARD WITH GROUND GRID
#267PCB layout structrue for suppressing EMI and method thereof
#268Semiconductor device having wiring formed on wiring board and electric conductor formed in wiring board and conductor chip formed over wiring
#269Multilayer printed wiring board and electronic device using the same
#270MULTILAYER SUBSTRATE
#271Wiring structure of a substrate
#272Mutual capacitance and magnetic field distribution control for transmission lines
#273Multi-layered printed circuit board with a conductive substrate and three insulating layers with wiring and ground traces
#274Semiconductor device
#275Display device having flexible printed circuit board with particular differential signal lines connection
#276Electric apparatus
#277I/O connectors with extendable faraday cage
#278Flexible data cable
#279Multilayer build-up wiring board including a chip mount region
#280ELECTROMAGNETIC WAVE SHIELDING WIRING CIRCUIT FORMING METHOD AND ELECTROMAGNETIC WAVE SHIELDING SHEET
#281Reference layer openings
#282Ceramic substrate grid structure for the creation of virtual coax arrangement
#283Ceramic substrate grid structure for the creation of virtual coax arrangement
#284ELECTRONIC COMPONENT MODULE AND CIRCUIT BOARD THEREOF
#285Systems, methods, and apparatus for electrical filters and input/output systems
#286High speed electrical interconnects and method of manufacturing thereof
#287Multilayer printed wiring board
#288DIELECTRIC SUBSTANCE AND METHOD OF PRODUCING THE SAME
#289Flexible printed circuit board
#290Circuit connection structure and printed circuit board
#291Printed circuit board having impedance-matched strip transmission line
#292Skew Compensation by Changing Ground Parasitic For Traces
#293POWER SUPPLY PLATFORM AND ELECTRONIC COMPONENT
#294FLEXIBLE CIRCUIT
#295PRINTED CIRCUIT BOARD
#296Integrated electronic components and methods of formation thereof
#297STRUCTURES FOR IMPLEMENTING EMI SHIELDING FOR RIGID CARDS AND FLEXIBLE CIRCUITS
#298Method and Structure for Implementing Control of Mechanical Flexibility With Variable Pitch Meshed Reference Planes Yielding Nearly Constant Signal Impedance
#299Method, recording medium, and design support system for designing an electronics device
#300Reduction of near field electro-magnetic scattering using high impedance metallization terminations